Abstract: A flash memory device includes multiple memory blocks, a decoder configured to select at least one of the memory blocks in response to block select signals, and a controller configured to generate the block select signals in response to a block address. When the block address corresponds to a bad block, the controller generates the block select signals to cause the decoder to interrupt selection of a memory block corresponding to the block address.

Abstract: In a stack array structure for a semiconductor memory device, a first semiconductor layer includes a plurality of first cell strings, and a second semiconductor including a plurality of second cell strings. Bit-line contact plugs are configured to couple a bit-line to two adjacent first cell strings aligned in series in a bit-line direction, and to further couple the bit-line to two adjacent second cell strings respectively located over the two adjacent first cell strings. Common source line contact plugs are configured to couple a common source line to the two adjacent first cell strings and the two adjacent second cell strings. Pocket p-well contact plugs are located at positions corresponding to a layout of the bit-line plugs and/or common source line plugs, and are configured to couple a pocket p-well line to the first semiconductor layer and the second semiconductor layer.

Abstract: An internal voltage of a semiconductor memory device is controlled, where the internal voltage is set according to a reference voltage. The reference voltage is controlled according to first control data to increase the internal voltage to be higher than a target voltage in a power-up operation, and second control data is read. The reference voltage is then controlled according to the second control data to decrease the internal voltage to the target voltage.

Abstract: A method of driving a non-volatile memory device includes supplying power to the memory device, in which setting information related to setting an operating environment is copied and stored in multiple of regions of a memory cell array. An initial read operation of the memory cell array is performed and initial setting data is determined based on the initial read operation. The operating environment of the memory device is set based on the initial setting data. Corresponding portions of the stored copies of the setting information are read at the same time.

Abstract: In a flash memory device, a high voltage generating circuit generates a high voltage and receives the high voltage as a switching voltage for controlling a voltage dividing circuit.

Abstract: A method of programming a nonvolatile memory device using hybrid local boosting which includes a plurality of cell strings each having a plurality of electrically erasable and programmable memory cells connected in series and a plurality of wordlines respectively connected to control gates of the plurality of memory cells. The address of a selected cell that is to be programmed is received. A determination is made as to whether a selected wordline connected to the selected cell is located above or under a reference wordline based on the received address. The selected cell is programmed using local boosting when the selected wordline corresponds to the reference wordline or is located above the reference wordline. The selected cell is programmed using self-boosting when the selected wordline is located under the reference wordline. The programming method reduces circuit size of a nonvolatile memory device employing the programming method and efficiently prevents program disturbance due to charge sharing.

Abstract: In one aspect, a non-volatile NAND-flash semiconductor memory device is provided which is configured to execute at least one of a pre-program operation and a post-program operation before and after an erase operation, respectively. Each of the pre-program and post-program operations includes applying a program voltage to a subset of a plurality of word lines defining a word line block of the memory device.

Abstract: A non-volatile memory device capable of stably setting its operating environment and a method of driving the non-volatile memory device are provided. The method includes providing power to the non-volatile memory device having a memory cell array that stores initial setting data for setting the operating environment of the non-volatile memory device. An initial read operation is performed on the memory cell array. The operating environment of the non-volatile memory device is set using the initial setting data that is read through the initial read operation. The initial setting data stored in the memory cell array includes main data having information about the operating environment to be set and an indicator corresponding to the main data for indicating a start and an end of the main data.

Abstract: A flash memory device is disclosed and includes; a memory cell array, a high voltage generating circuit generating a high voltage applied to a selected word line to select one or more memory cells in the memory cell array, and a controller. The controller cuts off a discharge path between the high voltage generating circuit and ground during a first period wherein the high voltage is not applied to a word line. The controller also deactivates the high voltage generating circuit during this first period.

Abstract: Disclosed is a multi-bit flash memory device which includes a memory cell array and a control circuit. The memory cell array has multiple memory cells and multiple flag cells. The control circuit determines whether the flag cells are programmed, based on a reference corresponding to a read margin of the flag cells, and controls a program operation of the memory cells in response to the determination.

Abstract: A flash memory device is programmed by loading first data into a page buffer of a first mat. Second data is loaded into a page buffer of a second mat while programming the first data in a first memory block of the first mat.

Abstract: Flash memory devices include a memory array having a plurality of NAND strings of EEPROM cells therein. A word line driver is provided to improve programming efficiency. The word line driver is electrically coupled to the memory array by a plurality of word lines. The word line driver includes a plurality of pass voltage switches. These switches have outputs electrically coupled by diodes to the plurality of word lines. Methods of programming flash memory devices include applying a pass voltage to a plurality of unselected word lines in a non-volatile memory array while simultaneously applying a sequentially ramped program voltage to a selected word line in the non-volatile memory array. The sequentially ramped program voltage has a minimum value that is clamped by a word line driver to a level not less than a value of the pass voltage.

Abstract: A method for programming multi-level non-volatile memory. A plurality of multi-bit storage cells capable of storing different levels of charge usable to represent data represented by a least significant bits (LSBs) and a most significant bits (MSBs) are programmed first with LSBs and then with MSBs. The programmed storage cells have a threshold voltage lower than a voltage VR1 to store a first value, greater than VR1 and lower than a voltage VR2 to store a second value, and greater than VR2 and lower than a voltage VR3 to store a third value. Each of the cells has a threshold voltage greater than a voltage VR3 when it is desired that the storage cell store a fourth value. VR1 is less than VR2 which is less than VR3. The flag cell is programmed to have a threshold voltage greater than VR3 to indicate that the MSBs have been programmed.

Abstract: A flash memory device is programmed by loading first data into a page buffer of a first mat. Second data is loaded into a page buffer of a second mat while programming the first data in a first memory block of the first mat.

Abstract: A multi-chip semiconductor memory device includes of a plurality of memory chips sharing a predetermined chip enable signal. Each of the plurality of memory chips includes an active internal power supply generation circuit configured to convert an external power supply voltage into an internal power supply voltage and to be disabled in response to deactivation of a predetermined drive control signal. Each of the plurality of memory chips also includes a conversion control circuit for generating the drive control signal, wherein the drive control signal is deactivated in an interval in which any of the plurality of memory chips is in an active interval.

Abstract: Flash memory devices include a memory array having a plurality of NAND strings of EEPROM cells therein. A word line driver is provided to improve programming efficiency. The word line driver is electrically coupled to the memory array by a plurality of word lines. The word line driver includes a plurality of pass voltage switches. These switches have outputs electrically coupled by diodes to the plurality of word lines. Methods of programming flash memory devices include applying a pass voltage to a plurality of unselected word lines in a non-volatile memory array while simultaneously applying a sequentially ramped program voltage to a selected word line in the non-volatile memory array. The sequentially ramped program voltage has a minimum value that is clamped by a word line driver to a level not less than a value of the pass voltage.

Abstract: A method of programming a nonvolatile memory device including a plurality of memory cells includes providing a plurality of program loops having a corresponding plurality of program voltages associated therewith. A first one of the plurality of program loops is activated to generate a first program voltage to program a first one of the plurality of memory cells. A second one of the plurality of program loops is activated to generate a second program voltage to program a second one of the plurality of memory cells.

Abstract: A method for programming multi-level non-volatile memory including at least one flag cell and a plurality of multi-bit storage cells. Each storage cell stores data of a least significant bit (LSB) and a most significant bit (MSB). The cells are programmed with LSB data such that programmed storage cells have a threshold voltage greater than VR1. The threshold voltage is modified to have a threshold voltage greater than VR2 for a third or fourth value. The cells are programmed with MSB data for a threshold voltage lower than a VR1 for a first value greater than VR1 and lower than VR2 for a second value, greater than VR2 and lower than VR3 for a third value, and greater than VR3 for a fourth value. VR1 is less than VR2 which is less than VR3. The flag cell is programmed to signal whether MSB data has been programmed.

Abstract: Control circuits for a voltage regulator of a semiconductor memory device include an option fuse circuit and a fusing control circuit. The option fuse circuit includes a plurality of fuses and a selection circuit that selects one of the plurality of fuses responsive to a control signal. An output voltage associated with the voltage reset circuit is adjusted responsive to a state of the selected one of the plurality of fuses. A fusing control circuit generates the control signal to allow multiple adjustments of the output voltage by the voltage reset circuit. The option fuse circuit may be a plurality of option fuse circuits and the output voltage may be adjusted responsive to the states of the respective selected ones of the plurality of fuses of the option fuse circuits.

Abstract: A NAND flash memory device includes a memory cell array including a plurality of memory cells, a plurality of page buffers, and an isolation circuit connected between the memory cell array and the plurality of page buffers. The isolation circuit comprises a high voltage transistor adapted to disconnect a first bit line connected to the memory cell array from a second bit line connected to the one of the page buffers during an erase operation of the NAND flash memory device. During the read operation, a third bit line arranged in parallel with the second bit line and connected to one of the page buffers is discharged to prevent the page buffer from being damaged due to coupling capacitance between the second and third bit lines.