Abstract: In one embodiment, a secure computing system comprises a key generation sub-system configured to generate cryptographic keys and corresponding key labels for distribution to computer dusters, each computer cluster including a plurality of respective endpoints, a plurality of quantum key distribution (QKD) devices connected via respective optical fiber connections, and configured to securely distribute the generated cryptographic keys among the computer clusters, and a key orchestration sub-system configured to manage caching of the cryptographic keys in advance of receiving key requests from applications running on ones of the endpoints, and provide respective ones of the cryptographic keys to the applications to enable secure communication among the applications.

Abstract: Embodiments are disclosed for a quantum key distribution (QKD) enabled intra-datacenter network. An example system includes a first QKD device and a second QKD device. The first QKD device includes a first quantum-enabled port and a first network port. The second QKD device includes a second quantum-enabled port and a second network port. The first quantum-enabled port of the first QKD device is communicatively coupled to the second quantum-enabled port of the second QKD device via a QKD link associated with quantum communication. Furthermore, the first network port of the first QKD device is communicatively coupled to a first network switch via a first classical link associated with classical network communication. The second network port of the second QKD device is communicatively coupled to a second network switch via a second classical link associated with classical network communication.

Abstract: Several VCSEL devices for long wavelength applications in wavelength range of 1200-1600 nm are described. These devices include an active region between a semiconductor DBR on a GaAs wafer and a dielectric DBR regrown on the active region. The active region includes multi-quantum layers (MQLs) confined between the active n-InP and p-InAlAs layers and a tunnel junction layer above the MQLs. The semiconductor DBR is fused to the bottom of the active region by a wafer bonding process. The design simplifies integrating the reflectors and the active region stack by having only one wafer bonding followed by regrowth of the other layers including the dielectric DBR. An air gap is fabricated either in an n-InP layer of the active region or in an air gap spacer layer on top of the semiconductor DBR. The air gap enhances optical confinement of the VCSEL. The air gap may also contain a grating.

Abstract: In one embodiment, an optical network system including a plurality of optical switches configured to switch beams of light which are modulated to carry information, a plurality of host computers comprising respective optical network interface controllers (NICs), optical fibers connecting the optical NICs and the optical switches forming an optically-switched communication network, over which optical circuit connections are established between pairs of the optical NICs over ones of the optical fibers via ones of the optical switches, the optically-switched communication network which including the optical NICs and the optical switches.

Abstract: A photonics frequency comb generator includes two integrated dies: an indium phosphide die laser of a first wavelength is grown on from, and a silicon photonics die having a microring resonator connected to the laser and frequency modulators. The microring resonator converts the first wavelength into a number of second wavelengths. One type of the microring resonator is a hybrid non-linear optical wavelength generator, comprising non-silicon materials, such as SiC or SiGe built on silicon to yield a non-linear wavelength generation. The second wavelengths are generated by adjusting the ring's geometric size and a distance between the ring and the traverse waveguide. Another type of microring resonator splits the first wavelength into a plurality of second wavelengths and transmits the multiple second wavelengths to filters and modulators, and each selects and modulates one of the second wavelengths in a one-to-one relationship.

Abstract: A passive dual polarization unit and coherent transceiver and/or receiver including one or more passive dual polarization units are provided. An example passive dual polarization unit includes a polarization splitter configured to split an input signal into a TE mode and TM mode signals; TE/TM splitters each designed to split the TE/TM mode signals into first TE/TM signals and second TE/TM signals; a first TE signal polarization rotation component for receiving the first TE signal and providing a third TM signal having the same magnitude and time dependence as the first TE signal; a first TM signal polarization rotation component for receiving the first TM signal and providing a third TE signal having the same magnitude and time dependence as the first TM signal; and TE/TM couplers that couple the second TE/TM signals and the third TE/TM signals to generate output TE/TM signals.

Abstract: A vertical-cavity surface-emitting laser (VCSEL) is provided. The VCSEL includes a mesa structure disposed on a substrate. The mesa structure includes a first reflector, a second reflector, and an active cavity material structure disposed between the first and second reflectors. The second reflector has an opening extending from a second surface of the second reflector into the second reflector by a predetermined depth. Etching into the second reflector to the predetermined depth reduces the photon lifetime and the threshold gain of the VCSEL, while increasing the modulation bandwidth and maintaining the high reflectivity of the second reflector. Thus, etching the second reflector to the predetermined depth provides an improvement in overshoot control, broader modulation bandwidth, and faster pulsing of the VCSEL such that the VCSEL may provide a high speed, high bandwidth signal with controlled overshoot.

Abstract: The invention is a datacenter network comprising a plurality of switches. The switches comprise edge switches and aggregation switches associated with sliceable bandwidth variable transceivers (S-BVT). An intermediate passive optical layer is communicatively coupled to the edge switches and the aggregation switches via fiber optic links associated with the S-BVTs. Furthermore, the intermediate passive optical layer is inserted between the edge and aggregation layers in order to combine the signals from each tier. The intermediate passive optical layer comprises a passive fiber coupler that combines the links between switches and each S-BVT receiver receives the signals sent from all S-BVT transmitters connected to the intermediate passive optical layer. The datacenter network is adapted to adjust the local oscillator wavelength of each S-BVT receiver and the wavelength and slice allocation of each S-BVT transmitter, thereby permitting dynamically allocating different resources to each link.

Abstract: An authentication method, network switch, and network device are provided. In one example, a method is described that includes receiving a first signal indicative of a data lane being activated and configured to carry data to or within the network switch, receiving a second signal indicative of an authentication lane being established in the network switch or a device connected to the network switch, where the authentication lane is different from the data lane, and enabling data transmission across the data lane only in response to receiving the second signal indicative of the authentication lane being established.

Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Abstract: Optical communication modules, optical communication cables, and associated methods of manufacturing are provided. An example optical communication module includes a substrate supporting a first optical transceiver and a second optical transceiver. The first optical transceiver includes a first optical transmitter that generates optical signals having a first wavelength and a first optical receiver that receives optical signals having a second wavelength. The second optical transceiver includes a second optical transmitter that generates optical signals having the second wavelength and a second optical receiver that receives optical signals having the first wavelength. One or more lens assemblies coupled with the respective transceivers may be used to direct optical signal generated by and directed to the respective transceivers.

Abstract: A package includes a light emitting portion configured to emit light, a lens including a first lens surface and a second lens surface, a protective layer between the light emitting portion and the first lens surface and that shields the first lens surface from a surrounding environment, and an optical component that redirects light output from the second lens surface. The first lens surface is configured to receive the emitted light from the light emitting portion, the second lens surface is configured output light that has passed through the first lens surface, and the protective layer has a refractive index greater than 1.5.

Abstract: Disclosed are a testing unit, system, and method for testing and predicting failure of optical receivers. The testing unit and system are configured to apply different values of current, voltage, heat stress, and illumination load on the optical receivers during testing. The test methods are designed to check dark current, photo current, forward voltage, and drift over time of these parameters.

Abstract: A system includes a pair of network devices, a universal multi-core fiber (UMCF) interconnect, and a pair of wavelength-division multiplexing (WDM) devices. Each network device includes (i) first optical communication devices configured to communicate first optical signals having a first carrier wavelength and (ii) second optical communication devices configured to communicate second optical signals having a second carrier wavelength. The universal multi-core fiber (UMCF) interconnect includes multiple cores that are configured to convey the first optical signals and the second optical signals between the network devices, using single-mode propagation for the first optical signals and multi-mode propagation for the second optical signals. Each WDM device is connected between a respective network device and the UMCF interconnect and configured to couple the first and second optical communication devices of the respective network device to the cores in accordance with a defined channel assignment.

Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

Abstract: An optical switching device (20) includes a substrate (39) and first and second optical waveguides (23, 25) having respective first and second tapered ends (62, 64), which are fixed on the substrate in mutual proximity one to another. A pair of electrodes (36, 38) is disposed on the substrate with a gap therebetween. A cantilever beam (32) is disposed on the substrate within the gap and configured to deflect transversely between first and second positions within the gap in response to a potential applied between the electrodes. A third optical waveguide (21) is mounted on the cantilever beam and has a third tapered end (60) disposed between the first and second tapered ends of the first and second waveguides, so that the third tapered end is in proximity with the first tapered end when the cantilever beam is in the first position and is in proximity with the second tapered end when the cantilever beam is in the second position.

Abstract: Embodiments are disclosed for a quantum key distribution enabled intra-datacenter network. An example system includes a first vertical cavity surface emitting laser (VCSEL), a second VCSEL and a network interface controller. The first VCSEL is configured to emit a first optical signal associated with data. The second VCSEL is configured to emit a second optical signal associated with quantum key distribution (QKD). Furthermore, the network interface controller is configured to manage transmission of the first optical signal associated with the first VCSEL and the second optical signal associated with the second VCSEL via an optical communication channel coupled to a network interface module.

Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

Abstract: A fast optical switch and networks comprising fast optical switches are disclosed herein. In an example embodiment, a fast optical switch includes two or more fabric switches; a first selector switch; and a second selector switch. The first selector switch may selectively pass a signal to one of the two or more fabric switches. The one of the two or more fabric switches may act on the received signal to provide a switched signal and the second selector switch may selectively receive the switched signal provided by the one of the two or more fabric switches. A slot of the fast optical switch comprises a transmission window of one of the two or more fabric switches that occurs in parallel with at least a portion of a reconfiguration window of the other of the two or more fabric switches.

Abstract: The invention is a datacenter network comprising a plurality of switches. The switches comprise edge switches and aggregation switches associated with sliceable bandwidth variable transceivers (S-BVT). An intermediate passive optical layer is communicatively coupled to the edge switches and the aggregation switches via fiber optic links associated with the S-BVTs. Furthermore, the intermediate passive optical layer is inserted between the edge and aggregation layers in order to combine the signals from each tier. The intermediate passive optical layer comprises a passive fiber coupler that combines the links between switches and each S-BVT receiver receives the signals sent from all S-BVT transmitters connected to the intermediate passive optical layer. The datacenter network is adapted to adjust the local oscillator wavelength of each S-BVT receiver and the wavelength and slice allocation of each S-BVT transmitter, thereby permitting dynamically allocating different resources to each link.