Abstract: A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.

Abstract: Disclosed herein is an apparatus for collecting game data in order to test performance of a game server. The apparatus includes a capture and filtering module, a control module, and a data management module. The capture and filtering module captures packets, transmitted and received between the game server and each of a plurality of game clients, using the plurality of game clients, and extracts a plurality of necessary data by performing filtering on the results of the capturing. The control module determines the movement route of a game character in such a way as to correspond to the plurality of necessary data, and controls the plurality of game clients based on the movement route. The data management module stores and manages the plurality of necessary data.

Abstract: A multiple viewpoint rendering method for a multiplayer online game and a multiple viewpoint rendering server using the same, the multiple viewpoint rendering server including a game progress information receiving unit configured to receive game progress information from an online game server, a viewpoint setting unit configured to obtain viewpoint information corresponding to each of the multiple terminals, a game image rendering unit configured to render game images corresponding to the multiple terminals, respectively, based on the game progress information and the viewpoint information, and a rendered image providing unit configured to provide the multiple terminals with the rendered game images corresponding to the multiple terminals, respectively.

Abstract: Disclosed herein is an apparatus and method for providing streaming-based game images. The apparatus for providing streaming-based game images includes an image capturing unit for capturing an image. An image distribution unit distributes pixels constituting the image captured by the image capturing unit depending on resolutions determined by a player and a watcher, and divides an original resolution image into one or more resolution images depending on resolutions desired by the game player and the watcher. A video encoder unit activates a plurality of video encoders depending on a number of images obtained from distribution of the image distribution unit and compresses the images from the image distribution unit. A network communication unit transmits the images compressed by the video encoder unit to a terminal of the game player or a terminal of the watcher depending on the determined resolutions.

Abstract: Disclosed herein is a scenario-based load testing apparatus and method. The scenario-based load testing apparatus includes a packet analysis unit, a scenario creation unit, and a load generation unit. The packet analysis unit creates a virtual map and game grammar by capturing and analyzing packets sent between a server and a client. The scenario creation unit creates a scenario of a virtual user on the virtual map. The load generation unit generates a load by creating packet data corresponding to the virtual user in compliance with the game grammar and the scenario.

Abstract: A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Abstract: Disclosed is a method for testing stability of a game server. The method for testing stability of a game server according to an exemplary embodiment of the present invention includes: executing, by at least one virtual user, actions or scenarios that are a list of actions; generating at least one game packets required to execute the executed actions or the actions included in the executed scenarios according to game protocols of specific game contents; and transmitting the generated game packets to a game server.

Abstract: A data storage device includes a printed circuit board (PCB), a connection tab, a dummy tab and a guiding member. A memory chip is mounted on the PCB. The connection tab is formed on a first surface of the PCB to electrically connect the PCB with a first cable. The dummy tab is formed on the first surface of the PCB. The guiding member is formed on the dummy tab to guide an insertion direction of the first cable. Thus, the data storage device without a separate connector may be manufactured by a relatively simple process at a lower cost.

Abstract: A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Abstract: Disclosed herein is an apparatus for collecting game data in order to test performance of a game server. The apparatus includes a capture and filtering module, a control module, and a data management module. The capture and filtering module captures packets, transmitted and received between the game server and each of a plurality of game clients, using the plurality of game clients, and extracts a plurality of necessary data by performing filtering on the results of the capturing. The control module determines the movement route of a game character in such a way as to correspond to the plurality of necessary data, and controls the plurality of game clients based on the movement route. The data management module stores and manages the plurality of necessary data.

Abstract: Disclosed herein is a scenario-based load testing apparatus and method. The scenario-based load testing apparatus includes a packet analysis unit, a scenario creation unit, and a load generation unit. The packet analysis unit creates a virtual map and game grammar by capturing and analyzing packets sent between a server and a client. The scenario creation unit creates a scenario of a virtual user on the virtual map. The load generation unit generates a load by creating packet data corresponding to the virtual user in compliance with the game grammar and the scenario.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract: A method of fabricating a semiconductor device includes preparing a semiconductor wafer having a top surface and a bottom surface. The semiconductor wafer is loaded onto a wafer chuck, and the bottom surface of the loaded semiconductor wafer faces the wafer chuck. A groove is formed in the top surface of the loaded semiconductor wafer by irradiating a second laser onto the top surface, and a reforming region is formed in the loaded semiconductor wafer under the groove by irradiating a first laser through wafer chuck and bottom surface of the semiconductor wafer into a region in which the first laser is focused. The semiconductor wafer is unloaded from the wafer chuck. The bottom surface of the semiconductor wafer is ground to decrease a thickness of the semiconductor wafer. The semiconductor wafer is separated along the groove and the reforming region, thereby forming a plurality of unit chips.

Abstract: A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Abstract: A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Abstract: An optical inspection tool used to detect surface defects of a substrate include a chuck for holding a substrate and a lens unit disposed over the chuck. The lens unit includes at least a pair of oblique beam paths therein, wherein light penetrating the beam paths travels without angular deflection. The beam paths take the form of spaces formed through the lens unit, or flat portions formed on a lens within the lens unit. A camera is installed on the lens unit, and the camera converts light passing through the lens unit into an image. Methods of detecting surface defects of the substrate using the inspection tool are also provided.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall.