Abstract: A transceiver module for providing operational resilience is presented. The transceiver module is configured to receive first data via a first optical module in a first configuration of operation and detect, using an adapter that is operationally connected to the first optical module, an operational failure of the first optical module. In response to detecting the operational failure, the transceiver module is configured to switch, via the adapter, from the first configuration of operation to a second configuration of operation by: automatically engaging a second optical module; triggering the first data that was initially directed into a first input port of the first optical module to be directed into a second input port of the second optical module; and receiving the first data from a second output port of the second optical module.

Abstract: Methods, apparatuses, systems, computing devices, and/or the like are provided. An example system for heat dissipation may include a memory. The example system may also include a processor configured to receive at least one visual representation of at least a portion of the sky, determine, based on the at least one visual representation (e.g., using artificial intelligence), a mask distinguishing between clouded and cloudless portions of the sky, based on the mask, determine a direction in which to point a heat dissipation panel toward one or more aim portions of the sky, and generate a signal to cause one or more heat dissipation surfaces or panels to be moved (e.g., using a robotic arm) such that heat is radiated toward the one or more aim portions of the sky.

Abstract: A computing entity obtains product information corresponding to a product and defines a multi-region metric space vector based on the product information. The multi-region metric space vector is a vector within a multi-region metric space that comprises a first region corresponding to supply chain/component information, a second region corresponding to assembly/fabrication information, and a third region corresponding to usage/usage environment information. Each of the first, second, and third regions are multi-dimensional.

Abstract: Disclosed are a testing unit, system, and method for testing and predicting failure of optical receivers. The testing unit and system are configured to apply different values of current, voltage, heat stress, and illumination load on the optical receivers during testing. The test methods are designed to check dark current, photo current, forward voltage, and drift over time of these parameters.

Abstract: Embodiments are disclosed for facilitating quantum computing over classical and quantum communication channels. An example system includes a network interface card (NIC) apparatus. The NIC apparatus includes an optical receiver, an embedded processor, and a network switch. The optical receiver is configured to receive qubit data via a first communication channel associated with quantum communication. The embedded processor is configured to convert the qubit data into binary bit data. The network switch is configured to output the binary bit data via a second communication channel associated with classical network communication.

Abstract: A distributed computing network includes a quantum computation network and a processor. The quantum computation network includes one or more quantum processor units (QPUs) interconnected one with the other using quantum interconnects including each a quantum link and quantum network interface cards (QNICs), where each QPU is further connected to, using the QNIC, a quantum memory. The processor is configured to receive a quantum computation task, and, using a network interface card (NIC) (i) allocate the quantum computation task to the computation network, by activating any of the quantum interconnects between the QPUs according to the quantum computation task, and (ii) solve the quantum computation task using the quantum computation network.

Abstract: A computing entity is described that obtains at least one inspection image of an at least partially fabricated product and causes the at least one inspection image to be processed by a product inspection engine. The product inspection engine includes a machine learning-trained model. The computing entity obtains an inspection result determined based on the processing of the at least one inspection image by the product inspection engine; identifies one or more training images stored in an image database based at least in part on the at least one inspection image; associates automatically generated labeling data with the one or more training images based at least in part on the inspection result determined by the processing of the at least one inspection image; and causes training of the product inspection engine using the one or more training images and the associated labeling data.

Abstract: A distributed quantum computing system formed of a plurality of quantum processing units (QPUs) is provided for performing quantum walks. An example first QPU includes a first plurality of physical qubits propagating across a first plurality of nodes where at least a portion of the first plurality of nodes are local nodes configured to perform the one or more quantum walks on the first QPU. The one or more quantum walks are conducted across the first plurality of nodes of at least the first QPU so as to form a graphical structure. Performance of the one or more quantum walks on the first QPU further includes propagation of at least a portion of the first plurality of physical qubits across the first plurality of nodes responsive to one or more inputs from evolution operators.

Abstract: Systems and methods for datacenter are disclosed. In at least one embodiment, a system or method herein causes a process for a structure that includes a component tracking system, where such a system includes individual components within individual servers or individual racks, the process being based in part on at least location information and configuration information from one or more of an optical sensor or a radio sensor associated with a motile-support that is adapted for at least three dimensional (3D) movement in a space having the individual servers or the individual racks.

Abstract: Embodiments are disclosed for providing a dual-facet distributed feedback (DFB) laser in a Mach-Zehnder modulator (MZM) structure. An example system includes an MZM structure that includes a DFB laser, a first waveguide interferometer arm structure, and a second waveguide interferometer arm structure. The DFB laser is configured to generate an optical input signal where the DFB laser includes a first output facet and a second output facet. The first waveguide interferometer arm structure is coupled to the first output facet of the DFB laser, and the first output facet of the DFB laser emits the optical input signal to the first waveguide interferometer arm structure. The second waveguide interferometer arm structure is coupled to the second output facet of the DFB laser, and the second output facet of the DFB laser emits the optical input signal to the second waveguide interferometer arm structure.

Abstract: A device for a network switch comprises N input ports, and an electrical block including a plurality of electrical switches configured to route signals in an electrical domain. Each electrical switch includes M input ports, and the device further comprises an optical block coupled to the electrical block. The optical block is configured to route signals in an optical domain. A configuration of the optical block and a configuration of the electrical block are based on at least a number of the N input ports.

Abstract: In various examples, a 3D representation of an environment may be generated from sensor data, with objects being detected in the environment using the sensor data and stored as items that can be tracked and located within the 3D representation. The 3D representation of the environment and item information may be used to determine (e.g., identify or predict) a location or position of an item within the 3D representation and/or recommend a storage location for the item within the 3D representation. Using a determined location or position, one or more routes to the location through the 3D representation may be determined. Data corresponding to a determined route may be provided to a user and/or device. User preferences, permissions, roles, feedback, historical item data, and/or other data associated with a user may be used to further enhance various aspects of the disclosure.

Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Abstract: A photonics frequency comb generator includes two integrated dies: an indium phosphide die laser of a first wavelength is grown on from, and a silicon photonics die having a microring resonator connected to the laser and frequency modulators. The microring resonator converts the first wavelength into a number of second wavelengths. One type of the microring resonator is a hybrid non-linear optical wavelength generator, comprising non-silicon materials, such as SiC or SiGe built on silicon to yield a non-linear wavelength generation. The second wavelengths are generated by adjusting the ring's geometric size and a distance between the ring and the traverse waveguide. Another type of microring resonator splits the first wavelength into a plurality of second wavelengths and transmits the multiple second wavelengths to filters and modulators, and each selects and modulates one of the second wavelengths in a one-to-one relationship.

Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto.

Abstract: Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.

Abstract: A distributed quantum computing system is provided that performs distributed quantum computing with time synchronization. The distributed quantum computing system includes a computer processing unit configured to instruct one or more quantum processing units to perform one or more operations associated with a quantum algorithm. The one or more QPUs include a plurality of qubits and the one or more QPUs are in communication with each other via a quantum channel. Each of the plurality of qubits may include local qubits, global qubits, and/or synchronization qubits. The local qubits and global qubits of each QPU may be configured to perform the one or more operations associated with the quantum algorithm. The synchronization qubits of each QPU may be configured to determine if the one or more operations associated with the quantum algorithm performed by each of the one or more QPUs are in sync.

Abstract: A metrology system includes metrology equipment, a remote communication link, a local communication link, and a data processing unit (DPU). The metrology equipment is configured to generate a stream of data relating to inspected wafers, and to format the generated data into first and second data types. The remote communication link is configured to communicate with an external system. The data processing unit (DPU) is configured to (i) using the remote communication link, send the data belonging to the first data type directly to the external system, and (ii) perform analysis on the data belonging to the second data type, and, using the local communication link, provide results of the analysis to the metrology equipment.

Abstract: A multi-chip module (MCM) assembly includes a substrate, a number of optical ports, an electrical block mounted on the substrate and including a plurality of electrical switches configured to route signals in an electrical domain. The MCM assembly further includes an optical block mounted on the substrate, coupled to the electrical block, and configured to route signals in an optical domain. A configuration of the optical block and a configuration of the electrical block are based on the number of optical ports.

Abstract: An optoelectronic component may include a substrate, an electronic integrated circuit supported by the substrate, and a photonic integrated circuit supported by the substrate. The optoelectronic component may include a plurality of substrate interconnect connectors disposed on the substrate, a plurality of electronic integrated circuit interconnect connectors disposed on the electronic integrated circuit, and a plurality of photonic integrated circuit interconnect connectors disposed on the photonic integrated circuit. The optoelectronic component may include a first plurality of cable connectors, each cable connector connected to the substrate, the electronic integrated circuit, and the photonic integrated circuit via respective interconnect connectors. The first plurality of cable connectors may be configured to facilitate electrical communication between the substrate, the electronic integrated circuit, and the photonic integrated circuit.