Abstract: A power semiconductor module and a method of manufacture thereof includes a lead frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: An electrical connection inside a semiconductor device is established by lead frames formed of plural conductor plates. The lead frames are disposed three-dimensionally so that the respective weld parts thereof are exposed toward a laser light source used in the laser welding. The laser welding is then performed by irradiating a laser beam. According to the above, welding can be performed readily in a reliable manner. The productivity of the semiconductor device and the manufacturing method of the semiconductor device can be thus enhanced. In addition, because the lead frames have the cooling effect, they have the capability of a heat spreader. It is thus possible to provide a semiconductor device and a manufacturing method of the semiconductor device with high productivity.

Abstract: A power semiconductor module and a method of manufacture thereof includes lead a frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: An optical deflector of the present invention includes a movable mirror and torsion bars supporting the mirror and formed integrally with the mirror. The mirror reciprocatingly vibrates to reflect a light beam to thereby deflect it. The mirror is curved in the form of an arch in a section including at least the torsion bars. The mirror deforms little during vibration even if it is thin. Small power can cause such a thin mirror to vibrate with a large amplitude.

Abstract: An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

Abstract: To provide: a method of manufacturing a ring-shaped member that can efficiently manufacture a stronger backup ring that reinforces a seal member disposed in a pressure introduction chamber of a fuel injection valve; the backup ring; and a seal structure for a fuel injection valve disposed with the backup ring.

Abstract: A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.

Abstract: A semiconductor device includes a first metal foil, an insulating sheet mounted on an upper surface of the first metal foil main, at least one second metal foil mounted on the insulating sheet, at least one solder layer mounted on the at least one second metal foil, and at least one semiconductor element mounted on the at least one second metal foil through the at least one solder layer. The at least one semiconductor has a thickness of 50 ?m or greater and less than 100 ?m.

Abstract: An optical deflector includes a plurality of piezoelectric unimorph oscillating bodies (210a to 210d) that cause a reflecting plate (1) to oscillate rotationally, centering upon a pair of flexible support units (2a and 2b). The optical deflector forms a single structure of the oscillating plates (23a to 23b), the reflecting plate (1), the flexible support units (2a and 2b), and a support body (9), by connecting one set of the terminals of the oscillating plates (23a to 23d) of the suite of piezoelectric unimorph oscillating bodies (210a to 210d) to the flexible support units (2a and 2b), and connecting the other set of terminals to the support body (9). Furthermore, the plurality of piezoelectric unimorph oscillating bodies (210a to 210d) each respectively comprise a plurality of parallel oscillating bodies (23a1 to 23a-3, 23b-1 to 23b-3, 23c-1 to 23c-3), and (23d-1 to 23d-3), and a suite of parallel actuators (28a-1 to 28a-3, 28c-1 to 28c-3, and 28d-1 to 28d-3).

Abstract: A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.

Abstract: A soldering method of soldering first and second members includes shooting a laser light to at least one part of an outer peripheral portion surrounding a soldering-target region of the first member thereby to form an oxide film, and bonding the second member with the soldering-target region through a solder. According to the method, the solder resist is never exfoliated even after cleaning with chemicals for removing flux residues contained in solder.

Abstract: An optical scanning device is disclosed that is manufactured through a simple mounting process and is provided with a hermetically sealed oscillation space for an oscillation mirror. The optical scanning device includes plural drive electrodes for driving the oscillation mirror and plural external electrodes of the drive electrodes that are formed at the same height.

Abstract: An electrical connection inside a semiconductor device is established by lead frames formed of plural conductor plates. The lead frames are disposed three-dimensionally so that the respective weld parts thereof are exposed toward a laser light source used in the laser welding. The laser welding is then performed by irradiating a laser beam. According to the above, welding can be performed readily in a reliable manner. The productivity of the semiconductor device and the manufacturing method of the semiconductor device can be thus enhanced. In addition, because the lead frames have the cooling effect, they have the capability of a heat spreader. It is thus possible to provide a semiconductor device and a manufacturing method of the semiconductor device with high productivity.

Abstract: A method of manufacturing a semiconductor device is disclosed in which a metallic deposit is stably formed on the anode side with small variation in film thickness, and plating is prevented on the cathode side without carrying out any additional processing on the cathode side. The processed anode side causes no interference in subsequent processing. Insulator films are used to cover a scribe line, as well as a field plate or an open electrode provided on a surface of a silicon substrate before Ni electroless plating of an aluminum electrode is performed to form a metallic deposit on the electrode.

Abstract: A semiconductor apparatus equipped with at least one semiconductor element includes a metallic plate bonded to an upper surface of the semiconductor element and a conductor plate, bonded to the metallic plate and serving as an electric current path of the semiconductor apparatus. The conductor plate and the metallic plate are bonded to each other by laser welding at a part other than a part directly above the semiconductor element. As a result, heat damage caused by laser welding can be reduced.

Abstract: An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

Abstract: An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

Abstract: A fluid transportation device includes: an outer case having a sealed space; a tube having elasticity; a fluid transport mechanism having fingers that occlude the tube and a cam that successively presses the plurality of fingers; a driving force transmission mechanism disposed so as to be overlapped with the fluid transport mechanism, and transmitting a driving force to the fluid transport mechanism; a reservoir disposed at a position so as not to overlap the fluid transport mechanism and the driving force transmission mechanism; a port through which the fluid is injected into the reservoir; and an electric power supply supplying electric power to the driving force transmission mechanism. In this fluid transportation device, at least the fluid transport mechanism, the driving force transmission mechanism, and the electric power supply are housed in the sealed space of the outer case.

Abstract: An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.