Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.

Abstract: A memory system includes multiple dice having multiple planes. A processing device is coupled to the dice and performs controller operations including receiving a status indicator signal comprising a pulse that is asserted by one or more planes of the multiple dice. In response to receiving the pulse, the processing device performs at least one of: a first status check of dice operations being performed by the multiple dice at an expiration of a polling delay period; or a second status check of the dice operations in response to detecting the pulse being deasserted. The processing device terminates performances of status checks while the status indicator signal remains deasserted.

Abstract: Systems and methods for automatically prioritizing computing resource configurations for remediation include receiving information describing configuration issues that may result in impaired system performance or unauthorized access, parsing that information and automatically analyzing configuration details of a user's private computing environment to determine that assets provide an environment in which configuration issues may be exploited to produce undesired results. Such systems and methods can generate assessments indicating the likelihood an issue can be exploited and potential impacts of the issue being exploited. Such systems and methods can use these assessments to generate a report prioritizing remediation of specific configuration issues for specific vulnerable assets based on the actual configuration of the user's computing resources and the data managed using those resources.

Abstract: Described are memory devices producing metadata characterizing the applied read voltage level with respect to voltage distributions. An example memory sub-system comprises: a memory device comprising a plurality of memory cells; and a controller coupled to the memory device, the controller to perform operations comprising: performing, using a read voltage level, a read strobe with respect to a subset of the plurality of memory cells; and receiving, from the memory device, one or more metadata values characterizing the read voltage level with respect to threshold voltage distributions of the subset of the plurality of memory cells, wherein the one or more metadata values reflect a conductive state of one or more bitlines connected to the subset of the plurality of memory cells.

Abstract: Memory devices might include a first storage element, a second storage element, a data line, and a controller. The first storage element is to store a first data bit. The second storage element is to store a second data bit. The data line is selectively connected to the first storage element, the second storage element, and a memory cell. The controller is configured to apply one of four voltage levels to the data line based on the first data bit and the second data bit.

Abstract: A system includes a memory component and a processing device, operatively coupled with the memory component, to send a read command to the memory component while a program or erase operation being executed by the memory component is suspended. The processing device, operatively coupled with the memory component, can then send an auto resume command to the memory component to automatically resume execution of the program or erase operation after the read command is executed.

Abstract: Exemplary methods, apparatuses, and systems include aggregating a plurality of memory status commands Each command of the plurality of memory status commands is assigned a corresponding bit on a memory interface. The plurality of memory status commands are sent in parallel as an aggregate status command to one or more memory components via the memory interface.

Abstract: Control logic in a memory device executes a programming operation to program the set of memory blocks of the set of memory planes to a set of a programming levels. In response to determining at least a portion of a first memory block passed a program verify operation associated with a last programming level of the set of programming levels, the control logic executes a first program sub-operation to terminate the programming operation with respect to a first subset of one or more memory planes of the set of memory planes that passed the program verify operation associated with the last programming level and identify a second subset of one or more memory planes that failed the program verify operation associated with the last programming level. The control logic executes a second program sub-operation to apply a trim set to the second subset of one or more memory planes that failed the program verify operation of the last programming level.

Abstract: A memory device includes a memory array and control logic, operatively coupled to the memory array, to perform operations including causing a read operation to be initiated with respect to a set of target cells, obtaining cell state information for each respective group of adjacent cells, for each target cell of the set of target cells, determining a state information bin of a set of state information bins based on the cell state information for its respective group of adjacent cells, and assigning each target cell of the set of target cells to the respective state information bin. Each state information bin of the set of state information bins defines a respective boost voltage level offset to be applied to perform boost voltage modulation.

Abstract: Control logic in a memory device executes a first programming operation to program the set of memory cells to a set of programming levels. A first cache ready signal is generated, the first cache ready signal indicating to a host system to send first data associated with a second programming operation to an input/output (I/O) data cache of the memory device. A first encoded data value and a second encoded data value associated with each memory cell of the set of memory cells are generated. A second cache ready signal is generated, the second cache ready signal indicating to the host system to send second data associated with the next programming operation to the I/O data cache. The first data associated with the second programming operation is caused to be stored in a third data cache of the cache storage. A third cache ready signal is generated, the third cache ready signal indicating to the host system to send third data associated with the second programming operation to the I/O data cache.

Abstract: A system includes a memory device including a memory array and control logic operatively coupled with the memory array. The memory array includes a target cell connected to a target wordline, a first cell connected to a first adjacent wordline adjacent to the target wordline, and a second cell connected to a second adjacent wordline adjacent to the target wordline. The control logic performs operations including causing a read to be performed with respect to the first cell to obtain an adjacent wordline read result, storing the adjacent wordline read result using a first set of page buffers, causing an incremental read to be performed with respect to the second cell and a first bin to obtain a first incremental read result, and storing the first incremental read result using a second set of page buffers.

Abstract: Memories might include a controller configured to cause the memory to prepare a first plurality of memory cells of a block of memory cells for programming from an initialization state of the block of memory cells, program the first data to the first plurality of memory cells, and, in response to receiving a write command associated with a second address corresponding to the block of memory cells and with second data before successfully verifying programming of the first data to the first plurality of memory cells, prepare a second plurality of memory cells of the block of memory cells corresponding to the second address for programming without returning the block of memory cells to the initialization state after programming the first data to the first plurality of memory cells.

Abstract: A system includes a memory component and a processing device, operatively coupled with the memory component, to send a read command to the memory component while a program or erase operation being executed by the memory component is suspended. The processing device, operatively coupled with the memory component, can then send an auto resume command to the memory component to automatically resume execution of the program or erase operation after the read command is executed.

Abstract: Memory devices might include an array of memory cells and a controller configured to access the array of memory cells. The controller might be further configured to receive a command to perform an erase operation; and in response to the command to perform the erase operation, begin execution of the erase operation. The controller might be further configured to while executing the erase operation, receive a command to perform a program operation; in response to the command to perform the program operation, suspend the execution of the erase operation; and with the execution of the erase operation suspended, execute the program operation.

Abstract: A page buffer circuit in a memory device includes a logic element configured to perform a series of calculations pertaining to one or more memory access operations and generate a plurality of calculation results associated with the series of calculations and a dynamic memory element coupled with the logic element and configured to store the plurality of calculation results. The page buffer circuit further includes an isolation element coupled between the logic element and the dynamic memory element, the isolation element to permit a calculation result from the logic element to pass to the dynamic memory element when activated and a circuit coupled to the dynamic memory element and configured to perform pre-charging operations associated with the one or more memory access operations and based at least in part on the plurality of calculation results stored in the dynamic memory element.

Abstract: A processing device in a memory sub-system determines whether to check a status of one or more memory dies of the memory device and sends a multi-unit status command to the memory device, the multi-unit status command specifying a plurality of memory units associated with the one or more memory dies of the memory device. The processing device further receives a response to the multi-unit status command, the response comprising a multi-bit value comprising a plurality of bits, wherein each bit of the plurality of bits represents a status of one or more parameters of a plurality of parameters for a corresponding one of the plurality of memory units.

Abstract: Described are systems and methods for implementing continuous memory programming operations. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of conductive lines; and a controller coupled to the memory array.

Abstract: A memory device includes a memory array comprising a plurality of memory planes, wherein the plurality of memory planes are arranged in a plurality of independent plane groups, and wherein each of the plurality of independent plane groups comprises one or more of the plurality of memory planes. The memory device further includes a plurality of independent analog driver circuits coupled to the memory array, wherein a respective one of the plurality of independent analog driver circuits is associated with a respective one of the plurality of independent plane groups. The memory device further includes a common analog circuit coupled to the memory array, wherein the common analog circuit is shared by the plurality of independent analog driver circuits and the plurality of independent plane groups.

Abstract: Exemplary methods, apparatuses, and systems include aggregating a plurality of memory status commands. Each command of the plurality of memory status commands is assigned a corresponding bit on a memory interface. The plurality of memory status commands are sent in parallel as an aggregate status command to one or more memory components via the memory interface.

Abstract: Memory devices might include a first latch to store a first data bit; a second latch to store a second data bit; a data line selectively connected to the first latch, the second latch, and a string of series-connected memory cells; and a controller configured to bias the data line during a programing operation of a selected memory cell. The controller may with the first data bit equal to 0 and the second data bit equal to 0, bias the data line to a first voltage level; with the first data bit equal to 1 and the second data bit equal to 0, bias the data line to a second voltage level; with the first data bit equal to 0 and the second data bit equal to 1, bias the data line to a third voltage level; and with the first data bit equal to 1 and the second data bit equal to 1, bias the data line to a fourth voltage level.