Abstract: A curable resin composition containing as essential components a high molecular weight compound having a weight average molecular weight of at least 10,000 and a vinyl compound of the formula (1).

Abstract: There are provided a vinyl compound which is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a vinyl group into a terminal of a bifunctional polyphenylene ether oligomer, and a cured product thereof which has a high glass transition temperature, has a low dielectric constant and a low dielectric loss tangent and has the excellent properties of polyphenylene ether.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: The invention relates to a polymeric micellar structure which comprising an ionic porphyrin dendrimer represented by general formula (1): q(c)PM (where q represents the number of charged atoms on the periphery of the dendrimer; c represents a negative (?) or positive (+) charge; and PM is represented by the following general formula (2): wherein M represents two hydrogen atoms or a metal atom, R1, R2, R3 and R4 are the same or different and represents hydrogen or identical or different aryl ether dendrosubunits, provided that at least one of R1, R2, R3 and R4 represent an aryl ether dendrosubunits and that each aryl ether dendrosubunit has an anionic or cationic group at the end optionally though a spacer molecule chain.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH??(1) HO—X—OH??(2) Y—OH??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: A cyanate ester compound represented by the formula (1), wherein Ar2 represents a phenylene group, a naphthylene group or a biphenylene group, Ar1 represents a naphthylene group or a biphenylene group when Ar2 is a phenylene group, or Ar1 represents a phenylene group, a naphthylene group or a biphenylene group when Ar2 is a naphthylene group or a biphenylene group, Rx represents all substituents of Ar1 each Rx is the same or different and represents hydrogen, an alkyl group or an aryl group, Ry represents all substituents of Ar2, each Ry is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.

Abstract: A process for the production of a vinyl compound of the formula (1), which process comprises reacting a bifunctional phenylene ether oligomer of the formula (2) with a vinylbenzyl halide in an aprotic polar solvent in the presence of an alkali metal alkoxide and then adding the reaction solution to water or a water/alcohol mixed solution to precipitate a solid

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.

Abstract: There are provided a polyfunctional (meth)acrylate compound which has the excellent properties of polyphenylene ether and is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a polyfunctional (meth)acrylate group into a bifunctional polyphenylene ether oligomer, and a cured product thereof which has a high glass transition temperature and has a low dielectric constant and a low dielectric loss tangent.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: An acid anhydride of the formula (4), and a polyimide using the acid anhydride, 1

Abstract: A polyester having a specific structure in its skeleton which is obtained from, as a raw material, a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure, a resin composition and a film made of the polyester, and a laminate using the above film.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), 1

Abstract: There are provided a vinyl compound which is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a vinyl group into a terminal of a bifunctional polyphenyleneether oligomer, and a cured product thereof which has a high glass transition temperature, has a low dielectric constant and a low dielectric loss tangent and has the excellent properties of polyphenylene ether.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H&Brketopenst;O—Y&Brketclosest;a&Parenopenst;O—X—O&Parenclosest;&Brketopenst;Y—O&Brketclosest;bH  (1) HO—X—OH  (2) Y—OH  (3) wherein —X— is represented by the formula (2′),  and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2′) and the formula (3′) being required not to be a hydrogen atom, and its use.

Abstract: A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof.

Abstract: An epoxy resin curing agent having a number average molecular weight of 500 to 3,000, represented by the formula (1), and a cured product thereof.

Abstract: There are provided a polyfunctional (meth)acrylate compound which has the excellent properties of polyphenylene ether and is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a polyfunctional (meth)acrylate group into a bifunctional polyphenylene ether oligomer, and a cured product thereof which has a high glass transition temperature and has a low dielectric constant and a low dielectric loss tangent.

Abstract: A photosensitive resin composition (C) containing a photosensitive resin (B) which is a reaction product produced by modifying an epoxy acrylate (a) with a cyanate ester compound (b) to obtain a modification product (A) and reacting the modification product (A) with a polybasic acid anhydride (c), and a compound (d) of the formula, in which each of n and m is an integer of at least 1, and a cured product of the photosensitive resin composition (C).