Abstract: An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus includes a first depression which cooperates with an alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the first substrate and a second depression which cooperates with a second alignment sphere to mechanically engage a corresponding depression disposed on the front surface of the second substrate. The first and second depression of the alignment apparatus and the alignment spheres cooperate to passively align micro-components disposed on each of the substrates.

Abstract: A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: A noisemaking toy with hard objects attached to terminal ends of a U-shaped handle. The hard objects can be steel ball bearings (e.g. ¾? diameter), and the U-shaped handle can comprise a U-shaped piece of resilient spring steel wire. The legs of the handle can be pressed together by hand so that the hard objects can be contacted. The objects are shaped so that they make point contact. When the hard objects are pressed together by pressing on the legs of the handle, the objects bounce many times, producing an unusual sound. The sound is initially a rapid series of clicks, and, as energy is dissipated, the sound changes to a buzz and then a high-pitched squeak. The objects must have a hardness of at least 30, 40, or 50 Rockwell C. High hardness is preferred.

Abstract: Baked goods are often burned by exposure to heat radiation (infrared rays) from heating coils in an electric baking oven. The infrared rays strike the bottom surface of bakeware and heat the surface to the point of burning. The present invention provides a heat shield that protects the bakeware from infrared rays and burning. The present invention comprises a metal sheet having corrugations or bumps. Bakeware is disposed on the bumps. The bumps make point contact with the bakeware, thereby limiting heat transfer to the bakeware. The bumps provide an insulating air gap between the heat shield and bakeware. Also included is a sheet disposed under a wire baking rack. The sheet blocks infrared rays. The sheet can be suspended by hooks or brackets, for example.

Abstract: A micromachined structure, comprising: a substrate; a first wet etched pit disposed in the substrate; a second wet etched pit disposed in the substrate, the second pit extending into the substrate a greater depth than the first pit; and a dry pit disposed between, and adjacent to, the first and second pits. Also disclosed is a micromachined substrate comprising: a wet etched pit; and a dry-etched hole disposed in the wet etched pit, wherein the dry hole extends through the substrate.

Abstract: An optical device is disclosed which includes a waveguide that support a first optical mode in a first region and a second optical mode in a second region. The waveguide further includes single material guiding layer having a lower portion with a first taper and an upper portion with a second taper.

Abstract: The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic planes of a single crystal substrate. Two of the structures provided are an etch-stop pit and an anisotropically etched feature disposed adjacent the etch-stop pit. At the point of intersection between the etch-stop pit and the anisotropically etched feature the orientation of the crystallographic planes is maintained. The present invention also provides a method for micromachining a substrate to form an optical microbench. The method comprises the steps of forming an etch-stop pit and forming an anisotropically etched feature adjacent the etch-stop pit. The method may also comprise coating the surfaces of the etch-stop pit with an etch-stop layer.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: A micromachined structure, comprising: a substarte; a first wet etched pit disposed in the substrate; a second wet etched pit disposed in the substrate, the second pit extending into the substrate a greater depth than the first pit; and a dry pit disposed between, and adjacent to, the first and second pits. Also disclosed is a micromachined substrate comprising: a wet etched pit; and a dry-etched hole disposed in the wet etched pit, wherein the dry hole extends through the substrate.

Abstract: In accordance with the present invention a fiber optic array is provided. The array includes a substrate having a fiber support surface. The array further includes an optical fiber having a fiber portion that includes an un-jacketed, un-buffered optical core segment. The un-jacketed, un-buffered optical core segment is placed in contact with the fiber support surface to orient the optical core segment at a selected position relative to the support surface. In addition, the array includes a solder glass chemically bonded to the optical core segment and the fiber support surface so that the optical core segment is secured at a predetermined location relative to the support surface of the substrate. A method for fabricating such a fiber optic array is also provided.

Abstract: Provided are radiofrequency identification (RFID) tag readers having visible light beams to visually indicate the location of an RFID tag. In one embodiment, the RFID reader can electronically determine the location of an RFID tag. The RFID reader has a visible laser scanner that is controlled to target the RFID tag, based on the electronic location data. Hence, the user will see a laser beam point toward the RFID tag location. In another embodiment, the RFID tag reader has a directional RF interrogating beam, and a visible light beam that overlaps with the RF interrogating beam. The visible light beam indicates the volume of space where the RFID tag reader can detect RFID tags. The size of the visible light beam can be adjusted to be bigger for more sensitive tags (e.g. active tags) or smaller for less sensitive tags. (e.g. passive tags), or adjusted for RF output power.

Abstract: An optical device is disclosed which includes a single-mode waveguide (700) which supports a first optical mode in a first region and a second optical mode in a second region. The waveguide includes a guiding layer (703) having at least one wing (750) extended outwardly from the guiding layer (703). The guiding layer (703) may desirably have a rib waveguide (706, 707) cross sectional shape at the wings. The wings (750) decrease in width along the length of the guiding layer to convert a rib waveguide mode at the wings to a channel waveguide mode.

Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in the substrate such that the tap surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.

Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate such that the top surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.

Abstract: An optoelectronic submount for providing optical connection and electrical connection to a vertically communicating optical device, such as a vertical cavity surface-emitting laser. The submount has a trench for holding the optoelectronic device on-edge, and electrical connection pits adjoining the trench. A metallization layer is disposed in the electrical connection pits. The electrical connection pits are aligned with the trench and optoelectronic device so that compact pads on the optoelectronic device can be soldered to the metallization layer. A groove can be provided in the submount for holding an optical fiber in alignment with an active area of the optoelectronic device.

Abstract: An optical fiber having an a core with a D-shape or an oval shape at an endface. The optical fiber tapers from a round, cylindrical section to the endface so that adiabatic mode transformation is provided. Preferably, the D-shape or oval shape is selected so that the optical fiber has a mode shape at its endface that matches the mode shape of a diffused waveguide.

Abstract: The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic planes of a single crystal substrate. Two of the structures provided are an etch-stop pit and an anisotropically etched feature disposed adjacent the etch-stop pit. At the point of intersection between the etch-stop pit and the anisotropically etched feature the orientation of the crystallographic planes is maintained. The present invention also provides a method for micromachining a substrate to form an optical microbench. The method comprises the steps of forming an etch-stop pit and forming an anisotropically etched feature adjacent the etch-stop pit. The method may also comprise coating the surfaces of the etch-stop pit with an etch-stop layer.

Abstract: An optical subassembly which positions an optical device is described. The optical device is mounted on a plurality of spheres or columns placed in predetermined positions in an upper surface of a substrate. The predetermined positions include pits formed in the upper surface of the substrate. The spheres may be the same size or may be of varying sizes. Pits or grooves also may be formed in the optical device. The optical device may be formed with flexure positions to assist in holding it in place on the spheres. Further, the optical device, spheres and substrate may be metallized or formed of metal and the surface tension forces of solder may be utilized to position the optical device.

Abstract: Baked goods are often burned by exposure to heat radiation (infrared rays) from heating coils in an electric baking oven. The infrared rays strike the bottom surface of bakeware and heat the surface to the point of burning. The present invention provides a heat shield that protects the bakeware from infrared rays and burning. The present invention comprises a sheet disposed under a wire baking rack. The sheet blocks infrared rays and can be make of sheet metal. The sheet can be suspended by hooks, for example. In another aspect of the invention, the sheet is disposed on top of the wire baking rack. In this embodiment, the sheet has corrugations or bumps that provide only line contact or point contact with the bakeware. Hence, an insulating air layer is provided between the sheet and the bakeware.