Abstract: A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.

Abstract: A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Abstract: The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part (22) arranged on a terminal face (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.

Abstract: A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least one thin metallic layer by the method for joining aligned discrete optical elements. The surface regions are subsequently wetted using a liquid solder free of flux in a contactless dosed manner. The solder is applied to the surface regions to be joined via a nozzle using a pressurized gas stream.

Abstract: A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Abstract: The present invention relates to a diode arrangement (10) comprising a diode (11) and two electrodes (14, 15) which are each connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces (20, 21) of said diode, wherein the contact surfaces of the diode are formed substantially by the surfaces of a lower side (19) and an upper side (18) of the diode and are contacted with the contact extensions (12, 13) of the electrodes via the soldered connection, said contact extensions forming counter contact surfaces (24, 25) being substantially congruent with the contact surfaces of the diode.

Abstract: Method and device for drying circuit substrates (13), in particular semiconductor substrates, in which a circuit surface (30) of the circuit substrate is flushed using a flushing liquid (10) in a flushing step and the circuit surface is dried in a subsequent drying step, the circuit substrate being moved in the flushing step in the direction of its planar extension transversely and in relation to a liquid level (28) of the flushing liquid in such a way that a liquid meniscus forms at a transition area between the circuit surface and the liquid level, which changes because of the relative movement, and thermal radiation (36) is applied to the transition area wetted by the liquid meniscus in the drying step.

Abstract: The present invention relates to a contact arrangement (47, 48, 49, 50, 55, 56, 57) for substrate contacting, in particular for contacting terminal faces of a semiconductor substrate (21), comprising at least one inner contact (25) of the contact arrangement that is formed on a substrate surface by a base terminal face of the substrate, a passivation layer (34, 35) covering at least the outer edge region and the periphery of the inner contact, at least one lower contact strip (36) extending laterally away from the inner contact (25) on the passivation layer (34, 35), and a further, upper contact strip (37, 38, 39) extending on the lower contact strip, wherein the further contact strip is formed by a contact metallization, which is substantially composed of a nickel (Ni) layer or a layer structure (38, 39) containing nickel and palladium (Pd).

Abstract: A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metalllizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Abstract: A method and device for alternately contacting two wafer-like component composite arrangements, in which the two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metallizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement , so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements.

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im

Abstract: The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part (22) arranged on a terminal face (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.

Abstract: A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.

Abstract: In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im

Abstract: A method for joining aligned discrete optical elements by which the optical elements can be joined in the aligned state. A thermal connection having long-term stability can be produced at little expense and with high positioning accuracy. Surface regions to be joined can be provided with at least one thin metallic layer by the method for joining aligned discrete optical elements. The surface regions are subsequently wetted using a liquid solder free of flux in a contactless dosed manner. The solder is applied to the surface regions to be joined via a nozzle using a pressurized gas stream.

Abstract: The invention relates to a method for removing a plurality of raised places of contact made of a meltable metal, such as tin or indium or an alloy, such as tin-containing solder, silver-containing solder or lead-containing solder, the meltable metal being meltable above a first temperature limit, the places of contact being surface-distributed over a substrate. It is also possible to form vaulted domes on a plurality of metallic support segments which are located on one of the surfaces of a substrate. The invention aims at reducing production costs, particularly at removing a soldered layer once applied. If defective contact places occur, a plurality of the raised contact places, particularly substantially all contacts, are at least in substantial portions melted off from the substrate by contacting them with a molten metal.

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im

Abstract: Method and device for drying circuit substrates (13), in particular semiconductor substrates, in which a circuit surface (30) of the circuit substrate is flushed using a flushing liquid (10) in a flushing step and the circuit surface is dried in a subsequent drying step, the circuit substrate being moved in the flushing step in the direction of its planar extension transversely and in relation to a liquid level (28) of the flushing liquid in such a way that a liquid meniscus forms at a transition area between the circuit surface and the liquid level, which changes because of the relative movement, and thermal radiation (36) is applied to the transition area wetted by the liquid meniscus in the drying step.