Abstract: A cooling fan is illuminated by addressable LEDs, which allows interactive control of the LEDs from a connected controller to create variable lighting effects on the fan impeller. The fan may include a frame, an electrical motor, an impeller, and addressable LEDs. The LEDs may be positioned around the periphery of a fan central cavity in which the impeller rotates. The LEDs may be mounted on a flexible circuit substrate that also forms a fan shroud. The addressable LEDs face towards the rotational axis of the motor, and can apply variable illumination of the impeller. The fan can be used to provide cooling to host device components and accessories, such as those related to a personal computer, while also providing interactive, decorative LED lighting and effects and/or conveying information concerning system operation, such as temperature, load, and queued email or instant messages.

Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Abstract: An optoelectronic component includes a housing having a cavity and a bottom, an optoelectronic semiconductor chip arranged on the bottom in the cavity, and a potting body arranged in the cavity, wherein a first region of the potting body has a higher content of filler than a second region of the potting body, and the first region of the potting body adjoins the bottom of the cavity.

Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Abstract: A cylinder for a reciprocating piston system, with a cylinder running surface, which is finished by machining by means of a tool with a geometrically defined cutting edge, wherein the finished cylinder running surface has a multiplicity of pores and/or cavities and is formed from a grey cast iron material with a proportion of the surface area that is taken up by pores of 2 to 10% or is formed from a thermally sprayed layer of iron or a thermally sprayed layer of ceramic with a proportion of the surface area that is taken up by pores of 5 to 25%. A method is also provided for finishing a cylinder in which a cylinder running surface of the cylinder is finished by machining by a tool with a geometrically defined cutting edge such that after the finishing the cylinder surface has a multiplicity of pores and/or cavities.

Abstract: A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

Abstract: An optoelectronic component includes a housing body comprising a mounting face and a leadframe embedded into the housing body. The leadframe comprises a first and a second leadframe section, wherein the leadframe sections each comprise a contact region and a terminal region. While the contact regions are exposed at the mounting face, the terminal regions project laterally from the housing body. The housing body is completely enclosed by a molding material, wherein the terminal regions are not enclosed by the molding material.

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip, wherein the semiconductor chip is arranged on a leadframe section, the leadframe section includes a stiffening structure projecting away laterally from the leadframe section, and the lead-frame section, the stiffening structure and the semiconductor chip are embedded in an electrically insulating housing.

Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

Abstract: A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

Abstract: A cooling fan is illuminated by addressable LEDs, which allows interactive control of the LEDs from a connected controller to create variable lighting effects on the fan impeller. The fan may include a frame, an electrical motor, an impeller, and addressable LEDs. The LEDs may be positioned around the periphery of a fan central cavity in which the impeller rotates. The LEDs may be mounted on a flexible circuit substrate that also forms a fan shroud. The fan can receive power and control signals from a controller, such as a motherboard and associated microprocessor within a host electronic device. The controller output may be based upon event data received from a host electronic device, such as system or application information relayed by a driver installed in a personal computer. The addressable LEDs face towards the rotational axis of the motor, and can apply variable illumination of the impeller.

Abstract: The width of scribe lines may be reduced in semiconductor devices by applying a process technique in which trenches may be formed first from the rear side on the basis of a required width of the corresponding trenches, while subsequently it may be cut into the substrate from the front side on the basis of a reduced thickness of the corresponding saw blades, thereby also enabling a reduction of the scribe line width. Furthermore, contamination of the front side, i.e., of the metallization system, may be reduced, for instance, by performing an optional intermediate cleaning process.

Abstract: A drive system (1) for a harvesting machine has a drive train (4) connected by a coupling device (5) with a drive motor (6). The drive train (4) has a hydrostatic transmission (10) with a variable displacement pump (11) and a hydraulic motor (12) connected in a closed circuit to the pump (11). The hydraulic motor (12) is connected to a feeder device (2). For quickly stopping the feeder device (2), the pump (11) is set to a displacement of zero by an electronic control system (15) and the feeder device (2) is braked by a pressure protection device (40). For a chopper device (3), the hydraulic motor (12) is cut off by the electronic control system (15). The drive train (4) is isolated from the drive motor (6) by uncoupling the coupling device (5) and the pump (11) is set to the maximum displacement volume.

Abstract: A display carton is disclosed, which includes a tray portion, the tray portion including a back panel, a bottom panel, a front panel, an inside front panel, a right back gusset panel, a left back gusset panel, a right side wall panel, a left side wall panel, a right front gusset panel, and a left front gusset panel; a display portion, the display portion including an extension panel, a display panel, and a top panel, the top panel foldably connected along a fold line to the back panel of the tray portion; and a removable front panel portion foldably connected along a fold line to the inside front panel.

Abstract: A method actuates a device for irradiating an object that has at least one target volume to be irradiated and at least one volume to be protected. The method includes defining at least one signal dose value for the volume to be protected and irradiating the object at least one of at least at times and at least in part with hadron irradiation. A dose introduced into the volume to be protected during the irradiation of the object is determined and at least one signal is emitted as soon as the introduced dose exceeds at least one signal dose value in at least one point of the volume to be protected.

Abstract: A radiation phantom device includes at least one movement device for moving at least one first sub-region of the radiation phantom device. The radiation phantom device has, at least one of at times or in regions, radiation properties which are in conformity with a radiation phantom model.