Patents by Inventor Darren A. Janzig
Darren A. Janzig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240100323Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 11890484Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.Type: GrantFiled: December 21, 2022Date of Patent: February 6, 2024Assignee: MEDTRONIC, INC.Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
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Patent number: 11872392Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.Type: GrantFiled: November 29, 2021Date of Patent: January 16, 2024Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 11752351Abstract: Seals used within lead bores of implantable medical devices for creating a seal to implantable medical leads inserted into the lead bores include a cylinder that engages the lead body. The length of contact of the cylinder to the lead body is at least 0.010? long while average contact pressure is no greater than (10 pounds per inch)/(contact length). Adequate electrical isolation is achieved, even when a debris particle is present between the inner cylinder and the lead body while insertion force remains acceptable.Type: GrantFiled: September 23, 2019Date of Patent: September 12, 2023Assignee: MEDTRONIC, INC.Inventors: Richard T. Stone, Michael T. Hegland, Darren A. Janzig, Dale F. Seeley, Sean P. Skubitz, Ryan Davis, Salil M. Vaidya
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Patent number: 11666767Abstract: A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.Type: GrantFiled: April 13, 2017Date of Patent: June 6, 2023Assignee: Medtronic, Inc.Inventors: Darren Janzig, Robert J. Davies, Seth M. Humphrys, Richard T. Stone
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Publication number: 20230127724Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.Type: ApplicationFiled: December 21, 2022Publication date: April 27, 2023Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
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Publication number: 20230109958Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.Type: ApplicationFiled: November 4, 2022Publication date: April 13, 2023Inventors: Niall DUFFY, Marian LALLY, Philip HAARSTAD, Frank HAREWOOD, Igor KOVALSKY, Jason QUILL, Daniel GELFMAN, Ana MENK, Darren JANZIG, Shyam GOKALDAS, Kenneth Dale WARNOCK, JR.
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Patent number: 11588213Abstract: Implantable medical devices that include a battery to power circuitry utilize a battery connector to electrically interconnect the battery to the circuitry. The battery connector may be mounted directly to a device housing to have the battery connector a fixed position within the device. Battery terminals of the battery are electrically connected to terminals on the battery connector, and the terminals on the battery connector are electrically connected to power terminals of the circuitry. The battery connector may include various features such as mounting grooves formed in a connector body, tapered pins to connect to power terminals on a circuit board, as well as plates to engage the battery terminals. The device housing may provide mounting features that allow the battery connector to be affixed directly to the device housing.Type: GrantFiled: May 3, 2021Date of Patent: February 21, 2023Assignee: MEDTRONIC, INC.Inventors: Steven Deininger, Jeffrey Clayton, Randy Roles, Darren Janzig, Paul Eichstaedt
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Patent number: 11559695Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.Type: GrantFiled: December 17, 2019Date of Patent: January 24, 2023Assignee: MEDTRONIC, INC.Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
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Patent number: 11559694Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.Type: GrantFiled: July 10, 2019Date of Patent: January 24, 2023Assignee: MEDTRONIC, INC.Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Publication number: 20230009502Abstract: A electrical contact for coupling a contact of a medical lead with electronics of a medical device including a contact member having a ring shaped wall defined by a ring inner diameter and ring outer diameter, a housing having a ring shape defining an opening therein, the opening configured to receive the medical lead therein, wherein the housing is defined in part by a housing longitudinal axis and a housing inner diameter, the contact member having at least one deflectable finger extending from the ring shaped wall into a contact opening defined by the ring inner diameter of the ring shaped wall, wherein the finger extends to a distal end and has side edges, the side edges of the finger disposed at respective angles relative to the housing longitudinal axis.Type: ApplicationFiled: June 22, 2022Publication date: January 12, 2023Inventors: Damian M. Becker, Bernard Q. Li, Darren A. Janzig, Thomas J. Conway
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Patent number: 11491339Abstract: Seals used within lead bores of implantable medical devices for creating a seal to implantable medical leads inserted into the lead bores include an inner cylinder that engages the lead body. The inner cylinder is surrounded by a gap to either an outer cylinder of the seal or to surrounding structures of the implantable medical device. The inner cylinder has freedom of movement within the gap such that movement of the lead body that is off-axis relative to a centerline of the lead bore causes movement of the inner cylinder that is providing the seal. In this manner, the seal engagement to the lead body is maintained during this off-axis movement of the lead body.Type: GrantFiled: April 26, 2019Date of Patent: November 8, 2022Assignee: MEDTRONIC, INC.Inventors: Steven T. Deininger, Jeffrey Clayton, Thomas M. Hillebrand, Jenna George, Bin Wang, Michael T. Hegland, Darren A. Janzig, Sean P. Skubitz, Richard T. Stone, Dale F. Seeley, Salil M. Vaidya
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Patent number: 11491036Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.Type: GrantFiled: April 9, 2021Date of Patent: November 8, 2022Assignee: MEDTRONIC VASCULAR GALWAYInventors: Niall Duffy, Marian Lally, Philip Haarstad, Frank Harewood, Igor Kovalsky, Jason Quill, Daniel Gelfman, Ana Menk, Darren Janzig, Shyam Gokaldas, Kenneth Dale Warnock, Jr.
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Patent number: 11426514Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.Type: GrantFiled: September 9, 2019Date of Patent: August 30, 2022Assignee: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
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Publication number: 20220080188Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.Type: ApplicationFiled: November 29, 2021Publication date: March 17, 2022Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 11213673Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.Type: GrantFiled: November 29, 2016Date of Patent: January 4, 2022Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 11154721Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.Type: GrantFiled: April 22, 2020Date of Patent: October 26, 2021Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
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Patent number: 11154713Abstract: An implantable segmented electrode structure may be configured to conduct electrical signals between elongated conductors of an implantable medical lead and respective portions of tissue of a patient. The implantable medical lead may extend from an implantable medical device that is implanted within the patient. The segmented electrode structure includes a plurality of separate electrode surfaces. The electrode surfaces are at a plurality of different axial positions and angular positions within the implantable segmented electrode structure. The segmented electrode structure additionally includes a plurality of prongs. The prongs extend axially from a proximal end of the segmented electrode structure through the segmented electrode structure. Each prong may electrically connect to one of the electrode surfaces. The prongs may terminate distally at respective electrode surfaces. Each prong may be configured to electrically connect to one of the elongated conductors.Type: GrantFiled: October 13, 2017Date of Patent: October 26, 2021Assignee: Medtronic, Inc.Inventors: Richard T. Stone, Robert J. Davies, Seth M. Humphrys, Darren A. Janzig
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Publication number: 20210290375Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.Type: ApplicationFiled: April 9, 2021Publication date: September 23, 2021Inventors: Niall DUFFY, Marian LALLY, Philip HAARSTAD, Frank HAREWOOD, Igor KOVALSKY, Jason QUILL, Daniel GELFMAN, Ana MENK, Darren JANZIG, Shyam GOKALDAS, Kenneth Dale WARNOCK, JR.
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Patent number: 11110284Abstract: A medical device lead connection assembly includes an end connector element including a plurality of fixed connection element tabs extending from the end connector element to a tab distal end. A lead body includes a plurality of lead filars extending through the lead body and coupled to a corresponding fixed connection tab. A tubular guide hub extends from a hub proximal end to a hub distal end. The tubular guide hub includes a plurality of guide elements circumferentially disposed about an outer surface of the guide hub. The hub distal end is disposed within the lead body and the hub proximal end received within connection element tabs, and selected guide elements contact selected lead filars.Type: GrantFiled: April 13, 2017Date of Patent: September 7, 2021Assignee: Medtronic, Inc.Inventors: Darren Janzig, Robert J. Davies, Seth M. Humphrys, Richard T. Stone