Abstract: A method of fabricating an integrated circuit includes identifying an edge device of a plurality of devices, the plurality of devices being part of a first layout including gate structures and diffusion regions, modifying the first layout resulting in a second layout, and fabricating the integrated circuit based on the second layout. Modifying the first layout resulting in the second layout includes adding a dummy device next to the edge device, the dummy device and the edge device having a shared diffusion region, adding a dummy gate structure next to the dummy device, extending the shared diffusion region to at least the dummy device, and performing a design rule check on the second layout. The performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method, includes: in a strap cell disposed between a memory cell and a logic cell, arranging a first gate across an active region; arranging a second gate next to and in parallel with the first gate and at an end of the active region; and when at least one conductive segment has a first length, arranging the at least one conductive segment across the first gate, the second gate, and no dummy gate in the strap cell. A semiconductor device is also disclosed herein.

Abstract: A memory device is disclosed that includes memory cell, e strap cell, conductive segment, and logic cell. The strap cell is arranged abutting the memory cell. The strap cell includes an active region, a first gate, and a second gate. The first gate is arranged across the active region. The second gate is arranged across the active region and disposed at the end of active region. The conductive segment is disposed over the first gate and the second gate. The strap cell is disposed between the memory cell and the logic cell, and the logic cell includes a third gate. The conductive segment is spaced apart from the third gate, and the length of the conductive segment is smaller than five times of a gate pitch between the first gate and the second gate.

Abstract: A method of fabricating an integrated circuit includes identifying an edge device of a plurality of devices, the plurality of devices being part of a first layout including gate structures and diffusion regions, modifying the first layout resulting in a second layout, and fabricating the integrated circuit based on the second layout. Modifying the first layout resulting in the second layout includes adding a dummy device next to the edge device, the dummy device and the edge device having a shared diffusion region, adding a dummy gate structure next to the dummy device, extending the shared diffusion region to at least the dummy device, and performing a design rule check on the second layout. The performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method includes designing a first layout of gate structures and diffusion regions of a plurality of active devices, identifying an edge device of the plurality of active devices, modifying the first layout resulting in a second layout, performing a design rule check on the second layout, and fabricating, based on the second layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. Modifying the first layout includes adding a dummy device next to the edge device, adding a dummy gate structure next to the dummy device and extending a shared diffusion region to at least the dummy device. The dummy device and the edge device have the shared diffusion region. Performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A memory device is disclosed that includes memory cell, e strap cell, conductive segment, and logic cell. The strap cell is arranged abutting the memory cell. The strap cell includes an active region, a first gate, and a second gate. The first gate is arranged across the active region. The second gate is arranged across the active region and disposed at the end of active region. The conductive segment is disposed over the first gate and the second gate. The strap cell is disposed between the memory cell and the logic cell, and the logic cell includes a third gate. The conductive segment is spaced apart from the third gate, and the length of the conductive segment is smaller than five times of a gate pitch between the first gate and the second gate.

Abstract: A method includes designing a first layout of gate structures and diffusion regions of a plurality of active devices, identifying an edge device of the plurality of active devices, modifying the first layout resulting in a second layout, performing a design rule check on the second layout, and fabricating, based on the second layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. Modifying the first layout includes adding a dummy device next to the edge device, adding a dummy gate structure next to the dummy device and extending a shared diffusion region to at least the dummy device. The dummy device and the edge device have the shared diffusion region. Performing the design rule check considers a gate structure of the dummy device as one of two dummy gate structures next to the edge device.

Abstract: A method of fabricating a memory array includes designing first layout sections in a row direction, each first layout section including first and second control lines in a first metal layer, and an upper conductive line in a third metal layer. A lower conductive line in a second metal layer is coupled to the first control line and the first control line is isolated from the second control line. A second layout section is inserted at every N-th first layout section, N being a positive integer equal to or greater than 2. The second layout section includes the first control line, the second control line and a lower conductive line in the second metal layer coupled to the second control line and to an upper conductive line in the third metal layer. The lower conductive lines in the first and second layout sections are isolated from each other.

Abstract: A method includes designing a layout of gate structures and diffusion regions of a plurality of devices, identifying an edge device of the plurality of devices, adding a dummy device next to the edge device and a dummy gate structure next to the dummy device resulting in a modified layout, and fabricating, based on the modified layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. The dummy device shares a diffusion region with the edge device. A gate structure of the dummy device is one of two dummy gate structures added next to the edge device.

Abstract: A memory compiler includes a processor configured to perform a simulation of an operation of an input stage coupled to an input terminal of a memory circuit, wherein the simulation of the operation of the input stage is performed for various slew rate values at the input terminal to obtain corresponding extrinsic input timing delays. The processor is further configured to perform a simulation of an operation of an output stage coupled to an output terminal of the memory circuit, wherein the simulation of the operation of the output stage is performed for various capacitance loading values at the output terminal to obtain corresponding extrinsic output timing delays. The processor is further configured to perform a simulation of an operation of a section of the memory circuit between the input stage and the output stage to obtain an intrinsic timing delay.

Abstract: Methods and systems for efficient retrieval of neighboring measurement values in order to enable fast execution of rule-based error correction are disclosed. In one aspect, a method for data normalization using multi-key sorting is disclosed. In some embodiments, the method includes receiving, by a data organization engine, a set of uncorrected data including corresponding neighboring data. In various embodiments, the data organization engine organizes the uncorrected data by construction of a directed acyclic graph (DAG), where the DAG includes a plurality of nodes. In some embodiments, the data organization engine may traverse the plurality of nodes to retrieve the corresponding neighboring data. Upon retrieval of the neighboring data, a rule-based correction engine may correct the uncorrected data utilizing the retrieved corresponding neighboring data.

Abstract: A method includes designing a layout of gate structures and diffusion regions of a plurality of devices, identifying an edge device of the plurality of devices, adding a dummy device next to the edge device and a dummy gate structure next to the dummy device resulting in a modified layout, and fabricating, based on the modified layout, at least one of a photolithography mask or at least one component in a layer of a semiconductor device. The dummy device shares a diffusion region with the edge device. A gate structure of the dummy device is one of two dummy gate structures added next to the edge device.

Abstract: A method of fabricating a memory array includes designing first layout sections in a row direction, each first layout section including first and second control lines in a first metal layer, and an upper conductive line in a third metal layer. A lower conductive line in a second metal layer is coupled to the first control line and the first control line is isolated from the second control line. A second layout section is inserted at every N-th first layout section, N being a positive integer equal to or greater than 2. The second layout section includes the first control line, the second control line and a lower conductive line in the second metal layer coupled to the second control line and to an upper conductive line in the third metal layer. The lower conductive lines in the first and second layout sections are isolated from each other.

Abstract: A method of designing a layout of devices includes designing a layout of gate structures and diffusion regions of a plurality of devices. The method further includes identifying an edge device of the plurality of devices. The method further includes adding a dummy device next to the edge device and a dummy gate structure next to the dummy device, wherein the dummy device shares a diffusion region with the edge device, and wherein a gate structure of the dummy device is considered to be one of two dummy gate structures added next to the edge device.

Abstract: A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.

Abstract: A method includes using a first tracking circuit corresponding to a first set of access ports of a memory macro to cause a signal transition of a first tracking signal based on an edge of a clock signal. Using a second tracking circuit corresponding to a second set of access ports of the memory macro, a signal transition of a second tracking signal is caused based on the edge of the clock signal. A reset signal is generated based on the signal transition of the first tracking signal and the signal transition of the second tracking signal. A read operation or a write operation on the memory macro is performed based on the edge of the clock signal and the reset signal.

Abstract: In response to a write operation to a memory cell that causes a data line of the memory cell to have a first voltage direction, causing the data line to have a second voltage direction opposite the first voltage direction.

Abstract: A memory macro includes a plurality of segments corresponding to a plurality of tracking circuits. Each segment of the plurality of segments thereby corresponds to one tracking circuit of the plurality of tracking circuits. In response to a read operation of a memory cell of a segment, a tracking circuit corresponding to the segment is configured to generate an edge of a tracking signal based on which a first edge of a cell signal associated with the memory cell is generated.

Abstract: A circuit includes a signal generating circuit that generates a pre-charge signal based on a clock signal and a column select signal for a column of memory cells associated with the signal generating circuit. A first state of the pre-charge signal depends on a first state of the column select signal, and the first state of the column select signal corresponds to selection of the column of memory cells. The circuit also includes a charge circuit associated with the signal generating circuit and a first data line coupled to the charge circuit. The charge circuit charges the first data line in response to the first state of the pre-charge signal and allows the first data line to float in response to a second state of the pre-charge signal.

Abstract: A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.