Patents by Inventor Daniel Richter

Daniel Richter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11000312
    Abstract: An access device for accessing an intervertebral disc having an outer shield comprising an access shield with a larger diameter (˜16-30 mm) that reaches from the skin down to the facet line, with an inner shield having a second smaller diameter (˜5-12 mm) extending past the access shield and reaches down to the disc level. This combines the benefits of the direct visual microsurgical/mini open approaches and the percutaneous, “ultra-MIS” techniques.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: May 11, 2021
    Assignee: Medos International Sarl
    Inventors: Daniel Thommen, Joern Richter, Michael Wang, Richard Assaker, Richard Fessler, Christoph Mehren, Seang Beng Tan, William Taylor, Eric Buehlmann, Michael White, Piet Hinoul, Richard Kocharian
  • Publication number: 20210135068
    Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
    Type: Application
    Filed: July 31, 2018
    Publication date: May 6, 2021
    Inventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter, Christopher Wiesmann, Ludwig Peyker, Alexander Linkov
  • Publication number: 20210126156
    Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
    Type: Application
    Filed: July 31, 2018
    Publication date: April 29, 2021
    Inventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter
  • Patent number: 10987129
    Abstract: An access device for accessing an intervertebral disc having an outer shield comprising an access shield with a larger diameter (˜16-30 mm) that reaches from the skin down to the facet line, with an inner shield having a second smaller diameter (˜5-12 mm) extending past the access shield and reaches down to the disc level. This combines the benefits of the direct visual microsurgical/mini open approaches and the percutaneous, “ultra-MIS” techniques.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: April 27, 2021
    Assignee: Medos International Sarl
    Inventors: Daniel Thommen, Joern Richter, Michael Wang, Richard Assaker, Richard Fessler, Christoph Mehren, Seang Beng Tan, William Taylor, Eric Buehlmann, Michael White
  • Publication number: 20210114798
    Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Applicant: Altria Client Services LLC
    Inventors: Stephen Bellamah, Daniel Richter
  • Patent number: 10926943
    Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: February 23, 2021
    Assignee: Altria Client Services LLC
    Inventors: Stephen Bellamah, Daniel Richter
  • Publication number: 20210043615
    Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.
    Type: Application
    Filed: February 25, 2019
    Publication date: February 11, 2021
    Inventors: Daniel Richter, Tobias Gebuhr, Michael Betz, Markus Boss
  • Publication number: 20210043465
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Publication number: 20210038542
    Abstract: Described is a stable cosmetic or dermatological formulation, in particular a wound healing ointment, which comprises a.) 0.8 to 3 wt.-%, in particular 1.2 to 1.8 wt.-% glyceryl stearates, b.) 0.8 to 3 wt.-%, in particular 1.2 to 1.8 wt.-% glyceryl stearates SE, c.) one or more lipids selected from the group of ceresin, cera microcristallina and paraffinum liquidum, advantageously 8 to 12 wt.-%, in particular 9 to 11 wt.-% ceresin, d.) less than 1 wt.-% water, and e.) less than 0.1 wt.-% of each of cholesterol and lanolin alcohol.
    Type: Application
    Filed: January 29, 2019
    Publication date: February 11, 2021
    Inventors: Felix KRAUSE-KYORA, Susanne SCHEIDWEILER, Alexander FILBRY, Daniel RICHTER
  • Publication number: 20200398374
    Abstract: The invention concerns a method and an apparatus for processing an object (1) by means of interfering laser beams. It is the task of the invention to provide for an improved compensation of the aberrations accumulated over the beam path in such processes/apparatuses, since these are a substantial disturbing factor with respect to the precision in structuring the material. Furthermore, the influence of the period course, i.e. the spatial modulation of the period of the modification produced in the material of the object (1), shall be improved. The invention proposes that laser radiation is generated as a collimated laser beam (3). The intensity distribution and/or the phase progression is influenced over the cross-section of the laser beam (3) to correct aberrations. The laser beam (3) is divided into two partial beams (6, 7). Finally, the partial beams (6, 7) are deflected and focused so that the partial beams (6, 7) overlap in a processing zone (10) in the material of the object (1).
    Type: Application
    Filed: March 7, 2019
    Publication date: December 24, 2020
    Applicants: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V., Friedrich-Schiller-Universität Jena
    Inventors: Malte Per SIEMS, Stefan NOLTE, Daniel RICHTER, Ria KRÄMER, Thorsten Albert GOEBEL
  • Publication number: 20200357763
    Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Inventors: Glenn Rinne, Daniel Richter
  • Patent number: 10832921
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: November 10, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Patent number: 10734343
    Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: August 4, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Glenn Rinne, Daniel Richter
  • Publication number: 20200176653
    Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.
    Type: Application
    Filed: June 21, 2018
    Publication date: June 4, 2020
    Inventors: Daniel RICHTER, Sven WEBER-RABSILBER
  • Publication number: 20200122916
    Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.
    Type: Application
    Filed: October 19, 2018
    Publication date: April 23, 2020
    Applicant: Altria Client Services LCC
    Inventors: Stephen Bellamah, Daniel Richter
  • Patent number: 10622494
    Abstract: An optoelectronic component includes a housing body comprising a mounting face and a leadframe embedded into the housing body. The leadframe comprises a first and a second leadframe section, wherein the leadframe sections each comprise a contact region and a terminal region. While the contact regions are exposed at the mounting face, the terminal regions project laterally from the housing body. The housing body is completely enclosed by a molding material, wherein the terminal regions are not enclosed by the molding material.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: April 14, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Richter, Daniel Wiener
  • Publication number: 20200090975
    Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.
    Type: Application
    Filed: January 24, 2018
    Publication date: March 19, 2020
    Inventors: Daniel Richter, Gunnar Petersen, Konrad Wagner
  • Publication number: 20200049157
    Abstract: A peripheral, such as a cooling fan or LED strip, is illuminated with addressable LEDs, which allow interactive control of the LEDs from a connected controller to create variable lighting effects. The fan can receive power and control signals from a controller, such as a motherboard and associated microprocessor within a host electronic device. The controller output may be based upon event data received from a host electronic device, such as system or application information relayed by a driver installed in a personal computer. The lighting can, amongst other things, convey status of temperature, load, and/or access to components of a personal computer. The fan may also indicate, e.g., queued email or instant messages, by utilizing the LEDs to display associated lighting and effects.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Inventor: Paul Daniel Richter
  • Patent number: 10538349
    Abstract: A display carton is disclosed, which includes a tray portion, the tray portion including a back panel, a bottom panel, a front panel, an inside front panel, a right back gusset panel, a left back gusset panel, a right side wall panel, a left side wall panel, a right front gusset panel, and a left front gusset panel; a display portion, the display portion including an extension panel, a display panel, and a top panel, the top panel foldably connected along a fold line to the back panel of the tray portion; and a removable front panel portion foldably connected along a fold line to the inside front panel.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: January 21, 2020
    Assignee: Altria Client Services LLC
    Inventors: Christopher J. Hession, Daniel Richter
  • Publication number: 20200020349
    Abstract: Apparatus for post-processing an audio signal, including: a converter for converting the audio signal into a time-frequency representation; a transient location estimator for estimating a location in time of a transient portion using the audio signal or the time-frequency representation; and a signal manipulator for manipulating the time-frequency representation, wherein the signal manipulator is configured to reduce or eliminate a pre-echo in the time-frequency representation at a location in time before the transient location or to perform a shaping of the time-frequency representation at the transient location to amplify an attack of the transient portion.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Inventors: Sascha DISCH, Christian UHLE, Patrick GAMPP, Daniel RICHTER, Oliver HELLMUTH, Jürgen HERRE, Peter PROKEIN, Antonios KARAMPOURNIOTIS, Julia HAVENSTEIN