Abstract: Imprint mold 50 includes first surface 51A, second surface 51B that is opposite to first surface 51A and is an uneven surface, and a plurality of pillars 52 protruding from second surface 51B. Second surface 51B around pillar 52 has a recessed shape recessed toward first surface 51A. Imprint mold 50 is used to provide opening 42 in resist 40 provided on a surface of semiconductor element 10, opening 42 corresponding to a position of electrode terminal 11.

Abstract: The mounting structure includes a first member including a first electrode pad and a metal bump disposed on a surface of the first electrode pad, and a second member disposed to face the first member and including a second electrode pad bonded to the metal bump, and a second insulating layer. An oxide film is formed on a surface of the metal bump. A metal bonding portion is formed between the metal bump and the second electrode pad, wherein at the metal bonding portion, metal constituting the metal bump and metal constituting the second electrode pad are metal-bonded. An oxide film bonding portion is formed between the oxide film and the second insulating layer, wherein at the oxide film bonding portion, the oxide film and the second insulating layer are bonded.

Abstract: A hybrid mold that is used for forming a wiring structure including wiring and vias connecting pieces of the wiring in different layers to each other, the hybrid mold includes a body made of an optically transparent material, a masking pattern made of an opaque material and disposed on a first surface of the body and a pillar structure including a plurality of pillars made of the optically transparent material and protruding from a second surface of the body, the second surface being opposite to the first surface. The masking pattern has shape and placement corresponding to shape and placement of the wiring when viewed from a direction orthogonal to the first surface, and the plurality of pillars each has shape and placement corresponding to shape and placement of the vias when viewed from the direction orthogonal to the first surface.

Abstract: A method for manufacturing a semiconductor device includes providing a semiconductor element having electrode terminals; forming a resist on the semiconductor element, the resist having a first surface facing the electrode terminals and a second surface opposite to the first surface; forming an opening in the resist, which covers the electrode terminals by inserting protrusions of a mold into the resist above the electrode terminals; curing the resist by applying energy to the resist; and widening the opening in a radial direction of the opening. The resist is cured in a state where the second surface of the resist faces an inner surface of the mold with a gap between the second surface of the resist and the inner surface of the mold.

Abstract: An photonic interconnect that is formed in an photonic device having an optical waveguide and transmits light emitted from a optical input and output portion included in the optical waveguide includes a connection portion connected to the optical waveguide and a transmission line portion extending from the connection portion. The connection portion is connected to the optical waveguide while avoiding the optical input and output portion, and is wider than the transmission line portion.

Abstract: A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer electrically connected to the first wiring layer, “N” layers (“N” is a natural number of 1 or greater) of insulating layers including a second insulating layer, a cavity formed through the “N” layers of insulating layers and exposing an upper surface and a side surface of the second wiring layer, a surface-processed layer covering the upper surface and the side surface of the second wiring layer, an electronic component mounted on the surface-processed layer, a filling insulating layer filling the cavity and covering the electronic component, and a third wiring layer electrically connected to the electronic component. The side surface of the second wiring layer includes a first roughened surface, and the upper surface of the second wiring layer includes a second roughened surface having a greater surface roughness than the first roughened surface.

Abstract: A method for producing an optical module includes: a step of bonding an electrode formed on a surface of a substrate and an electrode described on a surface of an optical element via a bump; a step of injecting an optical transparent resin to be cured by light into a gap between the substrate and the optical element; a step of applying light through an optical waveguide, formed on the substrate, toward a light reception unit formed on the optical element to photocure the optical transparent resin located between the optical waveguide and the light reception unit; a step of removing an uncured portion of the optical transparent resin; a step of injecting a encapsulation resin that has a coefficient of thermal expansion smaller than that of the optical transparent resin and is to be cured by heat into the gap between the substrate and the optical element; and a step of thermally curing the encapsulation resin.

Abstract: Semiconductor device (50) includes: semiconductor element (1) having a plurality of electrode terminals (2); bump (8) formed on each of the plurality of electrode terminals (2) and having tapering part (8a) that narrows with distance from a side close to corresponding one of electrode terminals (2); and buffer part (3c) covered with bump (8).

Abstract: A plate-shaped sensor element comprising an internal space 10G that extends in the axial line direction of the sensor element. When viewed at a cross section perpendicular to the axial line direction, at a corner portion of a first inner surface S1 closest to an outer surface of the sensor element in the internal space, a projection 80 extending from the corner portion toward the internal space is formed. Further, a void G2 is formed between a tip of the projection and the first inner surface.

Abstract: A flip-chip mounting structure includes a first member including a first electrode pad, a bump formed on the first electrode pad, a second member including a second electrode pad, and a connection portion formed on the second electrode pad. The first member and the second member are flip-chip mounted, and the first electrode pad and the second electrode pad are electrically connected via the bump and the bonding portion. The bonding portion includes at least a first bonding portion formed in a region sandwiched between a top portion of the bump and the second electrode pad, and a second bonding portion formed in a region surrounding a periphery of the first bonding portion and a region surrounding at least a side surface of the bump. Each of the first bonding portion and the second bonding portion is made of a sintered body of a metal powder.

Abstract: A method for manufacturing a bump on an object includes preparing an object including an electrode pad and a resist layer including an opening portion on the electrode pad. Further, the method includes inserting a needle having a diameter smaller than an opening diameter of the opening portion to the opening portion to come into contact with the electrode pad, filing the opening portion with a metal particle dispersion by transferring the metal particle dispersion to the needle, and sintering the metal particle dispersion filling the opening portion.

Abstract: A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

Abstract: A semiconductor element includes a plurality of microlenses provided on a main surface to collect light, a plurality of conductive electrodes provided on a back surface of the main surface, a photoelectric converter to which the light collected by the plurality of microlenses is guided, and a strain sensor provided on the same layer as the photoelectric converter to detect a strain. A solid-state imaging apparatus includes the semiconductor element, a transparent member, an adhesive layer that covers the plurality of microlenses and adheres to the transparent member, and a plurality of external connection electrodes electrically connected to the plurality of conductive electrodes, respectively.

Abstract: A hydraulic system of a working machine includes a hydraulic pump to output a hydraulic fluid, at least one proportional valve to deliver the hydraulic fluid to a supply target, a valve body including the proportional valve, a heat-up fluid passage in the valve body and into which the hydraulic fluid flows, a switching valve switchable between an open position in which the hydraulic fluid passing through the heat-up fluid passage is supplied to a hydraulic device and a closed position in which the hydraulic fluid is not supplied thereto and the hydraulic fluid from the hydraulic device is to be returned, a controller to operate the switching and proportional valves, and a return circuit through which the hydraulic fluid flowing into the heat-up fluid passage is returned as a result of at least one of the switching and proportional valves being operated by the controller.

Abstract: A working machine includes a machine body having a front-rear direction and a right-left direction perpendicular to the front-rear direction and having a rear part in the front-rear direction, a right side, and a left side opposite to the right side in the right-left direction. A boom has a front end part and a rear end part opposite to the front end part of the boom in the front-rear direction. The rear end part of the boom is rotatably supported at the rear part of the machine body. The front end part of the boom is to be connected to a working tool. An engine is mounted in the rear part of the machine body. A urea aqueous solution tank is provided on one side of the engine in the right-left direction and a rear side of the engine in the front-rear direction to store a urea aqueous solution.

Abstract: A method for manufacturing a semiconductor device includes providing a semiconductor element having an electrode terminal, forming a resist on the semiconductor element, the resist having a first surface facing the electrode terminal and a second surface opposite to the first surface, providing an imprint mold having a third surface and a protrusion protruding from the third surface, forming an opening in the resist by disposing the imprint mold on the second surface of the resist and inserting the protrusion into the resist, the third surface of the imprint mold facing the second surface of the resist, the protrusion being aligned with the electrode terminal, curing the resist by applying energy to the resist, widening the opening in a radial direction of the opening by causing the resist to react with a developer, and forming a bump by filling the opening with metal, in which the forming of the opening in the resist is performed in a state where a gap is provided between the second surface of the resist and

Abstract: An ejector refrigeration cycle includes a compressor, a radiator, a branch portion, an ejector, a suction side decompressor, a windward evaporator, and a leeward evaporator. The ejector includes a nozzle portion and a pressure increasing portion. The windward evaporator and the leeward evaporator include at least one outflow side evaporation portion. The leeward evaporator includes a suction side evaporation portion. An outflow side evaporation temperature is a refrigerant evaporation temperature in the at least one outflow side evaporation portion of the leeward evaporator. A suction side evaporation temperature is a refrigerant evaporation temperature in the suction side evaporation portion of the leeward evaporator.

Abstract: A hydraulic system of a working machine includes a hydraulic pump to output a hydraulic fluid, at least one proportional valve to deliver the hydraulic fluid to a supply target, a valve body including the proportional valve, a heat-up fluid passage in the valve body and into which the hydraulic fluid flows, a switching valve switchable between an open position in which the hydraulic fluid passing through the heat-up fluid passage is supplied to a hydraulic device and a closed position in which the hydraulic fluid is not supplied thereto and the hydraulic fluid from the hydraulic device is to be returned, a controller to operate the switching and proportional valves, and a return circuit through which the hydraulic fluid flowing into the heat-up fluid passage is returned as a result of at least one of the switching and proportional valves being operated by the controller.

Abstract: When an ejector having a variable nozzle and a variable throttle mechanism are integrated together as an ejector module, a nozzle-side central axis CL1 and a decompression-side driving mechanism have a twisted positional relationship, if the nozzle-side central axis CL1 is defined as a central axis of a nozzle-side driving mechanism in a displacement direction in which the nozzle-side driving mechanism of the ejector having the variable nozzle displaces a needle valve, and the decompression-side central axis CL2 is defined as a central axis of a decompression-side driving mechanism in a displacement direction in which the decompression-side driving mechanism of the variable throttle mechanism displaces a throttle valve. When viewed from the central axis direction of one of the nozzle-side central axis CL1 and the decompression-side central axis CL2, a driving portion corresponding to the one central axis is disposed to overlap with the other central axis.

Abstract: A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.