Patents by Inventor David Gunther
David Gunther has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961723Abstract: Embodiments of a process kit are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support, the deposition ring including an annular band configured to rest on a lower ledge of the substrate support, the annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, wherein a depth between an upper surface of the annular band and a horizontal portion of the upper surface of the inner lip is between about 6.0 mm and about 12.0 mm; a channel disposed radially outward of and beneath the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.Type: GrantFiled: December 17, 2018Date of Patent: April 16, 2024Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Cheng-Hsiung Tsai, Kirankumar Neelasandra Savandaiah
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Publication number: 20240113974Abstract: Mobile management method, system and client. Method includes receiving a DNS query for a host name from an application on client; retrieving reputation data associated with host name from a local cache on client; and determining a policy based on host name and the reputation data. Based on determined policy for the host name, blocking attempted network flows to a host corresponding to host name to produce blocked attempted network flows. Method also includes sending attempted network flow metadata related to the blocked attempted network flows to a collector on client; transmitting the attempted network flow metadata from the collector to a VPN server pool via a VPN tunnel; and producing an anomaly report from the transmitted attempted network flow metadata. The anomaly report includes at least one of anomalies, cohorts, trends, location boundaries, detected network security issues, detected compromised clients and/or optimized network usage.Type: ApplicationFiled: November 30, 2023Publication date: April 4, 2024Applicant: MOBILE SONIC, INC.Inventors: Joseph T. SAVARESE, Steven HECKT, Michael E. BRYANT, Eric C. MCNEILL, Carter SMITH, Elizabeth KIHSLINGER, Thomas Gunther HELMS, Camilla KEENAN-KOCH, Joseph G. SOUZA, Paul HOOVER, S. Aaron STAVENS, Christian E. HOFSTAEDTER, Jonathan SCOTT, Erik OLSON, James Scott SIMPKINS, Stephen Gregory FALLIN, John Harvey HILLOCK, Eivind NAESS, Michael Lee SNYDER, David Michael MIRLY, Marius LEE, Glenn Patrick ARANAS, Norman C. HAMER, Tridib DUTTA, Andrew James HOOVER, Thomas A. SWEET, Mark ANACKER, An PHAN
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Patent number: 11846013Abstract: An apparatus leverages a physical vapor deposition (PVD) process chamber with a wafer-to-target distance of approximately 400 millimeters to deposit tantalum film on through silicon via (TSV) structures. The PVD process chamber includes a source that is configured with dual magnet source compensation. The PVD chamber also includes an upper electromagnet assembly exterior to the chamber body in close proximity to the source, a magnetron assembly in the source including dual magnets with dual radius trajectories, a shield within the chamber body, and a plurality of grounding loops that are symmetrically spaced about a periphery of a substrate support assembly and are configured to provide an RF ground return path between the substrate support assembly and the shield.Type: GrantFiled: July 31, 2020Date of Patent: December 19, 2023Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Jiao Song, Kirankumar Neelasandra Savandaiah, Irena H. Wysok, Anthony Chih-Tung Chan
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Patent number: 11692262Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.Type: GrantFiled: July 16, 2020Date of Patent: July 4, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Jansen, Keith A. Miller, Prashanth Kothnur, Martin Riker, David Gunther, Emily Schooley
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Patent number: 11581167Abstract: Embodiments of process kits are provided herein. In some embodiments, a process kit, includes: a deposition ring configured to be disposed on a substrate support, the deposition ring comprising: an annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion, the step extending downward from the radially inner portion to the radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, and wherein an outer surface of the inner lip extends radially outward and downward from an upper surface of the inner lip to the upper surface of the annular band; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.Type: GrantFiled: June 18, 2021Date of Patent: February 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Siew Kit Hoi, Kirankumar Neelasandra Savandaiah
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Patent number: 11581166Abstract: Embodiments of deposition rings for use in a process chamber are provided herein. In some embodiments, a deposition ring includes: an annular body; an inner wall extending upward from an inner portion of the annular body; and an outer wall extending upward form an outer portion of the annular body to define a large deposition cavity between the inner wall and the outer wall, wherein a width of the large deposition cavity is about 0.35 inches to about 0.60 inches, wherein the outer wall includes an outer ledge and an inner ledge raised with respect to the outer ledge.Type: GrantFiled: July 31, 2020Date of Patent: February 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Kirankumar Neelasandra Savandaiah, Jiao Song, David Gunther, Irena H. Wysok, Anthony Chih-Tung Chan
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Publication number: 20220406573Abstract: Embodiments of process kits are provided herein. In some embodiments, a process kit, includes: a deposition ring configured to be disposed on a substrate support, the deposition ring comprising: an annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion, the step extending downward from the radially inner portion to the radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, and wherein an outer surface of the inner lip extends radially outward and downward from an upper surface of the inner lip to the upper surface of the annular band; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.Type: ApplicationFiled: June 18, 2021Publication date: December 22, 2022Inventors: David GUNTHER, Siew Kit HOI, Kirankumar Neelasandra SAVANDAIAH
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Publication number: 20220341029Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.Type: ApplicationFiled: July 11, 2022Publication date: October 27, 2022Applicant: Applied Materials, Inc.Inventors: Alexander Jansen, Keith A. Miller, Prashanth Kothnur, Martin Riker, David Gunther, Emily Schooley
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Patent number: 11361982Abstract: Methods and apparatus for cleaning an electrostatic chuck (ESC) in a semiconductor chamber allow in-situ cleaning of the ESC. An apparatus may include an adapter or cover ring that is electrically isolated from a deposition ring; an annular grounding bracket mounted to and surrounding a pedestal, the annular grounding bracket has at least one horizontal grounding loop on an upper perimeter surface configured to provide electrical contact with the adapter or cover ring and to provide an RF return path to the ESC during plasma generation; and a bracket with a horizontal grounding loop on a first end to make electrical contact with the deposition ring and a vertical grounding loop on a second end to make electrical contact with a lift hoop which is electrically grounded, the bracket is mounted to, but electrically isolated from, the annular grounding bracket.Type: GrantFiled: December 10, 2019Date of Patent: June 14, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Kirankumar Neelasandra Savandaiah, William R. Johanson, David Gunther, Prashant Prabhakar Prabhu
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Patent number: 11295938Abstract: Methods and apparatus for processing a substrate are provided herein. In embodiments, a magnetron assembly for use in a PVD chamber includes: a base plate having a first side, a second side opposite the first side, and a central axis; a magnet plate rotatably coupled to the base plate, wherein the magnet plate rotates with respect to the base plate about an offset axis; a magnet assembly coupled to the magnet plate offset from the offset axis and configured to rotate about the central axis and the offset axis; a first motor coupled to the base plate to rotate the magnet assembly about the central axis; and a second motor coupled to the magnet plate to control an angular position thereof and to position the magnet assembly in each of a plurality of fixed angular positions defining a plurality of different fixed radii.Type: GrantFiled: June 30, 2020Date of Patent: April 5, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Jiao Song, Anthony Chih-Tung Chan, David Gunther, Kirankumar Neelasandra Savandaiah, Irena H. Wysok
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Publication number: 20220033956Abstract: An apparatus leverages a physical vapor deposition (PVD) process chamber with a wafer-to-target distance of approximately 400 millimeters to deposit tantalum film on through silicon via (TSV) structures. The PVD process chamber includes a source that is configured with dual magnet source compensation. The PVD chamber also includes an upper electromagnet assembly exterior to the chamber body in close proximity to the source, a magnetron assembly in the source including dual magnets with dual radius trajectories, a shield within the chamber body, and a plurality of grounding loops that are symmetrically spaced about a periphery of a substrate support assembly and are configured to provide an RF ground return path between the substrate support assembly and the shield.Type: ApplicationFiled: July 31, 2020Publication date: February 3, 2022Inventors: David GUNTHER, Jiao SONG, Kirankumar Neelasandra SAVANDAIAH, Irena H. WYSOK, Anthony Chih-Tung CHAN
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Publication number: 20220037128Abstract: Embodiments of deposition rings for use in a process chamber are provided herein. In some embodiments, a deposition ring includes: an annular body; an inner wall extending upward from an inner portion of the annular body; and an outer wall extending upward form an outer portion of the annular body to define a large deposition cavity between the inner wall and the outer wall, wherein a width of the large deposition cavity is about 0.35 inches to about 0.60 inches, wherein the outer wall includes an outer ledge and an inner ledge raised with respect to the outer ledge.Type: ApplicationFiled: July 31, 2020Publication date: February 3, 2022Inventors: Kirankumar Neelasandra SAVANDAIAH, Jiao SONG, David GUNTHER, Irena H. WYSOK, Anthony Chih-Tung CHAN
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Publication number: 20210407778Abstract: Methods and apparatus for processing a substrate are provided herein. In embodiments, a magnetron assembly for use in a PVD chamber includes: a base plate having a first side, a second side opposite the first side, and a central axis; a magnet plate rotatably coupled to the base plate, wherein the magnet plate rotates with respect to the base plate about an offset axis; a magnet assembly coupled to the magnet plate offset from the offset axis and configured to rotate about the central axis and the offset axis; a first motor coupled to the base plate to rotate the magnet assembly about the central axis; and a second motor coupled to the magnet plate to control an angular position thereof and to position the magnet assembly in each of a plurality of fixed angular positions defining a plurality of different fixed radii.Type: ApplicationFiled: June 30, 2020Publication date: December 30, 2021Inventors: Jiao SONG, Anthony Chih-Tung CHAN, David GUNTHER, Kirankumar Neelasandra SAVANDAIAH, Irena H. WYSOK
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Publication number: 20210175107Abstract: Methods and apparatus for cleaning an electrostatic chuck (ESC) in a semiconductor chamber allow in-situ cleaning of the ESC. An apparatus may include an adapter or cover ring that is electrically isolated from a deposition ring; an annular grounding bracket mounted to and surrounding a pedestal, the annular grounding bracket has at least one horizontal grounding loop on an upper perimeter surface configured to provide electrical contact with the adapter or cover ring and to provide an RF return path to the ESC during plasma generation; and a bracket with a horizontal grounding loop on a first end to make electrical contact with the deposition ring and a vertical grounding loop on a second end to make electrical contact with a lift hoop which is electrically grounded, the bracket is mounted to, but electrically isolated from, the annular grounding bracket.Type: ApplicationFiled: December 10, 2019Publication date: June 10, 2021Inventors: KIRANKUMAR NEELASANDRA SAVANDAIAH, WILLIAM R. JOHANSON, DAVID GUNTHER, PRASHANT PRABHAKAR PRABHU
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Publication number: 20210017639Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.Type: ApplicationFiled: July 16, 2020Publication date: January 21, 2021Applicant: Applied Materials, Inc.Inventors: Alexander Jansen, Keith A. Miller, Prashanth Kothnur, Martin Riker, David Gunther, Emily Schooley
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Patent number: D908645Type: GrantFiled: August 26, 2019Date of Patent: January 26, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Kirankumar Neelasandra Savandaiah, David Gunther, Siew Kit Hoi
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Patent number: D933726Type: GrantFiled: July 31, 2020Date of Patent: October 19, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Kirankumar Neelasandra Savandaiah, Jiao Song, David Gunther, Irena H. Wysok, Anthony Chih-Tung Chan
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Patent number: D940765Type: GrantFiled: December 2, 2020Date of Patent: January 11, 2022Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Jiao Song, Kirankumar Neelasandra Savandaiah, Madan Kumar Shimoga Mylarappa
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Patent number: D966357Type: GrantFiled: December 31, 2021Date of Patent: October 11, 2022Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Jiao Song, Kirankumar Neelasandra Savandaiah, Madan Kumar Shimoga Mylarappa
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Patent number: D1007449Type: GrantFiled: May 7, 2021Date of Patent: December 12, 2023Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Kirankumar Neelasandra Savandaiah, Jiao Song, Madan Kumar Shimoga Mylarappa, Yue Cui, Nuno Yen-Chu Chen, Mengxue Wu