Abstract: An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Abstract: A novel micromachining method in which dry etching and anisotropic wet etching are combined.

Abstract: An optical fiber array having a V-groove chip with a front portion and a rear portion. The optical fibers are disposed in the V-grooves. The optical fibers are bnonded (e.g. glued) to the V-groove chip in the rear portion of the chip. The optical fibers are not bonded to the front portion of the chip. Preferably, the optical fibers have endfaces that are flush with a front face of the chip. The optical fibers extend from the rear portion. In use, the optical fiber array is pressed against V-grooves of an integrated optics chip or optoelectronic submount. Since the optical fibers are not bonded to the front portion, they can move slightly to fit precisely into V-grooves of the IO chip or submount. Hence, optical fiber alignment is improved. Also, there is no danger of residual adhesive preventing close contact between the optical fibers and IO chip.

Abstract: A waveguide array is provided for use in optical systems requiring a two-dimensional array of waveguides. The two-dimensional array comprises a first one-dimensional array which includes a plurality of optical waveguides and at least one registration feature. The two-dimensional array also comprises a second one-dimensional array having a plurality of optical waveguides and comprising at least one detent disposed in communication with the registration feature. The detent and registration feature are provided in respective locations of the first and second one-dimensional arrays so that the conjoined first and second one-dimensional arrays provide a two-dimensional array of waveguides. In a particular configuration of the two-dimensional array, the waveguides comprise optical fibers.

Abstract: Optoelectronic packages comprise both an optical array and base chip. The array and base chip are aligned and coupled using a combination of V-grooves, wick stops, and alignment spheres (e.g., presion ball bearings). The array and base chip are passively aligned by disposeing an optical fiber having an angled endface onto V-grooves in both the array and base chip. The base chip typically comprises an optical surface device, such as a vertical cavity, surface emitting laser or photodetector.

Abstract: An optical interconnect includes a waveguide holder having a first side and a second side. The first side has a first depression and the second side has a second depression. The waveguide holder has an opening in which a plurality of waveguides are disposed.

Abstract: The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A movement guiding member is provided for guiding the movement of the second waveguide holding member. A registration element is disposed at the movement guiding member for positioning the second waveguide holding member at a selected location relative to the first waveguide holding member. The selected location is one that provides alignment between a selected waveguide of the first waveguide holding member and a selected waveguide of the second waveguide holding member.

Abstract: The present invention relates generally to micromachining. More particularly, the present invention relates to a method for combining directional ion etching and anisotropic wet etching and devices and structures fabricated thereby. The present invention is particularly applicable to silicon micromachining and provides architectures that combine crystallographic surfaces and vertical dry etched surfaces together in the same structure.

Abstract: A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant optical filters may be used in a variety of applications including etalon applications.

Abstract: An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is positioned on V-grooves located on the upper surface. The imaging assembly, which preferably includes a plurality of lenses, such as GRIN lenses, is lowered at least partially into the cut-out portion. The optical fibers are optically coupled with said lenses. A waveguide, having a plurality of waveguide cores within a cladding, may further be optically coupled with the lenses, or alternatively, directly to the optical fibers. An integrated optic chip may also be affixed to the substrate or mounted on the substrate.

Abstract: An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.

Abstract: An optical fiber switch having two coupled fiber arrays which move in a transverse direction to provide switching action. Each array has a front face and the front faces are nearly in contact. Optical fiber ends are located at the front faces. The front faces of the fiber arrays have transverse grooves in which rolling spheres are disposed. The fiber arrays move by rolling on the spheres. The spheres provide for smooth transverse motion and a fixed distance between optical fiber arrays. The spheres and front face grooves also provide for alignment between the optical fibers.

Abstract: An optical device package includes a substrate, optical semiconductor component, optical fiber, frame and lid. The substrate has a longitudinal notch for mounting the optical fiber and a lateral groove with a proximally facing stop surface. The frame includes at least one downwardly extending projection configured and dimensioned so as to engage a lateral end portion of the lateral groove. The frame is self-aligning and seats itself by being dropped into place.

Abstract: An optical switch includes a first wavedguide holding member and a second waveguide holding member disposed on a substrate. The first waveguide holding member moves relative to the second waveguide holding member. A movement guiding member guides the motion of the first waveguide holding member and the substrate. Advantageously, the first waveguide holding member moves transversely relative to the second waveguide holding member. The traverse motion enables selective coupling between a waveguide in the first waveguide holding member and a waveguide in the second holding member. Through this transverse motion of the second waveguide holding member, an optical switching action may be implemented.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommodating fiber buffer coating, and a notch being formed in a top portion of the mount between the channel and one side portion thereof, for retaining strengthening fibers of an optical fiber cable, with the V-groove being configured to receive individual optical fibers therein respectively. Two such molded mounts with silicon chips are securely sandwiched together with V-groove of the chips opposing one another to retain optical fibers therebetween.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: Granules bonded to a sandal sole provide a high traction surface, even when wet. The granules are bonded to an upper surface of the sandal sole. The granules can be embedded in the sole or bonded to the sole with adhesive. The granules can be made of crushed rock or other hard materials. The granules can be present in selected weight-bearing areas of the sandal, such as the area supporting the foot ball, toes or heel. The granules may be present only in an area under the foot ball. The present sandal sole prevents the foot from slipping against the sandal sole, and thereby prevents damage to the sandal and prevents injury from falling.

Abstract: An optical switch is provided for selectively coupling outputs of one or more fibers of a first array to one or more inputs of fibers of a second array. The first array includes a first groove disposed within a front face of the first array. The second array optionally includes a second groove disposed within a front face of the second array. The first and second fiber arrays are oriented so that their respective front faces are disposed in a facing relationship. A roller element is located within at least the first groove, permitting the first array to translate relative to the second array upon the roller element along the direction of the first groove. In addition, detents may be formed within the grooves of each array to create areas in which the roller element may at least temporarily seat. The location and number of detents are arranged to correspond to the location and number of rows of fibers in the respective arrays.

Abstract: In an integrated optical waveguide device including a first top portion on the substrate, and a plurality of juxtaposed waveguide cores within cladding layers on a second top portion of the substrate, the waveguide cores having respective inner endfaces parallel to a longitudinal open slotway formed in the substrate between the first and second top portions, the substrate being undercut from the slotway to produce a cantilevered section of the waveguide cores and cladding layers, for permitting the plurality of waveguide cores and associated cladding layers to be simultaneously cleaved, thereby providing a smooth endface thereacross.