Abstract: A small ferrule having inwardly projecting lances is clenched about a small coaxial cable. The tips of the lances pierce the outer plastic covering of the cable and mechanically engage the underlying metal shield layer. Each lance includes an opening adjacent thereto through which a laser beam is directed to disintegrate a portion of the plastic layer adjacent the lance. Solder paste is then deposited into the opening and heated to cause the solder to reflow and form a low-resistance contact between each lance and an adjacent portion of the shield.

Abstract: The present disclosure sets forth a unique contact structure for a separable electrical connector for carrying relatively high levels of current at high frequency in a high temperature environment. The contact utilizes a high loading spring design which permits a relatively low resistance and low inductance contact element. The contact element takes either of two forms. One form being a multiple wire spring formed in an open helical pattern and the other being a number of c-shaped contact elements arranged in concentric circles on a thin disk.

Abstract: A separable assembly for connecting and mounting an integrated circuit chip (10) to a chip carrier substrate (12) utilizing the principle of field emitter current induction. Transmitting zones (14, 26, 28) on the chip (10) and substrate (12) are formed as recessed arrays of field emitter projections (30, 32) and the respective receiving zones (24, 16, 18) are planar conductive films. The chip (10) and the substrate (12) are separably connected with the respective transmitting and receiving zones in alignment with each other.

Abstract: A chip carrier (2) for use with an integrated circuit chip (4) has an accumulator means (38) provided in an enclosed gel filled chip receiving opening (14). The accumulator means (38) and the gel (34) cooperate to fill the opening (14), such that as the gel (34) expands, the accumulator means (38) is forced to contract. This cooperation insures that the forces applied to the chip carrier (2) due to the expansion of the gel (34) will not be great enough to cause the failure of the chip carrier (2). In the alternative, as the gel (34) contracts, the accumulator means (38) expands, insuring that a constant pressure is applied to the gel (34), thereby preventing the unrestrained motion of the gel (34) in the chip receiving opening (14). Consequently, the accumulator means (38) and the gel (34) cooperate to insure that the chip carrier (2) and the chip (4) therein will be reliable in any type of environment.

Abstract: A separable flat integrated circuit chip connector (22) includes a plurality of contact spring members (44) maintained in a planar array by a dielectric holder (54). The planar array of the contact members (44) on the connector (22) corresponds to the planar arrays of contact pads on the surfaces of the integrated circuit package (14) and the printed circuit board (10) to which it is to be connected. A connector fastening assembly (24, 26) clamps and holds the conncetor (22) between the integrated circuit package (14) and the printed circuit board (10) to provide separable electrical connections between corresponding contact pads.

Abstract: The present invention sets forth a low height socket for an integrated circuit chip carrier of the "Tape Pak" type. The unique contact is arranged in the shape of a tuning fork. The chip carrier, having flexible leads projecting outwardly from its sides, is placed in the lower body of the socket with the leads resting on top of their respective tuning fork contacts. The cover, having locking members projecting downwardly and in alignment with the tuning fork contacts, is forced into engagement with the lower body so that the locking members deflect the leads downwardly, bending them about the contacting portion of the tuning fork shaped contacts. The two arms of each tuning fork then has the locking member and a respective lead wedged therebetween.

Abstract: An electrical contact (110) formed as a monolithic element having three beam portions (114, 116, 124) and inherent springiness. The contact (110) is so configured that a relatively large deflection at a contact point (130) is transformed into a small deflection at the point (108) where the spring action is effective so that a relatively flat force/deflection characteristic is attained. A kinematic model and three embodiments of the contact are disclosed, as well as a method of formation thereof.

Abstract: An electrical contact (100) formed as a monolithic element includes a cantilevered member (74), first and second contact portions (68 and 70), a C-shaped spring member (80), and a base (72). Three pivotal zones (79,84, and 102) are provided so that a relatively large deflection of the first contact portion (68) is transformed into a small deflection at the point where the spring action is effective so that a relatively flat force/deflection characteristic is attained. A kinematic model and five embodiments of the contact are disclosed, as well as a method of formation thereof.

Abstract: A chip carrier socket (2, 102) has a latching chip (30, 130) which extends across a recess (10, 110) of the chip carrier socket (2, 102) to maintain a chip carrier (22, 122) positioned in the recess (10, 110). The latching chip (30, 130) is mounted to the chip carrier socket (2, 102) in a manner which allows the latching chip (30, 130) to move between an open and a closed position. The latching chip (30, 130) is configured to cooperate with the chip carrier socket (2, 102) such that the latching chip (30, 130) is prevented from being accidentally removed from the chip carrier socket (2, 102) during the operation thereof, thereby eliminating the possibility of the latching chip (30, 130) making electrical contact with other circuitry provided in the area. An overstress member (170) is provided on the latching clip (130) to insure that the latching chip will be reliable over many cycles.

Abstract: The present invention is an interposer connector assembly having a small contact grid spacing for interconnecting a relatively large integrated circuit chip carrier with a printed circuit board. The interposer connector assembly includes a holder which is composed of several thin plates having perforations arranged on the desired grid patterns. The thin plates are stacked with their perforations in alignment to form through openings in the holder. Contact modules are then inserted into the through openings to complete the connector assembly. The contact modules comprise a two part plastic housing with a contact member contained in a cavity formed by mating the two parts. The two parts are formed on continuous strips of extruded plastic.

Abstract: Chip carrier sockets, for providing an electrical connection between a first electrical component and a second electrical component, have terminals provided therein, the terminals have contacting portions and retention portions provided thereon. The contacting portions are provided to electrically engage leads of a chip carrier with is positioned in a recess of the chip carrier socket. A spacer is provided between the contacting portions and the retention portions, such that the spacer has a greater width than the distance provided between the contacting portion and the retention portion, This spacing, in combination with a resilient member, insure that the spacer is resiliently forced against the contacting portion and the retention portion, thereby insuring that the first electrical component will be positioned and maintained in electrical engagement with the contact portion of the terminal.

Abstract: An electrical contact (110) formed as a monolithic element having three beam portions (114, 116, 124) and inherent springiness. The contact (110) is so configured that a relatively large deflection at a contact point (130) is transformed into a small deflection at the point (108) where the spring action is effective so that a relatively flat force/deflection characteristic is attained. A kinematic model and three embodiments of the contact are disclosed, as well as a method of formation thereof.

Abstract: A method of constructing a connector housing block which includes a plurality of chambers (16) each for holding a contact member (14) therein, wherein the block is constructed of a plurality of stacked plates (18). Each of the plates (18) is formed with a plurality of apertures (20) so situated on the plates (18) that when the plates (18) are stacked the apertures (20) form the plurality of chambers (16). A solution of resin and catalyst in a solvent is provided, the plates (18) are coated with the solution, and the solvent is allowed to evaporate from the plates (18) to leave a continuous film of B-Staged resin and catalyst on the plates (18) which does not fill the apertures (20). The plates (18) are then stacked and the resin and catalyst are caused to cross-link and fuse.

Abstract: A chip carrier socket has terminals (2) positioned therein to provide an electrical connection between a chip carrier (4) and a substrate (6). The terminals (2) have first arms (10) which cooperate with the chip carrier (4), second arms (12) which engage the housing of the chip carrier socket, and mounting arms (32) which are placed in electrical engagement with the substrate (6). Engagement means (38) are provided between the first arms (10) and the mounting arms (32), and provide a shortened path across which the electrical signals can travel from the chip carrier to the substrate. The engagement means (38) also provide a frictional engagement between the first arms (10) and the mounting arms (32), thereby reducing the resilient characteristics required in the mounting arms.

Abstract: Stamping and forming machine of the type having opposed tooling assemblies which are reciprocable towards and away from each other has toggle mechanisms for moving the tooling assemblies along their paths of reciprocation. Each toggle mechanism has one toggle link pivoted to a tooling assembly and another toggle link pivoted at a fixed pivot location. The fixed location pivots are adjustable in order to control the position of the tooling assemblies when they are in their closed positions. Additionally, adjustable wear plates are provided in the passageway in which the tooling assemblies are mounted. Advantages achieved include reduced manufacturing cost for the machine, potential for high operating speeds, and compactness when desired.

Abstract: An electrical connector (20) for interposition between an electronic component (2) and a printed circuit card (14), electrically to connect contact pads (10) of the electronic component (2) to contact pads (18) of the circuit card (14), comprises a pair of superposed insulating plates (22 and 24) connected together by means of interengaging pins and sockets (66, 70 and 68, 72). The insulating plates (22 and 24) cooperate to define cavities (30) receiving spring contact elements (40) each having a nose (50) projecting through an opening (36) in a respective cuter surface (26 or 28) of the plates (22 and 24) for engagement with the contact pads (10 and 18). One half of each cavity (30) is defined by one of the plates (22 and 24) the other half being defined by the other of the plates (22 and 24). The cavities ( 30) have end walls (62 and 64) between which the contact elements (40) are compressed by engagement with the pads (10) and (18) so that the noses (50) wipe the contact surfaces of the pads (10 and 18).

Abstract: The present invention relates to a termination of a multi-strand electrical conductor carrying relatively high current levels at high frequency in an environment having an ambient temperature of up to about 300.degree. C. The cable is separated into groups of wire strands which are fanned outwardly so that each group projects away from the longitudinal axis of the cable. A retainer is provided to guide the groups of wire strands and to hold them against an annular terminal. The tips of the wire strands and adjacent surfaces of the retainer and the annular terminal are melted into a monolithic fused ring or welded surface, by means of heli-arc welding apparatus. A similar mating connector half is similarly formed, both halves of which mate to form an in-line connector.

Abstract: The invention is directed to a socketable chip carrier (2) for use with integrated circuits (22) having large lead counts. Due to the large lead counts, many leads may switch simultaneously, resulting in an instantaneous requirement for a great deal of power. The steady power supplies required for proper operation of the integrated circuits (22) cannot accommodate this requirement for increased power. Consequently, energy storage means (38) are provided in openings proximate the integrated circuit (22) to insure that an adequate power supply is maintained during switching. These energy storage means (38), such as capacitors (38) and/or batteries, supply the power required during the simultaneous switching. The capacitors (38) and/or batteries are electrically connected to the integrated circuit (22) by conductors (66) on a printed circuit (56).

Abstract: A high density connector assembly for an IC chip carrier (10) includes a stack of spacer plated (30) having apertures (32) which form chambers for holding planar contact members (22) therein. The stack of spacer plates (30) are sandwiched between a lower reference plate (34) and an upper reference plate (36) which have precisely located apertures (42, 44) communicating with the chambers for precisely positioning contact portions (26, 28) of the contact members (22) with respect to contact pads (14, 18) on the IC chip module (10) and a printed circuit board (12). The plates (30, 34, 36) are preferably formed of a dielectric coated metal material to provide a ground shield around the contact members (22) to prevent cross talk therebetween.

Abstract: Chip carrier socket has contact terminals therein comprising a web portion and first and second arms extending from the web. The first arm has a contact portion adjacent its free end for contacting a pad on a chip carrier and the second arm has a bearing portion adjacent to its free end. The intermediate portion of the second arm is not supported against wall surfaces of the chip carrier socket. The web is connected to a mounting portion by a neck which is compliantly responsive to stressing of the arms. When the contact portion engages a contact pad on a chip carrier, the entire system including the first and second arms and the web is stressed. The second arm is flexed and the freely supported end of the second arm is moved along its fixed support surface. The design permits the achievement of a high contact force and is capable of accommodating manufacturing tolerances in the chip carrier while maintaining the required contact force.