Abstract: The present invention relates to a two-part epoxy-based structural adhesive composition, comprising a first part and a second part, the first part comprising: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aromatic difunctional epoxy resin having an epoxide equivalent weight of from 400 g/eq to 3000 g/eq, and iii) a shell-core toughening agent; the second part comprising: I) a non-aromatic polyetheramide amine and II) an alicyclic amine. Moreover, the present invention also relates to a method for bonding substrates using the adhesive composition and an article bonded with the cured product of the adhesive composition and use of the composition in assembly of articles.

Abstract: This invention relates to an oil resistant adhesive composition, comprising at least one crystalline polyester polyol; at least one first amorphous aromatic polyester polyol having a glass transition temperature less than 0° C.; at least one second amorphous aromatic polyester polyol having a glass transition temperature greater than or equal to 0° C.; and at least one polyisocyanate. The oil resistant adhesive composition has excellent oil resistance and can be well applied to be used in wearable devices.

Abstract: This invention relates to a light curable composition, comprising at least one acrylate monomer, at least one acrylamide compound, at least one acrylate oligomer, and at least one photoinitiator. The light curable composition of the present invention exhibits excellent elongation property after curing and is suitable to be applied for 3D printing.

Abstract: The present invention relates to a photo-curable liquid optically clear adhesive composition, to a cured adhesive and an article produced therefrom, and to the use thereof.

Abstract: The present invention is directed to a photo-curable composition for use in additive manufacturing, said composition comprising, based on the total weight of the composition: from 10 to 80 wt. % of a) a dispersion of nanosilica particles in epoxy resin, said nanosilica particles having an average particle size (d50) of less than 50 nm, as measured by dynamic light scattering; from 10 to 80 wt. % of b) a toughened epoxy resin comprising i) core shell rubber particles; and, ii) at least one cycloaliphatic epoxy resin; and, from 0.1 to 10 wt. % of c) a photoinitatior, said photoinitator comprising an ionic photoacid generator.

Abstract: This invention relates to a light curable composition, comprising at least one acrylate monomer, at least one acrylamide compound, at least one acrylate oligomer, and at least one photoinitiator. The light curable composition of the present invention exhibits excellent elongation property after curing and is suitable to be applied for 3D printing.

Abstract: The present invention provides a photo-curable adhesive composition for display panel assembly comprising a) at least one polyurethane acrylate having Tg value from ?70 to 20° C.; b) at least one (meth)acrylate monomer; c) at least one chain transfer agent; d) at least two thixotropy agents, wherein first thixotropy agent is selected from the group consisting of hydrophobic fumed silica, hydrophilic fumed silica and mixtures thereof and second thixotropy agent is selected from the group consisting of modified urea, polyhydroxycarboxylic acid esters and mixtures thereof; e) at least one photoinitiator; f) at least one plasticizer; and g) at least one defoamer. The photo-curable adhesive composition according to the present invention can be used in bonding two transparent substrates together or in bonding one transparent substrate and one opaque substrate together. Furthermore, the composition according to the present invention can be used in a process of making an optical assembly.

Abstract: Disclosed is an adhesive composition, comprising: (A) a silane terminated oligomer; (B) a (meth)acrylate monomer; (C) optionally a (meth)acrylate oligomer; (D) a photoinitiator; and (E) optionally an organometallic catalyst. The adhesive composition is both ultraviolet curable and moisture curable. Also disclosed is a method of applying the adhesive composition, comprising: (i) coating the adhesive onto the substrate to be bonded; (ii) laminating or stacking the substrate to be bonded to form an assembly; (iii) irradiating the assembly by ultraviolet irradiation; and (iv) placing the assembly under the room temperature. The adhesive composition is useful in display panels, touch panels and optical devices.

Abstract: A process for binding a top substrate to a base substrate is disclosed, in which (a) a liquid optically clear photo-curable adhesive is applied onto the top side of the base substrate, (b) the liquid optically clear photo-curable adhesive is partially cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm, (c) the top substrate is attached on the partially cured adhesive layer of step (b), (d) the adhesive is fully cured by exposure to electromagnetic radiation comprising a wavelength ranging from 200 nm to 700 nm.

Abstract: The present invention provides a dual-curable adhesive composition, comprising: component (a): an epoxy resin; at least one selected from component (b) and component (c), wherein component (b) is a (meth)acrylate monomer, and component (c) is an oligomer containing a (meth)acryloxy group; component (d): a thermal polymerization catalyst which catalyzes the thermal polymerization reaction of component (a); and component (e): a photo polymerization initiator which initiates the photo polymerization reaction of component (a) and at least one selected from component (b) and component (c), wherein component (e) is a mixture of a cationic photo polymerization initiator and a radical photo polymerization initiator. The dual-curable adhesive composition of the present invention is used for bonding or laminating a transparent substrate with another transparent substrate, or bonding or laminating a transparent substrate with a non-transparent substrate.

Abstract: The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.

Abstract: The present invention provides a photo-curable adhesive composition for display panel assembly comprising a) at least one polyurethane acrylate having Tg value from ?70 to 20° C.; b) at least one (meth)acrylate monomer; c) at least one chain transfer agent; d) at least two thixotropy agents, wherein first thixotropy agent is selected from the group consisting of hydrophobic fumed silica, hydrophilic fumed silica and mixtures thereof and second thixotropy agent is selected from the group consisting of modified urea, polyhydroxycarboxylic acid esters and mixtures thereof; e) at least one photoinitiator; f) at least one plasticizer; and g) at least one defoamer. The photo-curable adhesive composition according to the present invention can be used in bonding two transparent substrates together or in bonding one transparent substrate and one opaque substrate together. Furthermore, the composition according to the present invention can be used in a process of making an optical assembly.

Abstract: The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.

Abstract: The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of ?160° C., preferably, from 160° C. to 260° C., more preferably from 240° C. to 250° C.

Abstract: The present invention relates to a photo-curable liquid optically clear adhesive composition, to a cured adhesive and an article produced therefrom, and to the use thereof.

Abstract: The present invention relates to a solder paste composition, a solder paste and a soldering flux. The soldering flux comprises a resin, a thixotropic agent, an activator, a solvent as well as a long-chain thiol and/or an organic chelating agent.

Abstract: A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.

Abstract: The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.

Abstract: Liquid optically clear photo-curable adhesive for display application A process for reworking an optical assembly and a liquid optically clear photo-curable adhesive, which comprises: (a) 10 to 50 wt % of an urethane acrylate, (b) 30 to 70 wt % of plasticizer, (c) 0.002 to 5 wt % of photo initiator, (d) 1 to 30 wt % of acrylate monomer are described.

Abstract: The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.