Patents by Inventor Darren A. Janzig

Darren A. Janzig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080177167
    Abstract: A hermetic lead connector assembly includes a hermetic lead connector having an open end, a lead connector outer surface and a lead connector inner surface defining a lead aperture and a rigid sleeve is disposed about the hermetic lead connector outer surface. The hermetic lead connector has one or more electrically conducting contact rings spaced apart by electrically insulating rings. The hermetic lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface. The rigid sleeve has an aperture that exposes a portion of the one or more electrically conducting contact rings.
    Type: Application
    Filed: April 10, 2007
    Publication date: July 24, 2008
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Patent number: 7392089
    Abstract: A modular implantable medical device includes a plurality of modules that are at least partially encapsulated by an overmold. The modules may be connected by coupling modules, which may be flexible to provide for one or more degrees of relative intermodular motion. The overmold may also be flexible. In order to reduce relative intermodule motion to acceptable direction and/or ranges, the overmold may include one or more motion reduction elements.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: June 24, 2008
    Assignee: Medtronic, Inc.
    Inventors: Carl D. Wahlstrand, Darren A. Janzig, Robert M. Skime
  • Publication number: 20080103543
    Abstract: An implantable medical device includes a housing comprising a titanium alloy selected from the group consisting of Ti-4.5Al-3V-2Fe-2Mo-0.15O, Ti-4Al-2.5V-1.5Fe-0.25O, Ti-6Al-2Sn-4Zr-2Mo, Ti-3Al-2.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 1, 2008
    Inventors: Bernard Q. Li, John J. Grevious, Timothy J. Davis, Leroy Perz, Chris J. Paidosh, John E. Kast, Keith A. Miesel, Darren A. Janzig, Gerald G. Lindner
  • Publication number: 20070185539
    Abstract: A modular implantable medical device permits implantable medical devices to have a smaller profile in order to better fit into locations within the human body. A modular implantable medical device separates various functional components of the implantable medical device into a set of interconnected modules. This distributed architecture of a modular implantable medical device may permit the device footprint to be distributed over a larger area while making the profile smaller, and may permit the overall shape of the implantable medical device to better match the body location into which it is to be implanted. An overmold integrates the modules of a modular implantable medical device into a single structure. In some embodiments the overmold is flexible and provides a biocompatible interface from the component modules and the patient, while restraining potentially harmful intermodule motion.
    Type: Application
    Filed: April 16, 2007
    Publication date: August 9, 2007
    Applicant: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren Janzig, Carl Wahlstrand, Robert Skime, Paulette Olson
  • Patent number: 7242982
    Abstract: A modular implantable medical device permits implantable medical devices to have a smaller profile in order to better fit into locations within the human body. A modular implantable medical device separates various functional components of the implantable medical device into a set of interconnected modules. This distributed architecture of a modular implantable medical device may permit the device footprint to be distributed over a larger area while making the profile smaller, and may permit the overall shape of the implantable medical device to better match the body location into which it is to be implanted. An overmold integrates the modules of a modular implantable medical device into a single structure. In some embodiments the overmold is flexible and provides a biocompatible interface from the component modules and the patient, while restraining potentially harmful intermodule motion.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: July 10, 2007
    Assignee: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson
  • Publication number: 20070074732
    Abstract: An implantable medical device with lubricious material permits implantable medical devices to have a reduced friction between the device and at least a portion of the surrounding tissue. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the tissue. The lubricious material may be provided on or impregnated in the housing or the member. In some embodiments, the device is configured for implantation in the head of a human body. In other embodiments, the device is configured for implantation between the cranium and the scalp. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled together to provide a smaller profile.
    Type: Application
    Filed: September 25, 2006
    Publication date: April 5, 2007
    Applicant: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren Janzig, Carl Wahlstrand, Robert Skime, Paulette Olson, Erik Scott, James Randall
  • Publication number: 20050245984
    Abstract: An implantable medical device with lubricious material permits implantable medical devices to have a reduced friction between the device and at least a portion of the surrounding tissue. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the tissue. The lubricious material may be provided on or impregnated in the housing or the member. In some embodiments, the device is configured for implantation in the head of a human body. In other embodiments, the device is configured for implantation between the cranium and the scalp. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled together to provide a smaller profile.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Applicant: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren Janzig, Carl Wahlstrand, Robert Skime, Paulette Olson, Erik Scott, James Randall
  • Publication number: 20050004620
    Abstract: An implantable medical device with anti-infection agent. The implantable medical device may be configured for placement in the head of a patient and for monitoring or treatment of the brain. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the adjacent tissue. The anti-infection agent may be provided on or impregnated in the housing or the member. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled to provide a smaller profile. In some embodiments the implantable medical device may include both anti-infection and lubricious materials.
    Type: Application
    Filed: April 30, 2004
    Publication date: January 6, 2005
    Applicant: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren Janzig, Carl Wahlstrand, Robert Skime, Paulette Olson, Erik Scott, James Randall
  • Publication number: 20040176819
    Abstract: A modular implantable medical device includes a plurality of modules that are at least partially encapsulated by an overmold. The modules may be connected by coupling modules, which may be flexible to provide for one or more degrees of relative intermodular motion. The overmold may also be flexible. In order to reduce relative intermodule motion to acceptable direction and/or ranges, the overmold may include one or more motion reduction elements.
    Type: Application
    Filed: December 9, 2003
    Publication date: September 9, 2004
    Inventors: Carl D. Wahlstrand, Darren A. Janzig, Robert M. Skime
  • Publication number: 20040176815
    Abstract: Components of an implantable medical device are arranged to facilitate a low-profile housing. A circuit board within the housing carries integrated circuits and discrete components. In some embodiments, the integrated circuits and discrete components are located on first and second opposing surfaces of the circuit board, respectively. In some embodiments, the implantable medical device is implanted on a cranium of a patient and the housing is concave such that it substantially conforms to the cranium. In such embodiments, the integrated circuits and/or discrete components can be arranged on the circuit board according to height to better conform to the concavity of the housing. In some embodiments, the implantable medical device includes a telemetry coil that is positioned within the housing such that it occupies space that cannot be practically occupied by the circuit board.
    Type: Application
    Filed: December 9, 2003
    Publication date: September 9, 2004
    Inventors: Darren A. Janzig, Carl D. Wahlstrand, Paulette C. Olson, Robert M. Skime
  • Publication number: 20040176814
    Abstract: A modular implantable medical device permits implantable medical devices to have a smaller profile in order to better fit into locations within the human body. A modular implantable medical device separates various functional components of the implantable medical device into a set of interconnected modules. This distributed architecture of a modular implantable medical device may permit the device footprint to be distributed over a larger area while making the profile smaller, and may permit the overall shape of the implantable medical device to better match the body location into which it is to be implanted. An overmold integrates the modules of a modular implantable medical device into a single structure. In some embodiments the overmold is flexible and provides a biocompatible interface from the component modules and the patient, while restraining potentially harmful intermodule motion.
    Type: Application
    Filed: December 9, 2003
    Publication date: September 9, 2004
    Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson
  • Publication number: 20040176673
    Abstract: At least one surface of an implantable medical device is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4.5 and 9.5 centimeters, and is preferably approximately equal to 7 centimeters. In some embodiments, the implantable medical device comprises a plurality of interconnected modules, and an overmold that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing, and at least one surface of at least one of the housings may be concave along at least one axis.
    Type: Application
    Filed: December 9, 2003
    Publication date: September 9, 2004
    Inventors: Carl D. Wahlstrand, Darren A. Janzig, Ruchika Singhal, Robert M. Skime, Erik R. Scott, James E. Randall
  • Publication number: 20040176816
    Abstract: A modular implantable medical device includes two or more interconnected modules and an overmold that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.
    Type: Application
    Filed: December 9, 2003
    Publication date: September 9, 2004
    Inventors: Ruchika Singhal, Carl D. Wahlstrand, Darren A. Janzig, Robert M. Skime
  • Publication number: 20040172090
    Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.
    Type: Application
    Filed: December 9, 2003
    Publication date: September 2, 2004
    Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith Miesel, James E. Cabak