Patents by Inventor Darren A. Janzig
Darren A. Janzig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8666497Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.Type: GrantFiled: November 9, 2010Date of Patent: March 4, 2014Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith A. Miesel, James E. Cabak
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Patent number: 8525027Abstract: An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.Type: GrantFiled: January 23, 2009Date of Patent: September 3, 2013Assignee: Medtronic, Inc.Inventors: Gerald G. Lindner, Paulette C. Olson, Darren A. Janzig, Chris J. Paidosh
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Patent number: 8457744Abstract: Components of an implantable medical device are arranged to facilitate a low-profile housing. A circuit board within the housing carries integrated circuits and discrete components. In some embodiments, the integrated circuits and discrete components are located on first and second opposing surfaces of the circuit board, respectively. In some embodiments, the implantable medical device is implanted on a cranium of a patient and the housing is concave such that it substantially conforms to the cranium. In such embodiments, the integrated circuits and/or discrete components can be arranged on the circuit board according to height to better conform to the concavity of the housing. In some embodiments, the implantable medical device includes a telemetry coil that is positioned within the housing such that it occupies space that cannot be practically occupied by the circuit board.Type: GrantFiled: December 9, 2003Date of Patent: June 4, 2013Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Carl D. Wahlstrand, Paulette C. Olson, Robert M. Skime
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Publication number: 20130126474Abstract: The invention describes a process to remove a recast layer and/or burrs from machining processes to provide a surface of a titanium medical device without dissipation of copper or zinc from the surface of the medical device.Type: ApplicationFiled: November 21, 2011Publication date: May 23, 2013Inventors: Alan Shi, Bernard Q. Li, Daniel D. Sorensen, Darren A. Janzig
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Patent number: 8397578Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.Type: GrantFiled: June 3, 2010Date of Patent: March 19, 2013Assignee: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
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Publication number: 20120124831Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.Type: ApplicationFiled: January 30, 2012Publication date: May 24, 2012Applicant: MEDTRONIC, INC.Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Publication number: 20120116470Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.Type: ApplicationFiled: January 25, 2011Publication date: May 10, 2012Applicant: MEDTRONIC, INC.Inventors: John E. KAST, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
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Patent number: 8131370Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.Type: GrantFiled: April 10, 2007Date of Patent: March 6, 2012Assignee: Medtronic, IncInventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Patent number: 8086313Abstract: An implantable medical device comprises an anti-infection agent. The implantable medical device may be configured for placement in the head of a patient and for monitoring or treatment of the brain. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the adjacent tissue. The anti-infection agent may be provided on or impregnated in the housing or the member. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled to provide a smaller profile. In some embodiments the implantable medical device may include both anti-infection and lubricious materials.Type: GrantFiled: August 5, 2009Date of Patent: December 27, 2011Assignee: Medtronic, Inc.Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson, Erik R. Scott, James E. Randall
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Publication number: 20110296925Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.Type: ApplicationFiled: June 3, 2010Publication date: December 8, 2011Applicant: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
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Publication number: 20110301575Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.Type: ApplicationFiled: June 3, 2010Publication date: December 8, 2011Applicant: Medtronic, Inc.Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
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Publication number: 20110270330Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.Type: ApplicationFiled: April 18, 2011Publication date: November 3, 2011Applicant: Medtronic, Inc.Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
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Publication number: 20110184480Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.Type: ApplicationFiled: January 25, 2011Publication date: July 28, 2011Applicant: MEDTRONIC, INC.Inventors: John E. Kast, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
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Publication number: 20110184479Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.Type: ApplicationFiled: January 25, 2011Publication date: July 28, 2011Applicant: MEDTRONIC, INC.Inventors: John E. KAST, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
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Publication number: 20110165785Abstract: An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.Type: ApplicationFiled: January 23, 2009Publication date: July 7, 2011Applicant: Medtronic, Inc.Inventors: Gerald G. Lindner, Paulette C. Olson, Darren A. Janzig, Chris J. Paidosh
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Publication number: 20110054563Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.Type: ApplicationFiled: November 9, 2010Publication date: March 3, 2011Applicant: MEDTRONIC, INC.Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith A. Miesel, James E. Cabak
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Patent number: 7848817Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.Type: GrantFiled: December 9, 2003Date of Patent: December 7, 2010Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith A. Miesel, James E. Cabak
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Patent number: 7720538Abstract: An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.Type: GrantFiled: April 10, 2007Date of Patent: May 18, 2010Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Patent number: 7711428Abstract: A hermetic lead connector assembly includes a hermetic lead connector having an open end, a lead connector outer surface and a lead connector inner surface defining a lead aperture and a rigid sleeve is disposed about the hermetic lead connector outer surface. The hermetic lead connector has one or more electrically conducting contact rings spaced apart by electrically insulating rings. The hermetic lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface. The rigid sleeve has an aperture that exposes a portion of the one or more electrically conducting contact rings.Type: GrantFiled: April 10, 2007Date of Patent: May 4, 2010Assignee: Medtronic, Inc.Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
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Patent number: 7711427Abstract: An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.Type: GrantFiled: April 10, 2007Date of Patent: May 4, 2010Assignee: Medtronis, Inc.Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh