Patents by Inventor Darren A. Janzig

Darren A. Janzig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8131370
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: March 6, 2012
    Assignee: Medtronic, Inc
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Patent number: 8086313
    Abstract: An implantable medical device comprises an anti-infection agent. The implantable medical device may be configured for placement in the head of a patient and for monitoring or treatment of the brain. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the adjacent tissue. The anti-infection agent may be provided on or impregnated in the housing or the member. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled to provide a smaller profile. In some embodiments the implantable medical device may include both anti-infection and lubricious materials.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: December 27, 2011
    Assignee: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson, Erik R. Scott, James E. Randall
  • Publication number: 20110296925
    Abstract: The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.
    Type: Application
    Filed: June 3, 2010
    Publication date: December 8, 2011
    Applicant: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
  • Publication number: 20110301575
    Abstract: The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.
    Type: Application
    Filed: June 3, 2010
    Publication date: December 8, 2011
    Applicant: Medtronic, Inc.
    Inventors: Keith A. Miesel, James M. Haase, Chris J. Paidosh, Darren A. Janzig, Timothy J. Denison
  • Publication number: 20110270330
    Abstract: A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
    Type: Application
    Filed: April 18, 2011
    Publication date: November 3, 2011
    Applicant: Medtronic, Inc.
    Inventors: Darren A. Janzig, Andrew J. Thom, Chris J. Paidosh, Brad C. Tischendorf, Gerald G. Lindner
  • Publication number: 20110184480
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: John E. Kast, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Publication number: 20110184479
    Abstract: A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: John E. KAST, Darren A. Janzig, Chris J. Paidosh, Andrew J. Thom, Brad C. Tischendorf, Gerald G. Lindner
  • Publication number: 20110165785
    Abstract: An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.
    Type: Application
    Filed: January 23, 2009
    Publication date: July 7, 2011
    Applicant: Medtronic, Inc.
    Inventors: Gerald G. Lindner, Paulette C. Olson, Darren A. Janzig, Chris J. Paidosh
  • Publication number: 20110054563
    Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.
    Type: Application
    Filed: November 9, 2010
    Publication date: March 3, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith A. Miesel, James E. Cabak
  • Patent number: 7848817
    Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: December 7, 2010
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Mark S. Lent, Keith A. Miesel, James E. Cabak
  • Patent number: 7720538
    Abstract: An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: May 18, 2010
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Patent number: 7711427
    Abstract: An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: May 4, 2010
    Assignee: Medtronis, Inc.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Patent number: 7711428
    Abstract: A hermetic lead connector assembly includes a hermetic lead connector having an open end, a lead connector outer surface and a lead connector inner surface defining a lead aperture and a rigid sleeve is disposed about the hermetic lead connector outer surface. The hermetic lead connector has one or more electrically conducting contact rings spaced apart by electrically insulating rings. The hermetic lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface. The rigid sleeve has an aperture that exposes a portion of the one or more electrically conducting contact rings.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: May 4, 2010
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20100063555
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Application
    Filed: September 8, 2009
    Publication date: March 11, 2010
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Publication number: 20090292327
    Abstract: An implantable medical device comprises an anti-infection agent. The implantable medical device may be configured for placement in the head of a patient and for monitoring or treatment of the brain. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the adjacent tissue. The anti-infection agent may be provided on or impregnated in the housing or the member. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled to provide a smaller profile. In some embodiments the implantable medical device may include both anti-infection and lubricious materials.
    Type: Application
    Filed: August 5, 2009
    Publication date: November 26, 2009
    Applicant: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson, Erik R. Scott, James E. Randall
  • Patent number: 7596408
    Abstract: An implantable medical device with anti-infection agent. The implantable medical device may be configured for placement in the head of a patient and for monitoring or treatment of the brain. The implantable medical device may have a housing or it may have a housing and a member for providing a smooth interface between the device and the adjacent tissue. The anti-infection agent may be provided on or impregnated in the housing or the member. In some embodiments, the device includes a single module while in other embodiments a plurality of modules are coupled to provide a smaller profile. In some embodiments the implantable medical device may include both anti-infection and lubricious materials.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: September 29, 2009
    Assignee: Medtronic, Inc.
    Inventors: Ruchika Singhal, Darren A. Janzig, Carl D. Wahlstrand, Robert M. Skime, Paulette C. Olson, Erik R. Scott, James E. Randall
  • Patent number: 7529586
    Abstract: At least one surface of an implantable medical device is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4.5 and 9.5 centimeters, and is preferably approximately equal to 7 centimeters. In some embodiments, the implantable medical device comprises a plurality of interconnected modules, and an overmold that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing, and at least one surface of at least one of the housings may be concave along at least one axis.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: May 5, 2009
    Assignee: Medtronic, Inc.
    Inventors: Carl D. Wahlstrand, Darren A. Janzig, Ruchika Singhal, Robert M. Skime, Erik R. Scott, James E. Randall
  • Publication number: 20080208279
    Abstract: An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, a power source and electronics in electrical communication and disposed within the sealed housing interior, and a lead connector projecting into the sealed housing interior. The lead connector includes a closed end, an open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics and the lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.
    Type: Application
    Filed: April 10, 2007
    Publication date: August 28, 2008
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20080208278
    Abstract: A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
    Type: Application
    Filed: April 10, 2007
    Publication date: August 28, 2008
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh
  • Publication number: 20080208277
    Abstract: An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, the hermetically sealed housing having a first surface and an opposing second surface. A power source and electronics are in electrical communication and disposed within the sealed housing interior. A lead connector projects through the sealed housing interior from the first surface to the second surface. The lead connector has a first open end, a second open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics. The lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.
    Type: Application
    Filed: April 10, 2007
    Publication date: August 28, 2008
    Applicant: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Gerald G. Lindner, Chris J. Paidosh