Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.

Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.

Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.

Abstract: Described is a stable cosmetic or dermatological formulation, in particular a wound healing ointment, which comprises a.) 0.8 to 3 wt.-%, in particular 1.2 to 1.8 wt.-% glyceryl stearates, b.) 0.8 to 3 wt.-%, in particular 1.2 to 1.8 wt.-% glyceryl stearates SE, c.) one or more lipids selected from the group of ceresin, cera microcristallina and paraffinum liquidum, advantageously 8 to 12 wt.-%, in particular 9 to 11 wt.-% ceresin, d.) less than 1 wt.-% water, and e.) less than 0.1 wt.-% of each of cholesterol and lanolin alcohol.

Abstract: The invention concerns a method and an apparatus for processing an object (1) by means of interfering laser beams. It is the task of the invention to provide for an improved compensation of the aberrations accumulated over the beam path in such processes/apparatuses, since these are a substantial disturbing factor with respect to the precision in structuring the material. Furthermore, the influence of the period course, i.e. the spatial modulation of the period of the modification produced in the material of the object (1), shall be improved. The invention proposes that laser radiation is generated as a collimated laser beam (3). The intensity distribution and/or the phase progression is influenced over the cross-section of the laser beam (3) to correct aberrations. The laser beam (3) is divided into two partial beams (6, 7). Finally, the partial beams (6, 7) are deflected and focused so that the partial beams (6, 7) overlap in a processing zone (10) in the material of the object (1).

Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Abstract: Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.

Abstract: In an example embodiment, a pack for tobacco articles comprises an inner sleeve, and an outer box comprising front and back covers that allow access to the inner sleeve when the outer box is opened. The inner sleeve can include a front connecting panel pivotally connecting a front wall of the inner sleeve to an inner surface of the front cover and a back connecting panel pivotally connecting a back wall of the inner sleeve to an inner surface of the back cover. A slot in the outer box is configured to allow opening of the outer box by applying pressure against a bottom wall of the inner sleeve.

Abstract: An optoelectronic component includes a housing body comprising a mounting face and a leadframe embedded into the housing body. The leadframe comprises a first and a second leadframe section, wherein the leadframe sections each comprise a contact region and a terminal region. While the contact regions are exposed at the mounting face, the terminal regions project laterally from the housing body. The housing body is completely enclosed by a molding material, wherein the terminal regions are not enclosed by the molding material.

Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

Abstract: A peripheral, such as a cooling fan or LED strip, is illuminated with addressable LEDs, which allow interactive control of the LEDs from a connected controller to create variable lighting effects. The fan can receive power and control signals from a controller, such as a motherboard and associated microprocessor within a host electronic device. The controller output may be based upon event data received from a host electronic device, such as system or application information relayed by a driver installed in a personal computer. The lighting can, amongst other things, convey status of temperature, load, and/or access to components of a personal computer. The fan may also indicate, e.g., queued email or instant messages, by utilizing the LEDs to display associated lighting and effects.

Abstract: A display carton is disclosed, which includes a tray portion, the tray portion including a back panel, a bottom panel, a front panel, an inside front panel, a right back gusset panel, a left back gusset panel, a right side wall panel, a left side wall panel, a right front gusset panel, and a left front gusset panel; a display portion, the display portion including an extension panel, a display panel, and a top panel, the top panel foldably connected along a fold line to the back panel of the tray portion; and a removable front panel portion foldably connected along a fold line to the inside front panel.

Abstract: Apparatus for post-processing an audio signal, including: a converter for converting the audio signal into a time-frequency representation; a transient location estimator for estimating a location in time of a transient portion using the audio signal or the time-frequency representation; and a signal manipulator for manipulating the time-frequency representation, wherein the signal manipulator is configured to reduce or eliminate a pre-echo in the time-frequency representation at a location in time before the transient location or to perform a shaping of the time-frequency representation at the transient location to amplify an attack of the transient portion.

Abstract: What is described is an apparatus for post-processing an audio signal, having: a time-spectrum-converter for converting the audio signal into a spectral representation having a sequence of spectral frames; a prediction analyzer for calculating prediction filter data for a prediction over frequency within a spectral frame; a shaping filter controlled by the prediction filter data for shaping the spectral frame to enhance a transient portion within the spectral frame; and a spectrum-time-converter for converting a sequence of spectral frames having a shaped spectral frame into a time domain.

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip, wherein the semiconductor chip is arranged on a leadframe section, the leadframe section includes a stiffening structure projecting away laterally from the leadframe section, and the leadframe section, the stiffening structure and the semiconductor chip are embedded in an electrically insulating housing.