Abstract: In an embodiment an optoelectronic lighting device at least one optoelectronic light source configured to generate light, at least one conversion system configured to convert the light into converted light, a thermally conductive substrate, wherein the conversion system is arranged on the substrate for heat dissipation, wherein the light source is also arranged on the substrate above the conversion system or laterally next to the conversion system, and a mirror coating arranged above the light source, wherein the mirror coating is transparent to the converted light and/or reflective to the light, wherein the conversion system includes a polymer matrix material in which a converter material and particles, which are substantially transparent to a wavelength of the converted light, are embedded, and which have a thermal conductivity which is at least 20 times higher than a thermal conductivity of the polymer matrix material.

Abstract: The present invention generally relates to the field of skin care. More particularly, the invention relates to a cosmetic or therapeutic skin care composition comprising live bacteria of at least one Cutibacterium acnes (C. acnes) strain in combination with a solubilizer that specifically supports their viability during storage and/or their ability to replicate after application to the skin. Preferably, the cosmetic or therapeutic skin care composition comprises bacteria of at least one C. acnes strain selected from the group consisting of D1, A5, C1, C3, H1, H2, H3, K1, K2, K4, K6, K8, K9, L1, and F4. The invention also provides a method for treating or preventing acne by applying the skin care composition of the invention to a skin area in need of treatment. The invention also relates to the use of a skin care composition of the invention for treating or preventing acne.

Abstract: A semiconductor device comprises a semiconductor layer structure that comprises at least one wide bandgap semiconductor layer; a gate pad on the semiconductor layer structure; and a gate runner that is electrically connected to the gate pad, the gate runner comprising a polysilicon gate runner and a metal gate runner on the polysilicon gate runner opposite the semiconductor layer structure. A gap is provided in the metal gate runner above a first portion of the polysilicon gate runner, where the gap separates the metal gate runner into a first metal gate runner segment and a second metal gate runner segment or separates the first metal gate runner segment from the gate pad.

Abstract: The invention relates to a radiation-emitting component, comprising: a radiation-emitting semiconductor chip, which during operation emits electromagnetic radiation from a radiation-emitting main face and has two electrical contacts, which are arranged on a main face of the radiation-emitting semiconductor chip opposite the radiation-emitting main face, a lead frame with two electrical connection points, each of which has a mounting face, wherein at least one mounting face is delimited by a wall each electrical contact of the radiation-emitting semiconductor chip is applied to a mounting face, and the radiation-emitting semiconductor chip protrudes beyond the wall. Additionally described are a method for producing a radiation-emitting component and a module comprising a radiation-emitting component.

Abstract: A semiconductor device includes a semiconductor die, and a bond pad on the semiconductor die, the bond pad comprising a bond layer, and a structural support layer between the bond layer and the semiconductor die. The bond layer has a first hardness and the structural support layer has a second hardness that is greater than the first hardness. A semiconductor device according to some embodiments includes a semiconductor die, and a bond pad on the semiconductor die. The bond pad includes a seed layer and two or more support/bond layer pairs on the seed layer, wherein each support/bond layer pair includes a structural support layer and a bond layer on the structural support layer. Each bond layer in a support/bond layer pair has a first hardness and each structural support layer in a support/bond layer pair has a second hardness that is greater than the first hardness.

Abstract: An optoelectronic component comprises a field effect transistor that is implemented in a first die and has a source and a sink. The field effect transistor is implemented as a floating-gate transistor with a control electrode and an isolated gate electrode. The optoelectronic component further comprises a light diode that is implemented in a second die and has an anode and a cathode. The second die is arranged on an upper side of the first die. The light diode and a channel of the field effect transistor are electrically connected in series.

Abstract: An audio encoder is disclosed for providing an encoded representation of an audio information encodes a sequence of audio frames. The audio encoder provides one or more immediate playout frames including a representation of a current audio frame, preceding the current audio frame. The audio encoder provides the representations of the current frame and of the one or more audio frames preceding the current audio frame, such that these representations are decodable using a same decoder configuration. The audio encoder provides the representations of the one or more audio frames preceding the current audio frame, which are included into the immediate playout frame, using a modified encoding functionality, which encodes an audio frame using a smaller number of bits than a normal encoding functionality, which is used for the encoding of the current audio frame.

Abstract: A semiconductor device comprises a semiconductor layer structure, a gate pad on the semiconductor layer structure, and a metal gate runner on the semiconductor layer structure. The metal gate runner comprises an inner gate runner that comprises a first inner segment and a second inner segment that interconnect at a first oblique angle.

Abstract: A power semiconductor device includes a semiconductor structure comprising an active region, an encapsulation material on the semiconductor structure, and a plurality of adhesion features in or on the semiconductor structure along an interface with the encapsulation material. The interface is laterally between the active region and at least one edge of the semiconductor structure. Related devices and fabrication methods are also discussed.

Abstract: A semiconductor device according to some embodiments includes a semiconductor die, and a bond pad on a first side of the semiconductor die for receiving a wire bond. The bond pad includes a discontinuous uppermost surface opposite the first side of the semiconductor die.

Abstract: A cosmetic or therapeutic skin care composition comprising live bacteria of at least one Cutibacterium acnes (C. acnes) strain in combination with a preservative that specifically supports their viability during storage and/or their ability to replicate after application to the skin. Preferably, the cosmetic or therapeutic skin care composition comprises bacteria of at least one C. acnes strain selected from the group consisting of D1, A5, C1, C3, H1, H2, H3, K1, K2, K4, K6, K8, K9, L1, and F4. The skin care composition is suitable for treating or preventing acne.

Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.

Abstract: Cosmetic product of a packaging means having two spatially separated chambers, wherein the first chamber contains a lyophilisate of bacteria of the strains C. acnes 6609 (H1), C1, C3, D1, A5, H1, H2, H3, K1, K2, K4, K6, K8, K9, L1 and/or F4, and the second chamber contains a cosmetic preparation containing water and a method for treating acne with this preparation.

Abstract: Semiconductor devices comprise a semiconductor layer structure having an active region therein, a gate pad on the semiconductor layer structure and positioned to be closest to a first side of the active region, a plurality of gate electrodes, and a metal gate runner that electrically connects the gate pad to at least some of the gate electrodes. The metal gate runner comprises an outer runner that extends around a portion of a periphery of the active region. The outer gate runner comprises a first outer segment that extends along at least a portion of the first side of the active region and a second outer segment that extends along at least a portion of a second side of the active region that connects to the first side, but the outer gate runner does not extend along a third side of the active region that is opposite the second side.

Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.

Abstract: The present invention generally relates to the field of skin care. More particularly, the invention relates to a cosmetic or therapeutic skin care composition comprising live bacteria of at least one Cutibacterium acnes (C. acnes) strain in combination with a preservative that specifically supports their viability during storage and/or their ability to replicate after application to the skin. Preferably, the cosmetic or therapeutic skin care composition comprises bacteria of at least one C. acnes strain selected from the group consisting of D1, A5, C1, C3, H1, H2, H3, K1, K2, K4, K6, K8, K9, L1, and F4. The invention also provides a method for treating or preventing acne by applying the skin care composition of the invention to a skin area in need of treatment. The invention also relates to the use of a skin care composition of the invention for treating or preventing acne.

Abstract: The invention relates to an optoelectronic module including a semiconductor component designed to emit electromagnetic radiation; a distribution structure having a plurality of distribution elements, at least one input waveguide and a plurality of output waveguides; and a plurality of conversion structures. The electromagnetic radiation emitted by the semiconductor component enters the distribution structure through the input waveguide. The electromagnetic radiation exits the distribution structure through the output waveguide. One conversion structure is arranged downstream of each output waveguide. The invention also relates to a method for operating an optoelectronic module.

Abstract: In an embodiment a method includes providing a moldable substrate, applying at least one semiconductor chip to a first main surface of the moldable substrate, introducing the semiconductor chip into the moldable substrate by deforming the moldable substrate such that the semiconductor chip is embedded into the moldable substrate proceeding from the first main surface, wherein at least one electrical contact of the semiconductor chip is freely accessible from an outside, wherein the semiconductor chip is a radiation-emitting flip-chip, and wherein a radiation exit surface of the flip-chip is free of electrical contacts, providing a carrier having at least one electrical connection location on a first main surface and applying the carrier to the first main surface of the moldable substrate after introducing the semiconductor chip into the moldable substrate such that the at least one electrical contact of the semiconductor chip is electrically contacted with the electrical connection location.

Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Abstract: An optoelectronic component includes a carrier, at least one optoelectronic semiconductor chip, which is arranged on the carrier, and a housing which comprises a molded body. The housing at least partially surrounds the optoelectronic semiconductor chip. A reflective layer is arranged on at least one side surface of the optoelectronic semiconductor chip, and the carrier includes vias.