Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.

Abstract: Apparatus for post-processing an audio signal, including: a converter for converting the audio signal into a time-frequency representation; a transient location estimator for estimating a location in time of a transient portion using the audio signal or the time-frequency representation; and a signal manipulator for manipulating the time-frequency representation, wherein the signal manipulator is configured to reduce or eliminate a pre-echo in the time-frequency representation at a location in time before the transient location or to perform a shaping of the time-frequency representation at the transient location to amplify an attack of the transient portion.

Abstract: A component for a display device, a display device and a method for operating the display device, a computer program and a storage medium are disclosed. The component comprises LED chips arranged in rows, wherein one red, one green and one blue LED chip are arranged alternately per row in the extension direction of the respective row and per column obliquely to the extension direction, and the rows have an offset from one another in the extension direction.

Abstract: A method for operating a visual display apparatus is specified. The apparatus comprises a first optoelectronic semiconductor component configured to emit electromagnetic radiation of a first wavelength and comprising a first intrinsic switch-on delay. The apparatus comprises a second optoelectronic semiconductor component configured to emit electromagnetic radiation of a second wavelength and comprising a second intrinsic switch-on delay. The second wavelength is different from the first wavelength. The first semiconductor component is operated with a first operating current according to a first actuation signal. The second semiconductor component is operated with a second operating current according to a second actuation signal.

Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

Abstract: A container includes a base and a cap that engages a portion of the base. The base has a body portion and a neck portion, where the neck portion defines an open end. The cap has a housing and a hinged lid. The housing defines an open cavity in the cap, and the neck portion extends into the open cavity. The hinged lid is movable between an open position providing access to the cavity and a closed portion sealing the cavity.

Abstract: In an embodiment an optoelectronic sensor arrangement includes a carrier substrate, an illuminating device, a frequency-selective optical element and a photodetector, wherein the illuminating device and the photodetector form a stacked arrangement on or with the carrier substrate, wherein the frequency-selective optical element is arranged between the illuminating device and the photodetector, wherein the photodetector is arranged in a cavity of the carrier substrate which is covered by the illuminating device and/or the frequency-selective optical element, and wherein the frequency-selective optical element includes a divider mirror and an optical filter.

Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

Abstract: The invention relates to a method for producing an optical component (1) by means of laser radiation. The object of the invention is that of providing a method that is improved compared with the prior art, which method allows for the correction of deviations of the optical functionality of the component from specified target parameters. For this purpose, the method according to the invention comprises the following method steps: generating a structure in the material of the component (1) which gives the component (1) an optical functionality, and modifying the refractive index in the material of the component (1) by means of laser beams in a pre- and/or post-processing step, i.e. before or after the generation of the structure, in order to correct deviations of the optical functionality of the component (1) from specified target parameters.

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

Abstract: A light emitting cell for use as a pixel, the light emitting cell being configured to generate the three primary colors and to form different color tones therewith, comprising: a light emitting front surface, a rear surface, and a substrate arranged between the front and rear surface; a light source carried by the substrate; three luminous sections, comprising a blue luminous section, a light converting red luminous section, and a light converting green luminous section; and a primary color selection device capable of performing a repetitive movement at a certain frequency so that, during this movement, one of the luminous sections is alternately selected as a potential light emitting section, characterized in that the primary color selection device is a single mechanical component that serves to select all three luminous sections.

Abstract: In an embodiment an optoelectronic sensor includes a radiation-emitting semiconductor region, a radiation-detecting semiconductor region, a first polarization filter arranged above the radiation-emitting semiconductor region and including a first polarization direction and a second polarization filter arranged above the radiation-detecting semiconductor region and including a second polarization direction, wherein the first polarization direction and the second polarization direction are perpendicular to each other, wherein a radiation-reflecting or radiation-absorbing layer is arranged on side flanks of the radiation-emitting semiconductor region and/or the radiation-detecting semiconductor region and/or the first polarization filter and/or the second polarization filter.

Abstract: In one embodiment, the optoelectronic component comprises a first emission zone, which emits electromagnetic radiation during operation. Furthermore, the component comprises an optical waveguide with an entrance side facing the first emission zone, a distribution element and with output coupling structures on a side of the distribution element facing away from the first emission zone. The optical waveguide is a simply connected solid body. In a top view of the side of the optical waveguide facing away from the first emission zone, the distribution element completely covers the first emission zone. The output coupling structures are individual, spaced-apart elevations, each of which extends away from the distribution element and comprises an output coupling surface at an end facing away from the distribution element. A structure that is nontransmissive to the radiation of the first emission zone is arranged on the optical waveguide in the region between the output coupling structures.

Abstract: In an embodiment, the display device comprises a light emitting semiconductor chip having a light exit side and a mask layer disposed downstream of the semiconductor chip and comprising a plurality of openings. In the openings, the semiconductor chip is free from the mask layer. A movable cover is made of an opaque material and is configured with a plurality of penetrations for adjusting a radiation characteristic of the semiconductor chip. The penetrations are at least temporarily associated with the openings. A drive unit is provided for moving the cover in the direction parallel to the light exit side.

Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.

Abstract: Cosmetic product of a packaging means having two spatially separated chambers, wherein the first chamber contains a lyophilisate of bacteria of the strains C. acnes 6609 (H1), C1, C3, D1, A5, H1, H2, H3, K1, K2, K4, K6, K8, K9, L1 and/or F4, and the second chamber contains a cosmetic preparation containing water and a method for treating acne with this preparation.

Abstract: In an embodiment a method for manufacturing a printed circuit board with at least one optoelectronic component integrated into the printed circuit board includes arranging the at least one optoelectronic component on a first metal layer, pressing a first electrically insulating layer onto the at least one optoelectronic component and creating at least one recess in the first metal layer and/or the first electrically insulating layer thereby at least partially exposing the at least one optoelectronic component, wherein the first electrically insulating layer comprises a fiber reinforced plastic or a glass fiber fabric.

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.