Patents by Inventor Darren A. Janzig

Darren A. Janzig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9162072
    Abstract: An implantable medical device with lubricious material permits implantable medical devices to have a reduced friction between the device and at least a portion of the surrounding tissue. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the tissue. The lubricious material may be provided on or impregnated in the housing or the member. In some embodiments, the device is configured for implantation in the head of a human body. In other embodiments, the device is configured for implantation between the cranium and the scalp. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled together to provide a smaller profile.
    Type: Grant
    Filed: September 25, 2006
    Date of Patent: October 20, 2015
    Assignee: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson, Erik R. Scott, James E. Randall
  • Publication number: 20150250997
    Abstract: A method of forming a medical device contact element includes annealing an elongated rod of Ti-15Mo alloy material to form an annealed rod having a Young's Modulus of less than 13.5 Mpsi and an elastic range or strain of at least 0.7%. Then forming a contact ring element from the annealed rod and assembling the contact ring element into a medical device. Contact rings and lead receptacles including the same are also described.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 10, 2015
    Inventors: Bernard Q. Li, Alan Shi, Daniel D. Sorensen, Darren A. Janzig, Margaret Bush
  • Patent number: 9095728
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: August 4, 2015
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Publication number: 20150119964
    Abstract: This disclosure includes techniques for securing the proximal ends of a medical lead to the connector block of an IMD with a fastener device that incorporates a flexible clamp. A fastener device for a medical device comprising a flexible clamp forming a clamp aperture, wherein the flexible clamp includes a clamp protrusion configured to facilitate actuation of the flexible clamp, a rigid body, wherein the rigid body connects to and surrounds the flexible clamp, and an actuator configured to actuate on the clamp protrusion to change a perimeter of the clamp aperture, wherein the change of the perimeter of the clamp aperture by the actuator is configured to apply a compressive force about a perimeter of an electrical contact of a medical lead in the clamp aperture to electrically and mechanically connect the medical lead to the fastener device.
    Type: Application
    Filed: October 25, 2013
    Publication date: April 30, 2015
    Applicant: Medtronic, Inc.
    Inventor: Darren A. Janzig
  • Publication number: 20150094789
    Abstract: A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.
    Type: Application
    Filed: March 12, 2013
    Publication date: April 2, 2015
    Inventors: Darren A. Janzig, Gerald Lindner, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf
  • Publication number: 20150080995
    Abstract: A medical lead may be fabricated using an electrode fixture ((130A)-(130D)) configured to facilitate circumferential and axial alignment between electrodes of the lead. In one example, a method includes positioning an electrode fixture around at least one conductor of a plurality of conductors (122) for a medical lead, wherein the electrode fixture at least partially retains an electrode assembly. The method also includes electrically coupling a portion of the at least one conductor with at least a portion of the electrode assembly at an attachment area defined by the electrode assembly when the electrode assembly is at least partially retained by the electrode fixture.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 19, 2015
    Applicant: Medtronic, Inc.
    Inventors: Dale Seeley, Evan Gustafson, Michael Hegland, Seth Humphrys, Darren Janzig, Gerald Lindner
  • Publication number: 20140343644
    Abstract: In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a substrate and a coating on an outer surface of the substrate, wherein the lead wire is formed of a composition comprising titanium or titanium alloys, wherein the substrate is formed of a composition comprising one or more of titanium, tantalum, niobium, and alloys thereof, wherein the coating comprises at least one of Pt, TiN, IrOx, and poly(dioctyl-bithiophene) (PDOT). In some examples, the lead wire may be coupled to the lead wire via a weld, such as, e.g., a laser weld.
    Type: Application
    Filed: March 12, 2014
    Publication date: November 20, 2014
    Applicant: Medtronic, Inc.
    Inventors: Alan Shi, Darren A. Janzig, Bernard Q. Li, Richard T. Stone, Dale F. Seeley, Peng Cong
  • Publication number: 20140331475
    Abstract: Devices, systems, and methods for crimping a medical device are disclosed. More specifically, the present disclosure relates to devices, systems, and methods for reducing the diameter of a collapsible heart valve prosthesis to be loaded onto a delivery device. The devices, systems, and methods using at least one funnel to crimp the heart valve prosthesis and load it onto the delivery system.
    Type: Application
    Filed: May 8, 2014
    Publication date: November 13, 2014
    Applicant: Medtronic Vascular Galway
    Inventors: Niall Duffy, Marian Creaven, Philip Haarstad, Frank Harewood, Igor Kovalsky, Jason Quill, Daniel Gelfman, Ana Menk, Darren Janzig, Shyam Gokaldas, Kenneth Warnock
  • Publication number: 20140277218
    Abstract: An implantable active medical device includes a hermetic housing defining an exterior surface and a hermetic cavity of an implantable active medical device. The hermetic housing has a first major surface, an opposing second major surface and a side surface extending between them. An elongate lead connector is recessed into the first major surface. The elongate lead connector has a top surface and a bottom surface and a side surface extending between them. The top surface forms only a portion of the first major surface.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: MEDTRONIC, INC.
    Inventor: Darren A. Janzig
  • Publication number: 20140277217
    Abstract: An implantable active medical device includes a hermetic housing defining an exterior surface and a hermetic cavity of an implantable active medical device. An elongate lead connector extends into the hermetic cavity. The elongate lead connector includes a closed end, an open end extending through and hermetically joined to the hermetic housing, an outer surface at least partially defining the hermetic cavity, and an inner surface defining a lead aperture.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: MEDTRONIC, INC.
    Inventor: Darren A. Janzig
  • Publication number: 20140277216
    Abstract: An implantable active medical device includes a chassis plate and a first and second elongate lead connector fixed to and extending orthogonally away from the chassis plate in opposing directions. The first and second elongate lead connectors are disposed within hermetic housings.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: MEDTRONIC, INC.
    Inventor: Darren A. Janzig
  • Publication number: 20140243942
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.
    Type: Application
    Filed: May 5, 2014
    Publication date: August 28, 2014
    Applicant: MEDTRONIC, INC.
    Inventors: John E. Kast, Darren A. Janzig, Christopher J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 8751002
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: June 10, 2014
    Assignee: Medtronic, Inc.
    Inventors: John E. Kast, Darren A. Janzig, Christopher J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Patent number: 8666497
    Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: March 4, 2014
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith A. Miesel, James E. Cabak
  • Patent number: 8525027
    Abstract: An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: September 3, 2013
    Assignee: Medtronic, Inc.
    Inventors: Gerald G. Lindner, Paulette C. Olson, Darren A. Janzig, Chris J. Paidosh
  • Patent number: 8457744
    Abstract: Components of an implantable medical device are arranged to facilitate a low-profile housing. A circuit board within the housing carries integrated circuits and discrete components. In some embodiments, the integrated circuits and discrete components are located on first and second opposing surfaces of the circuit board, respectively. In some embodiments, the implantable medical device is implanted on a cranium of a patient and the housing is concave such that it substantially conforms to the cranium. In such embodiments, the integrated circuits and/or discrete components can be arranged on the circuit board according to height to better conform to the concavity of the housing. In some embodiments, the implantable medical device includes a telemetry coil that is positioned within the housing such that it occupies space that cannot be practically occupied by the circuit board.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: June 4, 2013
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Carl D. Wahlstrand, Paulette C. Olson, Robert M. Skime
  • Publication number: 20130126474
    Abstract: The invention describes a process to remove a recast layer and/or burrs from machining processes to provide a surface of a titanium medical device without dissipation of copper or zinc from the surface of the medical device.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Inventors: Alan Shi, Bernard Q. Li, Daniel D. Sorensen, Darren A. Janzig
  • Patent number: 8397578
    Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: March 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
  • Publication number: 20120124831
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Application
    Filed: January 30, 2012
    Publication date: May 24, 2012
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20120116470
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.
    Type: Application
    Filed: January 25, 2011
    Publication date: May 10, 2012
    Applicant: MEDTRONIC, INC.
    Inventors: John E. KAST, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner