Abstract: A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

Abstract: An electronic component mounted structure is constituted by connecting together via a conductive adhesive 2 the electrode terminals 1a of a first electronic component such as a semiconductor element 1 and the electrode terminals 6a (here, projecting electrodes formed thereon) of a second electronic component such as a circuit substrate 6, and filling a molding resin 4 into a gap between the semiconductor element 1 and the circuit substrate 6. The molding resin 4 is composed of a low elasticity layer 3 and a high elasticity layer having higher elasticity than the low elasticity layer, and the low elasticity layer 3 lies adjacent to the whole of the outer surface of the conductive adhesive 2.

Abstract: Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

Abstract: A non-contact information storage medium has IC chip having at least a function of storing information, and resin substrate having antenna pattern for communicating a signal to an external device. Antenna terminal disposed at one end of antenna pattern on resin substrate and electrode terminal of IC chip are mounted so that the antenna terminal faces the electrode terminal. Insulating layer for gap regulation of at least 5 ?m is disposed between antenna pattern and circuit forming surface of IC chip.

Abstract: An electronic part mounting structure includes electronic part (2) having a plurality of electrode terminals (3), a substrate provided with connection terminals (6) in locations corresponding to these electrode terminals (3), and protruding electrode (7) for connecting one of electrode terminals (3) and one of connection terminals (6), where electrode terminal (3) of electronic part (2) and connection terminal (6) of substrate (5) are connected through protruding electrode (7), and protruding electrode (7) is formed of a conductive resin including a photosensitive resin and a conductive filler.

Abstract: A microbicidal agent comprising as an effective ingredient at least one selected from the group consisting of p-hydroxybenzaldehyde, 5,7,4?-trihydroxy-3?,5?-dimethoxyflavone, 3-hydroxypyridine and vanillin, and a microbicidal composition comprising the microbicidal agent.

Abstract: A method of moving figures whereby a number of aligned figures can be efficiently moved while maintaining the alignment. The method includes a figure group generating step of generating a plurality of figure groups arranged in a matrix by grouping a plurality of figures arranged in a matrix; an overall reference figure setting step of setting an overall reference figure selected from said plurality of figures; an entire figure moving step of moving all of the figures in the same manner as said overall reference figure when said overall reference figure is selected and moved; a reference figure setting step of setting a single reference figure selected from said plurality of figures in each of said figure groups; and a figure group moving step of moving all of the figure groups except for the figure group containing said overall reference figure while maintaining the relative relationships between the rows and columns and between the figure groups, when one of said reference figures is selected and moved.

Abstract: Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.

Abstract: A spline rolling tool including a plurality of forming teeth that are to bite into a cylindrical workpiece so as to roll splines in the workpiece. Each of the forming teeth has an incomplete toothed region in which a crest of each forming tooth is removed such that an upper end of each forming tooth in the incomplete toothed region is defined by an incomplete-toothed region surface that includes a curved surface portion, a flat surface portion and a slant surface portion. The incomplete-toothed region surface is defined at its periphery by a chamfered edge that has a surface roughness of not larger than about 3.2 ?m. Also disclosed is a process of manufacturing the spline rolling tool, which includes a chamfering step of forming the chamfered edge by using a wire brush having abrasive grains that are fixed to bristles of the wire brush.

Abstract: Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.

Abstract: A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 so as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and forming second conductive interconnection 6 onto interlevel insulator layer 42 to include opening 5.

Abstract: Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.

Abstract: After a first electronic component is inserted into a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted on the first circuit patterns to complete an electronic component-mounted component. According to the above method, a thickness of a module may be decreased by a thickness of the base substrate. Further, since electronic components are surface-mounted, electronic components of arbitrary sizes and types may be used.

Abstract: An interconnection substrate includes: an interconnection layer region where at least a first conductor layer and a second conductor layer are vertically stacked in that order on a substrate, with the first conductor layer and second conductor layer containing conductive particles and a binder, wherein the first conductor layer and second conductor layer stacked in the interconnection layer region have conductive particles different in average particle size from each other. As a result, only an intended region can have low resistance.

Abstract: First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

Abstract: After a first electronic component is inserted into a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted on the first circuit patterns to complete an electronic component-mounted component. According to the above method, a thickness of a module may be decreased by a thickness of the base substrate. Further, since electronic components are surface-mounted, electronic components of arbitrary sizes and types may be used.

Abstract: A technology that allows a consensus sequence targeted for primer design to be easily displayed is provided. In sequence data of analysis targets, a consensus nucleotide sequence is generated by performing multiple sequence alignment based on nucleotide sequence, and a consensus amino acid sequence is generated by performing multiple sequence alignment based on amino acid sequence, followed by generating additional consensus nucleotide sequence by reverse translation of the consensus amino acid sequence. In other words, two consensus sequences consisting of the consensus sequence based on nucleotide sequence and the consensus sequence based on amino acid sequence are generated. One of these two consensus sequences can be chosen as a target for primers on a screen to input parameters for primer design.

Abstract: A semiconductor element (111) with electrodes (112), and a passive element (113) with electrodes (113a) are embedded in a thermoplastic sheet base (115), which is then subjected to laser beam machining, electron beam machining or ion beam machining to expose electrodes (112 and 113a). Thereafter, a circuit pattern (119) is formed by formation of a thin film or printing of a conductive adhesive. Exposing the electrodes by laser beam machining or the like can be carried out in a short period of time and also by local treatment, thereby reducing damage to the base.

Abstract: First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

Abstract: Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.