Patents by Inventor Di Chen
Di Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240304954Abstract: A current collecting plate provided in embodiments of the present application includes an electrode tab connector configured to electrically connected to a battery cell. A plurality of battery cell escaping slots are provided on an outer peripheral wall of the electrode tab connector, and the plurality of battery cell escaping slots are spaced from each other. An electrode tab protruding end is provided between adjacent two battery cell escaping slots, and an isolation space is defined between the electrode tab protruding end and the battery cell. The battery cell escaping slots spaced from each other are provided in the outer peripheral wall of the electrode tab connector.Type: ApplicationFiled: October 26, 2022Publication date: September 12, 2024Applicants: EVE POWER CO., LTD., HUIZHOU EVE POWER CO. , LTDInventors: Di WU, Kaibo LI, Feng CHEN, Wei He, Jincheng LIU
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Publication number: 20240306120Abstract: In an example, a computing device in a particular region is detected based on receipt by the computing device of a wireless beacon signal. A peripheral device connected to the computing device is identified in response to the detection. A location of the peripheral device is determined in response to a determination that the computing device has been moved to outside the particular region. A lost device notification is activated in response to the location being inside the particular region.Type: ApplicationFiled: March 6, 2023Publication date: September 12, 2024Applicant: Hewlett-Packard Development Company, L.P.Inventors: Xin-Chang Chen, He-Di Liu, Chia Hung Kuo, Chih-Hsin Lee
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Publication number: 20240304907Abstract: A battery, a battery module, and a battery pack are provided in the present application. The battery provided in the present application includes a housing and a negative electrode current collector disk. The negative electrode current collector disk is disposed inside the housing, and the negative electrode current collector disk is welded with the housing inside the housing before the housing is sealed.Type: ApplicationFiled: October 26, 2022Publication date: September 12, 2024Applicants: EVE POWER CO., LTD., HUIZHOU EVE POWER CO., LTDInventors: Di Wu, Kaibo Li, Feng Chen, Wei He, Jincheng Liu
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Publication number: 20240287045Abstract: The present invention relates to the field of chemical pharmacy, relates to a crystal form of a pyrimidine derivative and a preparation method therefor, and specifically relates to crystal forms A, B, C, D, and E of a compound of formula (I), a preparation method therefor, and a pharmaceutical composition and use thereof. The present invention solves the problems of small granularity, poor fluidity, poor stability and the like of the compound of formula (I) present in an amorphous form. The crystal form prepared by the present invention and the pharmaceutical composition thereof can be used for preparing a drug for treating a cancer disease.Type: ApplicationFiled: June 21, 2022Publication date: August 29, 2024Applicant: ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.Inventors: Meiyu ZHAO, Lianwei CHEN, Na LI, Zhenjuan SHI, Jianfeng ZHENG, Di SU
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Publication number: 20240283087Abstract: A coating slurry for a battery separator includes an organic polymer, a solvent, and a photoinitiator. A coated separator prepared with the coating slurry, and a preparation method of the coated separator are also provided. The preparation method of the coated separator includes: coating the coating slurry on at least one surface of a substrate, and irradiating a coated substrate under ultraviolet (UV) light with a set energy and wavelength to allow UV crosslinking to obtain the coated separator.Type: ApplicationFiled: June 15, 2022Publication date: August 22, 2024Applicant: SHENZHEN SENIOR TECHNOLOGY MATERIAL CO., LTD.Inventors: Huizhen HUANG, Dandan YANG, Weiyan CHEN, Di XIONG, Zelin CHEN, Yulin LIN
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Patent number: 12063038Abstract: A reliable multi-information entropy PUF for Internet of Things security includes a control circuit, a data register, 128 glitch generation circuits, a 128-to-1 multiplexer, and a Schmidt glitch sampling module. The control circuit controls the data register to generate a square signal, the 128 glitch generation circuits to generate glitch signals to be output and the 128-to-1 multiplexer to select the glitch signals to be output. The Schmidt glitch sampling module samples the glitch signals to obtain PUF response outputs. Each glitch generation circuit generates a glitch signal by means of a fully symmetrical structure. The Schmidt glitch sampling module comprises a first PMOS transistor, a second PMOS transistor, a third PMOS transistor, a fourth PMOS transistor, a first NMOS transistor, a second NMOS transistor, a third NMOS transistor, a fourth NMOS transistor, a buffer module and a D flip-flop.Type: GrantFiled: September 1, 2022Date of Patent: August 13, 2024Assignee: Wenzhou UniversityInventors: Pengjun Wang, Li Ni, Di Zhou, Yue Jun Zhang, Bo Chen, Xiaochun Guan
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Patent number: 12053746Abstract: The present application provides a high-gravity device for generating nano/micron bubble and a reaction system. In the device, the liquid phase is continuous phase and the gas phase is dispersed phase. A gas enters the interior of the device from a hollow shaft, and the gas is subjected to primary shearing under a shearing effect of aerating micropores to form bubbles; then, the bubbles rapidly disengage from the surface of a rotating shaft under the effect of the rotating shaft rotating at a high speed, and are subjected to secondary shearing under the high-gravity environment with the strong shearing force formed by the rotating shaft to form nano/micron bubbles. The device has the advantages of fastness, stability, and small average particle size. The average particle size of the formed nano/micron bubbles is between 800 nanometers and 50 microns, and the average particle size of the bubbles can be regulated in a range by adjusting the rotating speed of the rotating shaft.Type: GrantFiled: March 5, 2020Date of Patent: August 6, 2024Assignee: BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGYInventors: Yong Luo, Di Wang, Guangwen Chu, Yachao Liu, Zhihao Li, Yong Cai, Haikui Zou, Baochang Sun, Jianfeng Chen
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Publication number: 20240256730Abstract: A customized method for strengthening the water droplet erosion (WDE) resistance on steam turbine blade surfaces having the following steps: step S1: carrying out numerical analysis about erosion characteristics on blade surfaces to predict water erosion prone areas; Step S2: designing corresponding structures against WDE, and conducting a test for WDE characteristics of structures to screen effective structures; Step S3: according to the areas detected in Step S1, selecting a suitable and effective structure from the test and determining where and how to arrange the structure on the blade surface is disclosed. The above-mentioned method can detect areas prone to blade erosion by numerical simulation, and arrange the structures screened out by test of WDE characteristics to improve the WDE resistance of blades, mitigating the WDE problem so only a small number of special structures in local areas are arranged, thereby minimizing cost and influence on steam turbine blades.Type: ApplicationFiled: December 20, 2022Publication date: August 1, 2024Applicant: Xi'an Jiaotong UniversityInventors: Yonghui XIE, Zifeng CHEN, Youxiang CHEN, Bin YANG, Di ZHANG
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Publication number: 20240258312Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin.Type: ApplicationFiled: March 12, 2024Publication date: August 1, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
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Patent number: 12052584Abstract: Transfer learning based on prediction determines a similarity between a source base station and a target base station. Importance of parameters is determined and training is adjusted to respect the importance of parameters. A lack of historical data is compensated by selecting a base station as source base station which has a larger amount of historical data.Type: GrantFiled: May 19, 2023Date of Patent: July 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Xi Chen, Ju Wang, Hang Li, Yi Tian Xu, Di Wu, Xue Liu, Gregory Lewis Dudek, Taeseop Lee, Intaik Park
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Publication number: 20240245172Abstract: An automatic shoe-making device includes a bottom mold unit having a shoe last, two side mold units driven to combine with or separate from each other, a pressing mold unit driven to be movable relative to the bottom mold unit, a feeding unit configured to feed a sole material into a mold cavity in a supercritical fluid state, and a control unit configured to: control the two side mold units to form a combined configuration, so the two side mold units surround the shoe last to form the mold cavity for receiving the sole material, control the pressing mold unit to hot-press the sole material to form a shoe product or a shoe component, and control the pressing mold unit and the two side mold units to move away from the bottom mold unit to allow the shoe product or the shoe component to be removed from the shoe last.Type: ApplicationFiled: October 18, 2023Publication date: July 25, 2024Inventors: Chih-Liang YAO, Pei-Ru CHEN, Chin-Hsun HSIAO, Ying-Di JHANG
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Publication number: 20240246309Abstract: An automatic shoe-making device includes a bottom mold unit having a shoe last for selectively receiving an upper, two side mold units driven to combine with or separate from each other, a pressing mold unit driven to be movable relative to the bottom mold unit, and a control unit configured to: control the two side mold units to move toward the bottom mold unit to form a combined configuration, so the two side mold units surround the shoe last to form a mold cavity for receiving a sole material, control the pressing mold unit to hot-press the sole material to form a shoe product or a shoe component, and control the pressing mold unit and the two side mold units to move away from the bottom mold unit to allow the shoe product or the shoe component to be removed from the shoe last.Type: ApplicationFiled: March 21, 2023Publication date: July 25, 2024Inventors: Chih-Liang YAO, Pei-Ru CHEN, Chin-Hsun HSIAO, Ying-Di JHANG
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Publication number: 20240211612Abstract: A data storage method includes receiving to-be-stored first data; encrypting a first data part in the to-be-stored first data; writing an encrypted first data part into a non-volatile memory; and then writing a second data part into a hard disk or a magnetic disk.Type: ApplicationFiled: March 5, 2024Publication date: June 27, 2024Inventors: Han Xu, Tao Huang, Di Chen, Jiawei Zhao
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Publication number: 20240213127Abstract: A laminated embedded die package for a power semiconductor device, wherein a laminated body comprises a layup of a plurality of electrically conductive layers and dielectric layers. The die may be mounted in thermal contact with a leadframe. Electrical connections between contact areas of the die, external contact pads of the package and internal conductive layers are made by electrically conductive vias or microvias, formed by laser drilling of vias through the dielectric layers, which are then filled with conductive metal. A plurality of unfilled half-vias are arranged around edges of the laminated body adjacent external contact pads. Half-vias are formed by laser or mechanical drilling along scribe lines before singulation of packages. Surface plating of the half-vias comprises a solder wettable material. The half-vias are unfilled to form a wettable flank which allows for lateral wicking of solder during surface mounting, to facilitate optical inspection of solder reliability.Type: ApplicationFiled: November 29, 2023Publication date: June 27, 2024Inventors: Abhinandan DIXIT, An-Sheng CHENG, Di CHEN, Hossein MOUSAVIAN
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Patent number: 12013917Abstract: A method for constructing a convolutional neural network model based on farmland images is applied in an electronic device. The method includes following steps: obtaining a number of farmland images of at least one farmland; obtaining a plurality of standard segmentation farmland images corresponding to each of the farmland images; dividing the farmland images and the standard segmentation farmland images into a training image set and a test image set; taking the farmland images and the standard segmentation farmland images in the training image set as input of a convolutional neural network, and constructing a convolutional neural network model based on the farmland images; and verifying the convolutional neural network model by using the farmland images in the test image set and the standard segmentation farmland images, and optimizing a plurality of parameters of the convolutional neural network model based on the farmland images.Type: GrantFiled: November 15, 2021Date of Patent: June 18, 2024Assignee: FJ Dynamics Technology Co., LtdInventors: Di Wu, Zhao-Di Chen, Min-Xin Chen, Chen-Jian Wu, Hong Chen
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Publication number: 20240080444Abstract: Bitrate-adaptive segmentation is performed for transcoding a video stream uploaded to an online video platform for hosting and later playback to platform users. The video stream is segmented into chunks based on prediction-based bit costs determined for frames of the video stream rather than based on scene changes detected within the video stream. The bitrate-adaptive segmentation includes determining inter-prediction bit costs and intra-prediction bit costs for frames of the video stream based on information indicated within a pass log based on a first pass encoding of the video stream, determining chunk boundaries for segmenting the video stream into a chunk based on the inter-prediction bit costs and the intra-prediction bit costs for the frames, and transcoding the chunk to produce a transcoded video stream.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Inventors: Di Chen, Sam John
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Live streaming processing method, apparatus, electronic device, and computer-readable storage medium
Patent number: 11917213Abstract: This application provides a live streaming processing method performed by an electronic device. The method includes: displaying a live streaming room, the live stream room having a host account, a host sub-account and multiple viewer accounts, the host sub-account being used for assisting the host account of the live streaming room in operation; receiving real-time live streaming data of the live streaming room, and displaying a live streaming content on a live streaming room page according to the real-time live streaming data, the real-time live streaming data collected from the host account and the viewer accounts; and displaying, in response to a live streaming room operation of the host sub-account, an operation result of the live streaming room operation of the host sub-account in the live streaming room, wherein the operation result of the live streaming room operation updates the live streaming content on the live streaming room page.Type: GrantFiled: September 19, 2022Date of Patent: February 27, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Longqi Ding, Di Chen, Shuyou Li, Hengkai Wan, Junqiu Lu, Yan Long, Fenglian Wei, Ting Huang -
Patent number: 11909384Abstract: A protected direct-drive depletion-mode (D-mode) GaN semiconductor half-bridge power module is disclosed. Applications include high power inverter applications, such as 100 kW to 200 kW electric vehicle traction inverters, and other motor drives. The high-side switch is a normally-on D-mode GaN semiconductor power switch Q1 in series with a normally-off LV Si MOSFET power switch M1 and the low-side switch is a normally on D-mode GaN semiconductor power switch Q2. The gates of both Q1 and Q2 are directly driven. M1 in series with Q1 provides a high-side switch which is a normally-off device for start-up and fail-safe protection. M1 may also be used for current sensing and overcurrent protection. For example, a control circuit determines an operational mode of M1 responsive to a UVLO signal and a voltage sense signal indicative of an overcurrent event. Examples of single phase and three-phase half-bridge modules and driver circuits are described.Type: GrantFiled: May 11, 2022Date of Patent: February 20, 2024Inventor: Di Chen
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Publication number: 20240044981Abstract: A power supply processing device includes three electric control valve groups, a positive output terminal and a conversion control switch group. The conversion control switch group includes a selection switch group configured to selectively connect the current valve control components in each electric control valve group to the positive output terminal or the phase output terminal, and a connection switch group configured to connect or disconnect a current path between two electric control valve groups connected one another. In such a way, both AC experiments and DC experiments of high voltage and large capacity may be performed to the connectors without changing experimental site and experimental equipment, thereby effectively reducing the experimental cost.Type: ApplicationFiled: May 11, 2021Publication date: February 8, 2024Inventors: Zhili LIN, Renxu YANG, Di CHEN, Xiangrong GUO, Chengxu LIU, Guifen MA, Yong PU, Binhai LI, Yatao FANG
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Patent number: 11866469Abstract: The present disclosure relates to compositions and methods for modulating gene expression and in particular to DNA binding proteins and their use for increasing expression of Klotho. In some examples, the present disclosure provides an isolated or recombinant DNA binding protein comprising or attached to a transcriptional activation domain wherein the DNA binding protein binds to a target sequence within or near a Klotho gene.Type: GrantFiled: December 16, 2019Date of Patent: January 9, 2024Assignee: Klogenix LLCInventor: Ci-Di Chen