Abstract: A curable resin composition containing as essential components a high molecular weight compound having a weight average molecular weight of at least 10,000 and a vinyl compound of the formula (1).

Abstract: Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN.

Abstract: A cyanate ester compound represented by the formula (1), wherein Ar2 represents a phenylene group, a naphthylene group or a biphenylene group, Ar1 represents a naphthylene group or a biphenylene group when Ar2 is a phenylene group, or Ar1 represents a phenylene group, a naphthylene group or a biphenylene group when Ar2 is a naphthylene group or a biphenylene group, Rx represents all substituents of Ar1, each Rx is the same or different and represents hydrogen, an alkyl group or an aryl group, Ry represents all substituents of Ar2, each Ry is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.

Abstract: A novel aromatic diamine compound obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer and a novel aromatic dinitro compound obtained by introducing aromatic nitro groups into both terminals of a specific bifunctional phenylene ether oligomer, these compounds being used as raw materials for obtaining high molecular weight materials having high heat resistance, a low dielectric constant, a low dielectric loss tangent and a low water absorption coefficient.

Abstract: A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H?O—Y?a?O—X—O??Y—O?bH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: A polyfunctional phenylene ether oligomer (B) having 3 to less than 9 phenolic hydroxyl groups, obtained by reacting a polyfunctional phenol (A) having 3 to less than 9 phenolic hydroxyl groups per molecule and having alkyl groups and/or alkylene groups at 2- and 6-positions of at least one of the phenolic hydroxyl groups with a monohydric phenol compound of the formula (1), derivatives thereof, resin compositions containing the derivatives, curable films obtained therefrom and cured films thereof, wherein R1 and R2 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and R3 and R4 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group.

Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.

Abstract: A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition.

Abstract: A process for the production of a vinyl compound of the formula (1), which process comprises reacting a bifunctional phenylene ether oligomer of the formula (2) with a vinylbenzyl halide in an aprotic polar solvent in the presence of an alkali metal alkoxide and then adding the reaction solution to water or a water/alcohol mixed solution to precipitate a solid

Abstract: An acid anhydride of the formula (4), and a polyimide using the acid anhydride, wherein anhydrides are substituted at sites 3 or sites 4, which acid anhydride is obtained from, as a raw material, a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000, represented by the formula (1).

Abstract: A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof.

Abstract: A cyanate ester compound represented by the formula (1), wherein Ar2 represents a phenylene group, a naphthylene group or a biphenylene group, Ar1 represents a naphthylene group or a biphenylene group when Ar2 is a phenylene group, or Ar1 represents a phenylene group, a naphthylene group or a biphenylene group when Ar2 is a naphthylene group or a biphenylene group, Rx represents all substituents of Ar1, each Rx is the same or different and represents hydrogen, an alkyl group or an aryl group, Ry represents all substituents of Ar2, each Ry is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.