Abstract: A package and system for elimination or reduction to a minimum of reflection of the signal when transmitting from a substrate into an integrated circuit package at very high speed. This is accomplished by providing a conductor grid at a proper distance from a conductor plane to act as a reference ground plane. The grid is designed so that the difference of coefficient of expansion of the ceramic insulator and the metal conductors, which results in the deformation of the plane substrate surface due to "bimetallic" effects, is essentially cancelled due to the symmetrical construction with about the same amount of the same metal placed on both sides of the ceramic substrate. In this way, forces provided due to the thermal mismatch are mutually cancelled.

Abstract: A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected to an interdigitated lead array at the center of the chip carrier with the chip being secured to the chip carrier above the interdigitated pattern. The chip is bonded to a dielectric sliver which rests above a glass filler and bonding agent which fills the space between the interdigitated pattern and the sliver. The chip is hermetically sealed within the ceramic cap which is bonded to the chip carrier. Power and ground connections are made, from the chip directly to a pair of buses surrounding the interdigitated pattern rather than to leads extending outwardly to the edge of the chip carrier.

Abstract: Solderless electrical connector receives solid wire by rolling wire progressively into a channel between two elongate plate-like members formed from an integral base against which the wire is rolled. At least one of the plate-like members yields resiliently to accommodate a wide range of wire sizes and further maintains contact force on the terminated wire.

Abstract: A ceramic chip carrier having a copper lead frame bonded directly to a ceramic substrate has a common rim connecting the tip portions of the leads. The rim is provided with extended portions which permit bending the rim away from the substrate without altering the relative positions of the tip portions. The rim is thus raised above the center region of the substrate and does not bond to the substrate and is thus readily removed after bonding the lead frame to the substrate.

Abstract: A socket for connecting an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip is as short as possible. This is accomplished by providing a straight line conductor between the integrated circuit package and the printed circuit board. In accordance with one embodiment, a contact in the form of a movable double ended sharp needle is employed to connect the lead from the package to the lead on a substrate. In order to provide the force mating the leads and the intermediate needle, external force is provided by a spring structure comprising a multi-fingered element with the tips of the fingers encapsulated in plastic or other compliant membrane separating the spring member and the leads of the package.

Abstract: Edge connector comprises a housing assembly having a board receiving trough which receives edge portions of a printed circuit board. The housing assembly comprises an insulating housing in which contact terminals are contained and a sheet metal frame of channel-shaped cross-section in which the insulating housing is nested. A camming means is mounted on the sheet metal frame for urging the circuit board against a board engaging surface portion of the insulating housing and an auxiliary spring is mounted on the frame to provide a high clamping force on the circuit board. The camming means is movable laterally towards and away from the board engaging surface so that the connector can receive circuit boards of widely varying thicknesses.

Abstract: An electrical contact terminal of the type contained in a connector housing comprises a yoke portion having extending therefrom a contact arm and a spring arm. The contact arm has an electrical contact portion on one side thereof and a bearing portion on the other side which bears against a bearing portion on the spring arm. When the contact arm is flexed toward the spring arm by a mating part, such as a circuit board, the contact force is developed in the spring arm and the contact arm serves primarily as a conductor. The terminal is of the complanate type in that it is produced by stamping sheet metal without subsequent bending, so that all parts of the terminal lie in the plane of the sheet metal from which it was produced.

Abstract: A semiconductor chip carrier having a lead frame wherein the ends of each of the inner lead portions, which are closely adjacent to the semiconductor device to which the leads are to be bonded, are manufactured with the inner leads temporarily connected to a common supporting rim which must be removed after the attachment of the lead frame to the ceramic substrate is completed. This provides accurate and constant spacing between the leads of the lead frame during the bonding of the lead frame to the ceramic substrate. The rim is removed from the lead frame after bonding of the lead frame to the ceramic substrate. This is accomplished by reducing the thickness of the rim and a portion of the leads of the lead frame contacting and closely adjacent to the rim. This provides a space between the rim and the substrate during the bonding of the lead frame to the substrate. In this way, the rim and a small portion of the leads do not bond to the substrate, thereby allowing the rim to be later removed quite easily.

Abstract: Electrical contact terminal of the flat coplanar type which is manufactured by stamping sheet metal, has a yoke portion having a latch arm and a spring arm extending therefrom. The latch arm is relatively short while the spring arm is of sufficient length to permit deflection thereof when the terminal is placed in service. The two arms have free ends which are adjacent to and resiliently biased against each other. The free ends are latched to each other by latching means which permits movement of the free end of the spring arm along a side edge of the latch arm. An edge portion of the spring arm serves as a contact portion and current flows from this contact portion to the end of the spring arm then to the latch arm and to the yoke portion of the terminal to provide a short low inductance current path for the current. The spring arm is in a preloaded and flexed condition so that an elevated contact pressure is achieved.

Abstract: Multi-contact electrical connector for connecting a first plurality of conductors to a second plurality of conductors comprises an insulating housing having a plurality of side-by-side contact terminals therein, each terminal being a one-piece stamping having first and second contact portions for engagement with a first and second conductor respectively. The first and second contact portions also have first and second bypass contact surfaces thereon which are against each other. The spring means for maintaining contact force comprises a spring loop which extends circuitously from the first contact portion to the second contact portion. In use, the spring loop maintains the contact forces at all of the contact interfaces and the current flows from the first conductor through the first contact portion, through the bypass contact surfaces, through the second contact portion, and to the second conductor. The spring loop does not serve as a current path and self-inductance in the contact is thereby minimized.

Abstract: A method of making electrical devices, and the electrical devices made thereby, comprising the steps of: stamping from a sheet of metal a pattern of conductors configured to connect circuit components together in a relationship which forms a useful product, such as a watch, with the terminals of each of said circuit components being adjacent and connectable to appropriate terminating means formed in said pattern of conductors when said circuit components have predetermined positions adjacent said pattern of conductors; encapsulating said pattern of conductors with plastic having cavities and apertures formed therein, the cavities each having a configuration and a location to receive one of said circuit components therein in said predetermined positions and with said terminating means extending into said cavities to terminate the terminals of said circuit components; forming at least some of said component terminals on the surface of said components in positions to bend over the terminating means when the comp

Abstract: Packaging and interconnecting means for a plurality of microcircuit chips contained in chip carriers comprises a chip carrier socket which is dimensioned to receive a plurality of chip carriers in stacked relationship, one on top of the other. Vertically extending conductors in the socket are contacted by the leads from the chip carriers. In accordance with one embodiment, the several chip carriers are electrically and physically identical and the conductors are shared by all of the chips, excepting one dedicated conductor for each chip carrier. Alternatively, the chips in the chip carriers can be electrically dissimilar in which case only limited numbers of the socket conductors are shared and connections among the several chip carriers in the stack are achieved by interrupting the conductors in the chip carrier socket.

Abstract: A two part connector system for connecting a circuit element such as an integrated circuit chip to the surface of a printed circuit board in which the first connector section, e.g., a chip carrier, which holds the circuit chip, has resilient, spring-like external terminals which can be connected directly and permanently on the printed circuit board surface, as by soldering, without appreciable risk of breakage of said connections because of different expansion and contraction coefficients of the chip carrier and the printed circuit board or, alternatively, the chip carrier can be removably mounted in the second connector section, e.g., a socket, which also has resilient, spring-like external terminals connectable permanently to the surface of the printed circuit without appreciable risk of breakage of said connections because of different expansion and contraction coefficients of the socket and the circuit board.

Abstract: An assembly line method for fabricating hermetically sealed integrated circuit chips with externally extending terminal leads comprising the steps of securing at least one integrated circuit chip upon a spider assembly; stamping a strip of iterative lead frame assemblies from a strip of flat stock metal; encapsulating each of said lead frame assemblies with plastic in a configuration which leaves a window space in the center thereof or defined elsewhere therein, with the convergent ends of the individual conductive paths of the lead frame extending out of the plastic and into said window space, and the divergent ends of such conductive paths extending out of the plastic and away from the window space; mounting the terminal chip holding spider assembly onto the convergent ends of the conductive paths of the lead frame; inserting a first cap over the window space on one side of the encapsulating plastic; filling the window space with a sealant to completely immerse said spider bearing chip therein and having th