Patents by Inventor Daisuke Ohno

Daisuke Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159890
    Abstract: A displacement output device according to the present invention includes: a memory; and at least one processor coupled to the memory. The processor performing operations. The operations include: acquiring a first ground surface displacement at a first point from a synthetic aperture radar; estimating a second ground surface displacement at a second point different from the first point using the acquired first ground surface displacement; clipping at least one of the first ground surface displacement and the second ground surface displacement included in a preset first region from the first ground surface displacement and the second ground surface displacement; and outputting at least one of the first ground surface displacement and the second ground surface displacement included in the first region.
    Type: Application
    Filed: March 24, 2021
    Publication date: May 16, 2024
    Applicant: NEC Corporation
    Inventors: Shouhei OHNO, Takakazu Ishii, Hiromichi Hirata, Daisuke Hashizume, Nana Jumonji, Kaori Iwafuchi, Yosuke Kimura, Chisato Sugawara
  • Publication number: 20240117234
    Abstract: A composition for an oil or gas well formation, containing a viscoelastic surfactant; and a modified nanomaterial and a producing method of the composition, and a forming method of the oil or gas well. The modified nanomaterial optionally contains a nanocellulose. The modified nanomaterial optionally has, on its surface, a sulfate group, a sulfite group, a carboxy group, an ethylene oxide chain, an amino group, an ester group, a silane group, a tertiary ammonium group or a mixture thereof.
    Type: Application
    Filed: October 7, 2020
    Publication date: April 11, 2024
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Rigoberto C. ADVINCULA, Kunitoshi MIMURA, Daisuke OHNO, Masahiro SHIMADA
  • Patent number: 11943513
    Abstract: There is provided an information processing apparatus that presents a user with a content selection screen including a plurality of types of content as content options and that presents the user with, in the case where one of the content options is selected while the content selection screen is presented, a preview screen including a video which represents a state of a screen watched by another user who is actually using the selected content option.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 26, 2024
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Erika Ohno, Daisuke Kawamura
  • Publication number: 20240071452
    Abstract: The present invention provides an access controller, and a data transfer method. The access controller controls accesses to the MRAM by reading data in advance and backing up the data when data is to be read from the MRAM.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 29, 2024
    Applicant: TOHOKU UNIVERSITY
    Inventors: Masanori Natsui, Daisuke Suzuki, Akira Tamakoshi, Takahiro Hanyu, Tetsuo Endoh, Hideo Ohno
  • Publication number: 20220098369
    Abstract: Disclosed are a degradable resin composition including a cyanate ester (A) and a compound (B) having a hydroxyl group with a hydroxyl group equivalent of less than 240 g/eq., and a degradable cured product and a downhole tool for drilling using the same.
    Type: Application
    Filed: February 3, 2020
    Publication date: March 31, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masahiro SHIMADA, Daisuke OHNO, Hiroto KUMAGAI
  • Patent number: 10610834
    Abstract: An asymmetric membrane including a crosslinked polyimide resin, the crosslinked polyimide resin being formed by crosslinking a polyimide resin by a crosslinking agent; the polyimide resin including a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from diamine; the structural unit (A) including a structural unit (A-1) derived from a compound represented by Formula (a-1); the structural unit (B) including a structural unit (B-1) derived from Formula (b-1), and a proportion of the structural unit (B-1) per 100 mol % of the structural unit (B) being from 0.1 to 50 mol %; and the crosslinking agent being a compound having not less than two functional groups that bond with carboxy groups. In Formula (b-1), Q1 and Q2 are each independently a group including an aromatic group, an aliphatic hydrocarbon group, and/or an alicyclic hydrocarbon group; X is a single bond or a particular group.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 7, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Ryuichiro Kawai, Takashi Yamamoto, Daisuke Ohno, Yohei Abiko, Hiroaki Oka, Shuya Suenaga, Takafumi Takada, Tomohiro Hariu
  • Publication number: 20190381463
    Abstract: An asymmetric membrane including a crosslinked polyimide resin, the crosslinked polyimide resin being formed by crosslinking a polyimide resin by a crosslinking agent; the polyimide resin including a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from diamine; the structural unit (A) including a structural unit (A-1) derived from a compound represented by Formula (a-1); the structural unit (B) including a structural unit (B-1) derived from Formula (b-1), and a proportion of the structural unit (B-1) per 100 mol % of the structural unit (B) being from 0.1 to 50 mol %; and the crosslinking agent being a compound having not less than two functional groups that bond with carboxy groups. In Formula (b-1), Q1 and Q2 are each independently a group including an aromatic group, an aliphatic hydrocarbon group, and/or an alicyclic hydrocarbon group; X is a single bond or a particular group.
    Type: Application
    Filed: January 30, 2019
    Publication date: December 19, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Ryuichiro KAWAI, Takashi YAMAMOTO, Daisuke OHNO, Yohei ABIKO, Hiroaki OKA, Shuya SUENAGA, Takafumi TAKADA, Tomohiro HARIU
  • Patent number: 10155835
    Abstract: To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: December 18, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuuichi Sugano, Masayuki Katagiri, Seiji Kita, Daisuke Ohno, Masanobu Sogame
  • Patent number: 9169356
    Abstract: Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: October 27, 2015
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuuichi Sugano, Masayuki Katagiri, Daisuke Ohno, Tomoaki Kubota, Yoshikazu Shima
  • Patent number: 9062145
    Abstract: A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: June 23, 2015
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Daisuke Ohno, Kenji Ishii
  • Publication number: 20140308530
    Abstract: To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.
    Type: Application
    Filed: July 31, 2012
    Publication date: October 16, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuuichi Sugano, Masayuki Katagiri, Seiji Kita, Daisuke Ohno, Masanobu Sogame
  • Patent number: 8497025
    Abstract: A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: July 30, 2013
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazuyoshi Uera, Daisuke Ohno, Kenji Ishii
  • Publication number: 20120329957
    Abstract: A novel aromatic diamine compound obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer and a novel aromatic dinitro compound obtained by introducing aromatic nitro groups into both terminals of a specific bifunctional phenylene ether oligomer, these compounds being used as raw materials for obtaining high molecular weight materials having high heat resistance, a low dielectric constant, a low dielectric loss tangent and a low water absorption coefficient.
    Type: Application
    Filed: September 7, 2012
    Publication date: December 27, 2012
    Inventors: Kazuyoshi Uera, Daisuke Ohno, Kenjji Ishii
  • Publication number: 20100048826
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Application
    Filed: October 30, 2009
    Publication date: February 25, 2010
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Patent number: 7662906
    Abstract: A polyfunctional phenylene ether oligomer (B) having 3 to less than 9 phenolic hydroxyl groups, obtained by reacting a polyfunctional phenol (A) having 3 to less than 9 phenolic hydroxyl groups per molecule and having alkyl groups and/or alkylene groups at 2- and 6-positions of at least one of the phenolic hydroxyl groups with a monohydric phenol compound of the formula (1), derivatives thereof, resin compositions containing the derivatives, curable films obtained therefrom and cured films thereof, wherein R1 and R2 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R3 and R4 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: February 16, 2010
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazuyoshi Uera, Takeru Horino, Daisuke Ohno, Kenji Ishii
  • Publication number: 20090312519
    Abstract: A bismaleamic acid obtained by reacting a bifunctional phenylene ether oligomer diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with maleic anhydride, a bismaleimide obtained from the bismaleamic acid as a raw material, which bismaleimide has high heat resistance, low dielectric characteristics and excellent solvent solubility and exhibits only a small change in dielectric characteristics even in high humidity, a curable resin composition containing the above bismaleimide and a cured product obtained by curing the curable resin composition.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 17, 2009
    Inventors: Kazuyoshi Uera, Daisuke Ohno, Kenji Ishii
  • Patent number: 7632912
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: December 15, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Publication number: 20090286094
    Abstract: A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.
    Type: Application
    Filed: May 13, 2009
    Publication date: November 19, 2009
    Inventors: Kazuyoshi Uera, Daisuke Ohno, Kenji Ishii
  • Publication number: 20090205856
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Application
    Filed: April 21, 2009
    Publication date: August 20, 2009
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Patent number: 7560518
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: July 14, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno