Abstract: An image forming apparatus includes a setting-information storage unit that stores plural pieces of print setting information each indicating a list of settings on printing, in association with logical printer names, a data receiving unit that receives PJL data, print drawing data, and a logical printer name from a client terminal, a parameter setting unit that compares settings included in the received PJL data and the settings in the print setting information that is stored in the setting-information storage unit and corresponds to the received logical printer name, to specify the settings included in the PJL data as print parameters, and a printing unit that prints the print drawing data using the specified print parameters

Abstract: An image forming apparatus, an image forming method, and a storage medium. The image forming apparatus includes a memory, a frame creator to create at least one rendering frame in the memory, a renderer to render rendering data on the at least one rendering frame based on print data, and a control device to arrange the rendering data according to a sequence of the print data in duplex printing.

Abstract: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

Abstract: An image forming apparatus, connected to an information processing device via a network, includes a receiving section, a memory, an interpretation section, and a transmission section. The receiving section receives a plurality of pieces of print data from the information processing device via the network. The plurality of pieces of print data include first print data for normal printing, second print data for interruption printing, and third print data. The memory has first to third buffers. The first and second buffers store the first and second print data, respectively. The third buffer stores the third print data during execution of the interruption printing of the second print data. The interpretation section interprets the plurality of pieces of print data. The transmission section transmits a reply message to the information processing device in accordance with a result of the third print data interpreted by the interpretation section.

Abstract: An image forming apparatus includes a memory interface configured to receive an external memory, an internal memory, a reading unit, a writing unit, and an activating unit. The activating unit activates the image forming apparatus when an external memory is connected to the memory interface and model data read from the external memory by the reading unit is the same as model data about the image forming apparatus stored in the internal memory.

Abstract: An image processing apparatus, method, and computer readable storage medium in which a controller or control means recognizes whether information read from a detachable recording medium can be applied to the image forming apparatus based on the information stored in a memory of the image processing apparatus and a removable recording medium. When the detachable recording medium is recognized as containing information which can be applied to the image processing apparatus, the information from the detachable recording medium is loaded into the image forming apparatus.

Abstract: A memory cell includes a selective gate and a memory gate arranged on one side surface of the selective gate. The memory gate includes one part formed on one side surface of the selective gate and the other part electrically isolated from the selective gate and a p-well through an ONO layer formed below the memory gate. A sidewall-shaped silicon oxide is formed on side surfaces of the selective gate, and a sidewall-shaped silicon dioxide layer and a silicon dioxide layer are formed on side surfaces of the memory gate. The ONO layer formed below the memory gate is terminated below the silicon oxide, and prevents generation of a low breakdown voltage region in the silicon oxide near an end of the memory gate during deposition of the silicon dioxide layer.

Abstract: A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.

Abstract: A memory cell includes a selective gate and a memory gate arranged on one side surface of the selective gate. The memory gate includes one part formed on one side surface of the selective gate and the other part electrically isolated from the selective gate and a p-well through an ONO layer formed below the memory gate. A sidewall-shaped silicon oxide is formed on side surfaces of the selective gate, and a sidewall-shaped silicon dioxide layer and a silicon dioxide layer are formed on side surfaces of the memory gate. The ONO layer formed below the memory gate is terminated below the silicon oxide, and prevents generation of a low breakdown voltage region in the silicon oxide near an end of the memory gate during deposition of the silicon dioxide layer.

Abstract: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

Abstract: A polysilicon film forming a memory gate interconnection and the like includes a part extending from a part positioned on one side surface of a control gate interconnection to a side opposite to a side where the control gate interconnection is positioned, and that part serves as a pad portion. A contact hole is formed to expose the pad portion. The height of a part of the polysilicon film that is positioned on one side surface of the control gate interconnection is set equal to or lower than the height of the control gate interconnection so that the polysilicon film forming a memory gate interconnection and the like does not two-dimensionally overlap the control gate interconnection. Therefore, a semiconductor memory device with increased process margin can be obtained.

Abstract: Memory cells are disposed in plural array form. Select gate electrodes of the memory cells arranged in an X direction are connected to one another by select gate lines respectively. Memory gate electrodes are connected by memory gate lines respectively. The memory gate lines respectively connected to the memory gate electrodes of the memory cells adjacent to one another through source regions interposed therebetween are not electrically connected to one another. Each of the select gate lines has a first portion that extends in the X direction, and a second portion 9b of which one end is connected to the first portion and extends in a Y direction. The memory gate line is formed on its corresponding sidewall of the select gate line with an insulating film interposed therebetween.

Abstract: A manufacturing method of a semiconductor device includes a first electrode formation step of forming a control gate electrode above a surface of a semiconductor substrate with a control gate insulating film interposed between the control gate electrode and the semiconductor substrate, a step of forming a storage node insulating film on the surface of the semiconductor substrate, and a second electrode formation step of forming a memory gate electrode on a surface of the storage node insulating film. The second electrode formation step includes a step of forming a memory gate electrode layer on the surface of the storage node insulating film, a step of forming an auxiliary film, having an etching rate slower than that of the memory gate electrode layer, on a surface of the memory gate electrode layer, and a step of performing anisotropic etching on the memory gate electrode layer and the auxiliary film.

Abstract: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

Abstract: Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 iA to flow a current in the memory cell.

Abstract: A theme change system includes a portable communication device; and a server apparatus, wherein the portable communication device and the server apparatus are connected to each other via a communication network. The portable communication device includes a theme request section making a request for theme data related to an interface between a user and a process execution part for performing processing in accordance with a request from the user to the server apparatus, a theme management section determining permission and non-permission about the reception of the theme data requested by the theme request section and storing, in a storage section, the theme data, and an interface output section outputting the interface on the basis of the theme data when the process execution part is started or while the process execution part is being started. The server apparatus includes a transmission section transmitting theme data to the portable communication device.

Abstract: Defects in element forming regions on which memory cells of a non-volatile memory are formed are to be diminished to reduce leakage current. End portions of element forming regions with non-volatile memory cells formed thereon are extended a length D by utilizing the region which underlies a dummy conductive film, whereby a stress induced from an insulating film which surrounds the element forming regions is concentrated on the extended region. As a result, defects do not extend up to the regions where memory cells are formed and therefore it is possible to reduce leakage current in the memory cells.

Abstract: A method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 ìA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 ìA to flow a current in the memory cell.

Abstract: At least not less than one capacitor formation trench providing an uneven surface is formed on the surface of a capacitor formation region. Thus, the surface area of a capacitor is increased, which enables improvement of the capacitance of the capacitor per unit area. Further, by forming the capacitor formation trench and an element formation trench that are formed in the surface of the semiconductor substrate by the same step, it is possible to simplify the manufacturing process. Whereas, a dielectric film of the capacitor in the capacitor formation region and a high-voltage gate insulating film in a MISFET formation region are formed by the same step; alternatively, the dielectric film of the capacitor in the capacitor formation region and a memory gate interlayer film between a polysilicon layer and a polysilicon layer in the memory cell formation region are formed by the same step.

Abstract: Defects in element forming regions on which memory cells of a non-volatile memory are formed are to be diminished to reduce leakage current. End portions of element forming regions with non-volatile memory cells formed thereon are extended a length D by utilizing the region which underlies a dummy conductive film, whereby a stress induced from an insulating film which surrounds the element forming regions is concentrated on the extended region. As a result, defects do not extend up to the regions where memory cells are formed and therefore it is possible to reduce leakage current in the memory cells.