Abstract: An inductor formed on an integrated circuit chip including one or more inner layers (12) between two or more outer layers (14), inductor metal winding turns (16) included in one or more inner layers (12), and a magnetic material forming the two or more outer layers (14) and the one or more inner layers (12). In one embodiment, the magnetic material is a photoresist paste having magnetic particles. In another embodiment, the magnetic material is a series of magnetic metallic strips (32 and 36) disposed on each of the first and second portions (30 and 34, respectively) of the two or more outer layers (14) and on each of the one or more inner layers (12). The series of magnetic metallic strips on the first and second portions (30, 34) form a grid pattern. Other embodiments include an adjustable controlled compound deposit and control windings with adjustable electrical currents.

Abstract: A light guide device includes a main body and a plurality of parallel elongate first V-shaped microstructures. The main body has an incident surface; an emitting surface adjoining the incident surface; and a reflecting surface opposite to the emitting surface. The first V-shaped microstructures are provided on the reflecting surface. Each of the first V-shaped microstructures has a triangular cross-section having a first base angle nearest the incident surface, a second base angle furthest from the incident surface and a vertex angle. A pitch between adjacent microstructures is configured to be substantially constant. A size of each of the first V-shaped microstructures is defined by the equation is y=9.2637×10?6x2?0.0003x+0.0232, wherein x is a distance from a given first V-shaped microstructures to the incident surface (in units of micrometers), and wherein y is a base width of the given first V-shaped microstructures (in units of micrometers).

Abstract: A light guide device includes a main body having a first incident surface, a second incident surface, an emitting surface, a reflecting surface and a plurality of first microstructures. The first incident surface is opposite to the second incident surface. The emitting surface extends from the first incident surface to the second incident surface. The reflecting surface is opposite to the emitting surface, and the plurality of first microstructures are formed on the reflecting surface and extend parallel to the first and second incident surface. A distribution density and relative size of the first microstructures progressively decrease along directions from a center of the reflecting surface toward the first and second incident surface, respectively. The present light guide device does not employ additional optical correcting elements and thus has a simple structure. A backlight module using the same light guide device is also provided.

Abstract: A light guide device includes a main body having a first incident surface, a second incident surface, an emitting surface, a reflecting surface and a plurality of first microstructures. The first incident surface is opposite to the second incident surface. The emitting surface extends from the first incident surface to the second incident surface. The reflecting surface is opposite to the emitting surface, and the plurality of first microstructures are formed on the reflecting surface and extend parallel to the first and second incident surface. A distribution density and relative size of the first microstructures progressively decrease along directions from a center of the reflecting surface toward the first and second incident surface, respectively. The present light guide device does not employ additional optical correcting elements and thus has a simple structure. A backlight module using the same light guide device is also provided.

Abstract: An exemplary light guide plate (500) includes: a light incident portion (51) for receiving a light; a light reflecting portion (52) for reflecting the light input through the light incident portion; and a light emitting portion (53) opposite to the light reflecting portion, for outputting the reflected light. The light incident portion includes a first diffractive optical element (512) located thereat. The first diffractive optical element includes a plurality of protrusions (512a) each having a curved surface, with the protrusions being arranged symmetrically opposite to each other across a central axis of symmetry of the first diffractive optical element. The light emitting portion may include a second diffractive optical element (532) located thereat. The second diffractive optical element includes a plurality of elongate protrusions, with the protrusions being arranged symmetrically opposite to each other across a central axis of symmetry of the second diffractive optical element.

Abstract: Wafer-level testing is performed on an electronic device to be used in an optical communications system. An optical test signal is generated and is provided to a first photo detector. An electrical output of the first photo detector is supplied to the electronic device on the wafer. An electrical output from the electronic device on the wafer is used to drive a light source. An optical output of the light source is supplied to a second photo detector and an electrical signal output from the second photo detector is examined.

Abstract: A light guide plate includes an incident surface, a reflecting surface, and a plurality of V-shaped projections arrayed on the reflecting surface. The V-shaped projections extend outwardly from the reflecting surface. Each of the V-shaped projection has a triangular cross-section. A vertex angle of the cross-section is in the range from 40° to 95°. A first base angle of the cross-section is in the range from 70° to 90°. A second base angle of the cross-section is in the range from 15° to 50°. A distribution density of the V-shaped projections progressively increases along a direction away from the incident surface. A size of the V-shaped projections progressively increases along a direction away from the incident surface. The light guide plate can be one of a flat sheet having a uniform thickness and a wedge-shape piece.

Abstract: A light guide device (60) and a backlight module using the same. The light guide device includes: an incident surface (61); an emitting surface (64) adjacent to the incident surface; a reflecting surface (62) opposited to the emitting surface; a plurality of first V-shaped structures (644) formed on the emitting surface; and a plurality of second V-shaped structures (622) formed on the reflecting surface and perpendicular to the first V-shaped structures, wherein respective heigths of the second V-shaped structures increase with increasing distance from the incident surface and respective distances between adjacent second V-shaped structures decrease with increasing distance from the incident surface. The light guide device of the present invention does not need optical elements, and thus has a simple structure. A backlight module using the same light guide plate is also provided.

Abstract: A method and structure for an apparatus for maintaining signal integrity between integrated circuits residing on a printed circuit board. The apparatus has adjustable delay circuitry within the circuits and the adjustable delay circuitry adjusts the timing of signals processed within the circuit. A phase monitor connects to the circuits. The phase monitor detects phase differences between signals output by the circuits. A controller connected to the delay circuitry, the phase monitor, and the controller adjust the delay circuitry to compensate for the phase differences.

Abstract: An inductor formed on an integrated circuit chip including one or more inner layers (12) between two or more outer layers (14), inductor metal winding turns (16) included in one or more inner layers (12), and a magnetic material forming the two or more outer layers (14) and the one or more inner layers (12). In one embodiment, the magnetic material is a photoresist paste having magnetic particles. In another embodiment, the magnetic material is a series of magnetic metallic strips (32 and 36) disposed on each of the first and second portions (30 and 34, respectively) of the two or more outer layers (14) and on each of the one or more inner layers (12). The series of magnetic metallic strips on the first and second portions (30, 34) form a grid pattern. Other embodiments include an adjustable controlled compound deposit and control windings with adjustable electrical currents.

Abstract: Wafer-level testing is performed on an electronic device to be used in an optical communications system. An optical test signal is generated and is provided to a first photo detector. An electrical output of the first photo detector is supplied to the electronic device on the wafer. An electrical output from the electronic device on the wafer is used to drive a light source. An optical output of the light source is supplied to a second photo detector and an electrical signal output from the second photo detector is examined.

Abstract: Wafer-level testing is performed on an electronic device to be used in an optical communications system. An optical test signal is generated and is provided to a first photo detector. An electrical output of the first photo detector is supplied to the electronic device on the wafer. An electrical output from the electronic device on the wafer is used to drive a light source. An optical output of the light source is supplied to a second photo detector and an electrical signal output from the second photo detector is examined.

Abstract: An input buffer for an optical receiver or transceiver which provides symmetrical hysteresis and zero static current, comprises two field effect transistors (FETs) which form the basic buffer logic circuit, two FETs which respectively provide offset voltages to the buffer logic FETs, and two FETs which provide positive feedback. In the preferred embodiment the input buffer provides multiple-channels, each channel comprising a component inverter designed to provide zero static current and symmetrical hysteresis for a different input signal mode.

Abstract: A method and structure for an apparatus for maintaining signal integrity between integrated circuits residing on a printed circuit board. The apparatus has adjustable delay circuitry within the circuits and the adjustable delay circuitry adjusts the timing of signals processed within the circuit. A phase monitor connects to the circuits. The phase monitor detects phase differences between signals output by the circuits. A controller connected to the delay circuitry, the phase monitor, and the controller adjust the delay circuitry to compensate for the phase differences.

Abstract: Wafer-level testing is performed on an electronic device to be used in an optical communications system. An optical test signal is generated and is provided to a first photo detector. An electrical output of the first photo detector is supplied to the electronic device on the wafer. An electrical output from the electronic device on the wafer is used to drive a light source. An optical output of the light source is supplied to a second photo detector and an electrical signal output from the second photo detector is examined.

Abstract: An input buffer for an optical receiver or transceiver which provides symmetrical hysteresis and zero static current, comprises two field effect transistors (FETs) which form the basic buffer logic circuit, two FETs which respectively provide offset voltages to the buffer logic FETs, and two FETs which provide positive feedback. In the preferred embodiment the input buffer provides multiple-channels, each channel comprising a component inverter designed to provide zero static current and symmetrical hysteresis for a different input signal mode.

Abstract: An infrared communication device with an adaptive configuration controller for programming system parameter settings with command codes. The adaptive configuration controller comprises a number of shift registers and control circuits. The registers store command codes for configuring system parameters including bandwidth, sensitivity and LED drive current. The codes are obtained from an external source. The capability to program the system parameter settings allows the communication device to be adapted or reconfigured for optimal operation in response to changes in the environment without the need for removing or adding external components.

Abstract: A low power selector circuit is described which permits control of multiple configurations of an integrated circuit chip without external pull-up or pull-down resistors or additional lead frame pins. The selector circuit has a gated pull-up resistor formed on the chip, controlled by a sampling latch, When enabled by a power-on reset circuit, the latch samples voltage on the terminal input pad; the latch shuts off the pull-up resistor when a grounded terminal input pad is detected. This circuit thus samples the voltage of a pad of the chip to determine whether it has been grounded; this information may be used to control various chip functions. Very little power consumption is required.

Abstract: This invention provides a solution to the problem of determining how long the peak value detected for the first pulse be kept, and when should it be updated. In infrared communication, the communication distance may vary over time during the transmission. For instance in a mobile infrared telephone the users generally are moving with respect to each other. The signal amplitude changes within a very large range over time and the receiver expected to operate in this environment must also handle a large number of different communication protocols. It uses the instant signal as a basis for adjusting the threshold. The present invention is capable of accepting a wide input dynamic range of signals up to and beyond five orders of magnitude (50 dB). This is accomplished while overcoming the difficulties presented by many communications protocols, by providing a technique in which the output pulse width of an amplified photo detector input is not strongly dependent upon the input signal amplitude.