Patents by Inventor Dong-chun Lee
Dong-chun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6815236Abstract: A method of measuring a concentration of a material includes irradiating an infrared light onto a substrate having a layer including a first material and dopants, wherein the infrared light is partially absorbed by and partially transmitted through the substrate including the layer. Intensities of the infrared light absorbed in the first material and the dopants are computed according to light wave numbers by utilizing a difference between intensities of the infrared light before and after transmitting the substrate and layer and by utilizing a difference between intensities of the infrared light absorbed in the substrate and layer and absorbed in only the substrate. Concentrations of the dopants are obtained by utilizing a ratio of light wave number regions corresponding to predetermined intensities of infrared light absorbed in the dopants relative to light wave number regions corresponding to the predetermined intensity of infrared light absorbed in the first material.Type: GrantFiled: October 29, 2003Date of Patent: November 9, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-Kyoung Kim, Sun-Yong Choi, Chung-Sam Jun, Kwang-Soo Kim, Koung-Su Shin, Jeong-Hyun Choi, Dong-Chun Lee
-
Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the same
Patent number: 6800863Abstract: A method for monitoring an ion implanter includes positioning a substrate behind an interceptor for intercepting a portion of an ion beam to be irradiated toward the substrate, irradiating a first ion beam toward the substrate to form a first shadow on the substrate, rotating the substrate about a central axis of the substrate, irradiating a second ion beam toward the substrate to form a second shadow on the substrate, and measuring a dosage of ions implanted into the substrate to monitor whether the rotation of the substrate has been normally performed. Preferably, a dosage of ions implanted into the substrate is calculated from a thermal wave value of the substrate and whether the rotation of the substrate has been normally performed is monitored by comparing the thermal wave value corresponding to the first shadow with a reference thermal wave value.Type: GrantFiled: August 6, 2003Date of Patent: October 5, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Chung-Sam Jun, Sun-Yong Choi, Dong-Chun Lee, Tae-kyoung Kim, Doo-Guen Song, Seung-Won Chae -
Publication number: 20040169869Abstract: For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.Type: ApplicationFiled: February 27, 2004Publication date: September 2, 2004Inventors: Koung-Su Shin, Sun-Yong Choi, Chung-Sam Jun, Dong-Chun Lee, Kwang-Jun Yoon
-
Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the same
Publication number: 20040099818Abstract: A method for monitoring an ion implanter includes positioning a substrate behind an interceptor for intercepting a portion of an ion beam to be irradiated toward the substrate, irradiating a first ion beam toward the substrate to form a first shadow on the substrate, rotating the substrate about a central axis of the substrate, irradiating a second ion beam toward the substrate to form a second shadow on the substrate, and measuring a dosage of ions implanted into the substrate to monitor whether the rotation of the substrate has been normally performed. Preferably, a dosage of ions implanted into the substrate is calculated from a thermal wave value of the substrate and whether the rotation of the substrate has been normally performed is monitored by comparing the thermal wave value corresponding to the first shadow with a reference thermal wave value.Type: ApplicationFiled: August 6, 2003Publication date: May 27, 2004Inventors: Chung-Sam Jun, Sun-Yong Choi, Dong-Chun Lee, Tae-Kyoung Kim, Doo-Guen Song, Seung-Won Chae -
Publication number: 20040092046Abstract: A method of measuring a concentration of a material includes irradiating an infrared light onto a substrate having a layer including a first material and dopants, wherein the infrared light is partially absorbed by and partially transmitted through the substrate including the layer. Intensities of the infrared light absorbed in the first material and the dopants are computed according to light wave numbers by utilizing a difference between intensities of the infrared light before and after transmitting the substrate and layer and by utilizing a difference between intensities of the infrared light absorbed in the substrate and layer and absorbed in only the substrate. Concentrations of the dopants are obtained by utilizing a ratio of light wave number regions corresponding to predetermined intensities of infrared light absorbed in the dopants relative to light wave number regions corresponding to the predetermined intensity of infrared light absorbed in the first material.Type: ApplicationFiled: October 29, 2003Publication date: May 13, 2004Inventors: Tae-Kyoung Kim, Sun-Yong Choi, Chung-Sam Jun, Kwang-Soo Kim, Koung-Su Shin, Jeong-Hyun Choi, Dong-Chun Lee
-
Patent number: 6687011Abstract: A transmission-type extrinsic Fabry-Perot interferometric optical fiber sensor and a method used for integrity monitoring of structures and measuring strain and temperature are provided. The transmission-type extrinsic Fabry-Perot interferometric optical fiber sensor includes first single-mode optical fiber and second single-mode optical fiber, laser device, and optical detector. The first single-mode optical fiber is inserted into an end of a capillary quartz-glass tube and the second single-mode optical fiber is inserted into the other end of the capillary quartz-glass tube. Air gap is formed between the first single-mode optical fiber and the second single-mode optical fiber in the capillary quartz-glass tube. Gap length of the air gap changes in response to magnitude and direction of transformation of the capillary quartz-glass tube. The laser device launches light into an end of the first single-mode optical fiber.Type: GrantFiled: December 22, 1999Date of Patent: February 3, 2004Assignee: Korea Advanced Institute Science and TechnologyInventors: Jung Ju Lee, San Hoon Kim, Dong Chun Lee, Il Bum Kwon
-
Patent number: 6629812Abstract: A module IC handler used for testing module Ics is disclosed in which the handler enables loading and unloading operations for module ICs, without further elevating pallet over an installation plate, and provides sequential transferring operations for the pallet on which test or customer tray is placed. To this end, after all module Ics 1 are loaded from the test tray 6 exposed to the loading or unloading position 19 or 26 by the loading and unloading elevator units 18a, 18b, or the test-finished module Ics are filled in the customer tray 17, the pallet 5 is moved to a rotation position 30 by a transfer 31, and then can be circulated to an upper side of the loading or unloading elevation plate 36 by the downer 32.Type: GrantFiled: December 6, 1999Date of Patent: October 7, 2003Assignee: Mirae CorporationInventors: Sang Soo Lee, Wan Gu Le, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
-
Publication number: 20030033711Abstract: A chamber for a module IC handler is disclosed which consists of a pre-heater for suitably heating a carrier containing a plurality of module IC at a preset temperature (which may be generated at the driving of the module IC) before the tests for the module IC are performed, and a test site for performing the tests with a external tester while pushing the carrier by using the pusher.Type: ApplicationFiled: April 22, 2002Publication date: February 20, 2003Applicant: MIRAE CORPORATIONInventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
-
Patent number: 6498472Abstract: There is disclosed a method for handling a module IC and a carrier of a module IC handler used for transferring the carrier containing a plurality of module ICs between the processes. While a separate carrier containing the produced module ICs is transferred between the processes, the tests for the module ICs are performed. Thus, the reliability of the product discharged can be further improved, and the operation rate of a high-cost test apparatus is maximized. For this, a plurality of module ICs 1 vertically loaded in the carrier are transferred inside a heating chamber 22, the tests for the module ICs 1 are conducted at a test site 7 under the state that the module ICs 1 are contained in the carrier 18, and then at an unloading position 20, the module ICs having been tested are held by pick-up means 8 in an unloading side and classified based upon the test results and the classified module ICs are placed in customer trays 9.Type: GrantFiled: November 30, 1999Date of Patent: December 24, 2002Assignee: Mirae CorporationInventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
-
Publication number: 20020172412Abstract: A method for correcting color variations on the surface of a wafer, a method for selectively detecting a defect from different patterns, and computer readable recording media for the same are provided. Color variations in images of different parts of a wafer can be corrected using the mean and standard deviation of grey level values for the pixels forming each of the different parts of the wafer. In addition, different threshold values are applied to metal interconnect patterns and spaces of the wafer so that a defect can be selectively detected from the different patterns. Thus, a bridge known as a fatal, or killing defect to a semiconductor device can be detected without also falsely detecting grains as fatal defects. Due to increased defect screening capacity of the methods, the defect detecting method can be further efficiently managed.Type: ApplicationFiled: September 7, 2001Publication date: November 21, 2002Applicant: Samsung Electronics Co., Ltd.Inventors: Chung-sam Jun, Sang-mun Chon, Hyoung-jin Kim, Dong-chun Lee, Sang-bong Choi, Sung-gon Ryu
-
Patent number: 6479982Abstract: There is disclosed a rotator for a module IC handler, including a loading side rotator for 90-degrees changing a direction of a carrier and supplying it to the inside of a heating chamber, and an unloading side rotator for 90-degrees changing a direction of the carrier after being vertically contacted in a test site and for transferring it to the unloading location. The rotator according to the invention includes a loading side rotator, and an unloading side rotator, the loading side rotator having a driving unit, a transferring member, a holding unit for holding or releasing the carrier, and a removal/insertion unit for introducing or discharging the transferring member into or from the rotating plate, the unloading side rotator having a rotating plate, a driving unit and a holding unit.Type: GrantFiled: November 29, 1999Date of Patent: November 12, 2002Assignee: Mirae CorporationInventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
-
Patent number: 6471462Abstract: A carrier handling apparatus of an IC module handler includes a carrier transferring unit for holding one side of the carrier to transfer the same between the various processes, and a carrier positioning unit for precisely positioning the carrier. The carrier handling apparatus includes a carrier for transferring predetermined modules, a carrier transferring unit for transferring the carrier from a loading location to an unloading location, and a carrier positioning unit for precisely positioning the carrier in the loading and unloading locations, thereby allowing IC modules contained in a tray to be accurately loaded into the carrier or unloaded therefrom by a pick-up means. According to another aspect of the present invention, a slider is installed to be moved along the traveling path of the carrier, and is provided with a pair of fingers that can be withdrawn or spread by one cylinder, so that the area required to install the carrier transferring apparatus can be minimized.Type: GrantFiled: November 29, 1999Date of Patent: October 29, 2002Assignee: Mirae CorporationInventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
-
Patent number: 6449156Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.Type: GrantFiled: September 12, 2001Date of Patent: September 10, 2002Assignee: Samsung Electronics Co., Ltd.Inventors: Seong-Chan Han, Dong-Woo Shin, Dong-Chun Lee, Wang-Jae Lee
-
Patent number: 6425178Abstract: A module integrated circuit (IC) carrier is used to move module ICs through a testing machine. The module IC carrier has a housing with a pair of installation elements installed parallel to one another in a receiving space of the housing. A plurality of holding members are installed on each of the installation elements. Each holding member on one of the installation elements faces a corresponding holding member on the other of the installation elements. Module ICs are held between corresponding pairs of the holding members. The holding elements can be biased towards each other to help hold the module ICs. Each holding element may include a rotator with a grooved edge which helps to hold a module IC, and which allows the module ICs to be easily inserted into and removed from the carrier.Type: GrantFiled: October 28, 1999Date of Patent: July 30, 2002Assignee: Mirae CorporationInventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
-
Publication number: 20020039282Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.Type: ApplicationFiled: September 12, 2001Publication date: April 4, 2002Applicant: Samsung Electronics Co., Ltd.Inventors: Seong-Chan Han, Dong-Woo Shin, Dong-Chun Lee, Wang-Jae Lee
-
Patent number: 6062799Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.Type: GrantFiled: June 23, 1998Date of Patent: May 16, 2000Assignee: Samsung Electronics Co., Ltd.Inventors: Seong Chan Han, Dong Chun Lee, Kwang Su Yu, O Kyung Kwon
-
Patent number: 5927504Abstract: An apparatus for carrying plural printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus comprises a main frame which is formed with an inside space for the PCBs. The main frame includes receivers for supporting one shorter edge of the PCBs. A clamp frame joined to the main frame includes a support plate for the other shorter edge of the PCBs. Movable clamps are elastically connected to the clamp frame so as to push the PCBs by elastic force when the PCBs are loaded into the apparatus. A adjustable mounting such as a slot or holes is provided in the main frame for fasteners joining two frames each other. Therefore, the apparatus can carry the PCBs of different size. The elastic connection between the clamp and the clamp frame is preferably made by slide bars and elastic members. Clamp holes, sub-walls, partition walls, hollow corners, and so forth may be preferably provided for the apparatus.Type: GrantFiled: June 23, 1998Date of Patent: July 27, 1999Assignee: Samsung Electronics Co., Ltd.Inventors: Seong Chan Han, Dong Chun Lee, Kwang Su Yu, O Kyung Kwon