Abstract: An optical device package includes a substrate, optical semiconductor component, optical fiber, frame and lid. The substrate has a longitudinal notch for mounting the optical fiber and a lateral groove with a proximally facing stop surface. The frame includes at least one downwardly extending projection configured and dimensioned so as to engage a lateral end portion of the lateral groove. The frame is self-aligning and seats itself by being dropped into place.

Abstract: The invention includes an integrated optical device having an embedded waveguide and an alignment groove. The waveguide is made by depositing waveguide material in a trench and then planarizing the chip. The alignment grooves can provide passive alignment for connecting the chip to other waveguides or optical fibers.

Abstract: A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

Abstract: An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive vias extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate such that the top surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.

Abstract: An optical connector system is disclosed which utilizes a pair of substrates having optical elements associated therewith. Fiducial features in conjunction with alignment members are further utilized to provide for a greater alignment of the optical elements. Methods for forming the optical connector system are also provided.

Abstract: An optical fiber having an endface with a D-shape at an endface. The optical fiber tapers from a round, cylindrical section to the D-shaped section so that adiabatic mode transformation is provided. Preferably, the D-shape is selected so that the optical fiber has a mode shape at its endface that matches the mode shape of a diffused waveguide.

Abstract: The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic planes of a single crystal substrate. Two of the structures provided are an etch-stop pit and an anisotropically etched feature disposed adjacent the etch-stop pit. At the point of intersection between the etch-stop pit and the anisotropically etched feature the orientation of the crystallographic planes is maintained. The present invention also provides a method for micromachining a substrate to form an optical microbench. The method comprises the steps of forming an etch-stop pit and forming an anisotropically etched feature adjacent the etch-stop pit. The method may also comprise coating the surfaces of the etch-stop pit with an etch-stop layer.

Abstract: Novel micromachined structures made by combined wet and dry etching.

Abstract: An optical device includes a single-piece alignment frame and has at least one opening therein. The opening is adapted to receive a waveguide alignment member.

Abstract: An optical fiber array having wick stop grooves in a front face of the array. The wick stop grooves control the movement of liquid adhesive (e.g. UV curable adhesive, solder, sol-gel). Particularly, the wick stop grooves prevent liquid adhesive from flowing between the optical fibers in the array and waveguides of an integrated optic chip. Adhesives disposed in the fiber-waveguide optical path can degrade the performance of optical devices. The wick stop grooves can be cut with a dicing saw, or chemically etched (wet or dry), and can have a wide variety of patterns (e.g., straight lines, circles). In any case, the wick stop grooves must prevent the flow of liquid adhesive between the fibers and waveguides. Alternatively, the wick stop grooves are disposed in an edge of the integrated optic chip. Also, the wick stop grooves can be disposed on the front face of other microoptical devices such as filters and lenslet arrays.

Abstract: A connector for optically connecting an array of optoelectronic device (e.g. VCSELS or photodetectors) and an array of optical waveguides (e.g. optical fibers or integrated optical waveguides). The device has a submount chip for holding the optoelectronic device. The submount chip has a micromachined pit and the OE device is disposed in the pit. The pit has sidewalls that provide mechanical alignment for the OE device. The submount also has holes for receiving guide pins. The connector also has a waveguide array such as a V-groove optical fiber array. The waveguide array has edges of holes for contact with the guide pins. When the guide pins are inserted into the submount chip, the waveguides are automatically aligned with the optical waveguides. The present invention is also directed to the submount chip and OE device combination.

Abstract: A novel micromachining method in which dry etching and anisotropic wet etching are combined.

Abstract: A method of forming a tapered V-groove in a <100>silicon substrate is described. Spaced apart pits are dry etched in the substrate and sidewalls of the pits are masked. Then, sections of the substrate are wet-etched to connect the spaced apart pits. Each successive wet-etched section has a different width, and hence depth, than the preceding wet-etched section. In one aspect, each succeeding wet-etched section is not as wide, and hence more shallow, than the preceding wet-etched section. Also, each succeeding pit has a smaller cross-sectional area than the preceding pit.

Abstract: The invention includes fiber optic device, comprising a substrate comprising at least one groove comprising a first surface, a fiber stop a bonding material, and at least one fiber comprising a second surface in the at least one groove, wherein at least one of the first surface and the second surface has a surface energy that increases in the direction of the fiber stop and method for longitudinally locating an optical fiber stub in a groove wherein the fiber stub is pressed against a fiber stop by surface tension.

Abstract: A thin film magnetic read/write head which has a return pole and a read/write pole adjacent to the return pole. The return pole has a vertical sidewall which has a predetermined height and is perpendicular to a substrate. An insulating layer is disposed on the sidewall between the return pole and read/write pole. The insulating layer thus defines a gap spacing between the return pole and read/write pole. The read/write pole comprises a magnetic material layer which is perpendicular to the substrate and adhered to the insulating layer. The thickness of the magnetic material layer determines the thickness of the read/write pole. The return pole and read/write pole have top surfaces which are coplanar. The plane defined by the top return pole surface is perpendicular to the magnetic material layer and parallel to the substrate. The read/write pole is magnetically coupled to a core layer which is magnetically coupled to a solenoidal winding of conductive material.

Abstract: An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is positioned on V-grooves located on the upper surface. The imaging assembly, which preferably includes a plurality of lenses, such as GRIN lenses, is lowered at least partially into the cut-out portion. The optical fibers are optically coupled with said lenses. A waveguide, having a plurality of waveguide cores within a cladding, may further be optically coupled with the lenses, or alternatively, directly to the optical fibers. An integrated optic chip may also be affixed to the substrate or mounted on the substrate.

Abstract: A method of producing smooth sidewalls on a micromachined device is described. A portion of the wafer is dry etched, forming a dry etched sidewall. The sidewall is covered with a mask. An area adjacent to the dry etched area is wet etched, forming a wet etched sidewall. The mask may optionally be removed after wet etching. The wafer substrate has a <110> orientation, which allows the wet etched area to have nearly vertical wet etched sidewalls.

Abstract: A stacked assembly includes first and second substrates and at least one alignment member. The alignment member has a relatively wide diameter body portion and a relatively narrow diameter alignment projection extending from the body portion. The body portion is mounted in a groove in the upper surface of the second substrate and the alignment projection being mounted in the groove in the upper surface of the first substrate.

Abstract: An optical fiber switch having two coupled fiber arrays which move in a transverse direction to provide switching action. Each array has a front face and the front faces are nearly in contact. Optical fiber ends are located at the front faces. The front faces of the fiber arrays have transverse grooves in which rolling spheres are disposed. The fiber arrays move by rolling on the spheres. The spheres provide for smooth transverse motion and a fixed distance between optical fiber arrays. The spheres and front face grooves also provide for alignment between the optical fibers.