Abstract: A composition for an oil or gas well formation, containing a viscoelastic surfactant; and a modified nanomaterial and a producing method of the composition, and a forming method of the oil or gas well. The modified nanomaterial optionally contains a nanocellulose. The modified nanomaterial optionally has, on its surface, a sulfate group, a sulfite group, a carboxy group, an ethylene oxide chain, an amino group, an ester group, a silane group, a tertiary ammonium group or a mixture thereof.

Abstract: There is provided an information processing apparatus that presents a user with a content selection screen including a plurality of types of content as content options and that presents the user with, in the case where one of the content options is selected while the content selection screen is presented, a preview screen including a video which represents a state of a screen watched by another user who is actually using the selected content option.

Abstract: The present invention provides an access controller, and a data transfer method. The access controller controls accesses to the MRAM by reading data in advance and backing up the data when data is to be read from the MRAM.

Abstract: Disclosed are a degradable resin composition including a cyanate ester (A) and a compound (B) having a hydroxyl group with a hydroxyl group equivalent of less than 240 g/eq., and a degradable cured product and a downhole tool for drilling using the same.

Abstract: An asymmetric membrane including a crosslinked polyimide resin, the crosslinked polyimide resin being formed by crosslinking a polyimide resin by a crosslinking agent; the polyimide resin including a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from diamine; the structural unit (A) including a structural unit (A-1) derived from a compound represented by Formula (a-1); the structural unit (B) including a structural unit (B-1) derived from Formula (b-1), and a proportion of the structural unit (B-1) per 100 mol % of the structural unit (B) being from 0.1 to 50 mol %; and the crosslinking agent being a compound having not less than two functional groups that bond with carboxy groups. In Formula (b-1), Q1 and Q2 are each independently a group including an aromatic group, an aliphatic hydrocarbon group, and/or an alicyclic hydrocarbon group; X is a single bond or a particular group.

Abstract: An asymmetric membrane including a crosslinked polyimide resin, the crosslinked polyimide resin being formed by crosslinking a polyimide resin by a crosslinking agent; the polyimide resin including a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from diamine; the structural unit (A) including a structural unit (A-1) derived from a compound represented by Formula (a-1); the structural unit (B) including a structural unit (B-1) derived from Formula (b-1), and a proportion of the structural unit (B-1) per 100 mol % of the structural unit (B) being from 0.1 to 50 mol %; and the crosslinking agent being a compound having not less than two functional groups that bond with carboxy groups. In Formula (b-1), Q1 and Q2 are each independently a group including an aromatic group, an aliphatic hydrocarbon group, and/or an alicyclic hydrocarbon group; X is a single bond or a particular group.

Abstract: To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

Abstract: Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN.

Abstract: A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.

Abstract: To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

Abstract: A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.

Abstract: A novel aromatic diamine compound obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer and a novel aromatic dinitro compound obtained by introducing aromatic nitro groups into both terminals of a specific bifunctional phenylene ether oligomer, these compounds being used as raw materials for obtaining high molecular weight materials having high heat resistance, a low dielectric constant, a low dielectric loss tangent and a low water absorption coefficient.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A polyfunctional phenylene ether oligomer (B) having 3 to less than 9 phenolic hydroxyl groups, obtained by reacting a polyfunctional phenol (A) having 3 to less than 9 phenolic hydroxyl groups per molecule and having alkyl groups and/or alkylene groups at 2- and 6-positions of at least one of the phenolic hydroxyl groups with a monohydric phenol compound of the formula (1), derivatives thereof, resin compositions containing the derivatives, curable films obtained therefrom and cured films thereof, wherein R1 and R2 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R3 and R4 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group.

Abstract: A bismaleamic acid obtained by reacting a bifunctional phenylene ether oligomer diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with maleic anhydride, a bismaleimide obtained from the bismaleamic acid as a raw material, which bismaleimide has high heat resistance, low dielectric characteristics and excellent solvent solubility and exhibits only a small change in dielectric characteristics even in high humidity, a curable resin composition containing the above bismaleimide and a cured product obtained by curing the curable resin composition.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A curable resin composition containing as essential components a high molecular weight compound having a weight average molecular weight of at least 10,000 and a vinyl compound of the formula (1).