Patents by Inventor Daisuke Ohno

Daisuke Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyphenylene ether oligomer compound, derivatives thereof and use thereof
    Publication number: 20030194562
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Application
    Filed: January 28, 2003
    Publication date: October 16, 2003
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Polymeric micellar structure
    Publication number: 20030153547
    Abstract: The invention relates to a polymeric micellar structure comprising an ionic porphyrin dendrimer represented by general formula [1]
    Type: Application
    Filed: October 18, 2002
    Publication date: August 14, 2003
    Inventors: Takuzo Aida, Dong-Lin Jiang, Daisuke Ohno, Hendrick Stapert, Nobuhiro Nishiyama, Kazunori Kataoka
  • Bifunctional phenylene ether oligomer, its derivatives its use and process for the production thereof
    Publication number: 20030130438
    Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3),
    Type: Application
    Filed: June 27, 2002
    Publication date: July 10, 2003
    Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
  • Photosensitive resin composition
    Publication number: 20030017414
    Abstract: A photosensitive resin composition (C) containing a photosensitive resin (B) which is a reaction product produced by modifying an epoxy acrylate (a) with a cyanate ester compound (b) to obtain a modification product (A) and reacting the modification product (A) with a polybasic acid anhydride (c), and a compound (d) of the formula, 1
    Type: Application
    Filed: May 31, 2002
    Publication date: January 23, 2003
    Inventors: Kenji Ishii, Nobuyuki Ikeguchi, Takabumi Omori, Daisuke Ohno