Abstract: Disclosed herein is a device that includes: a sense amplifier circuit activated in response to a first control signal; a first global bit line coupled to the sense amplifier circuit; a first local bit line; a first transistor electrically coupled between the first global bit line and the first local bit line, the first transistor being rendered conductive in response to a second control signal; a first memory cell; a first cell transistor electrically coupled between the first local bit line and the first memory cell, the first cell transistor being rendered conductive in response to a third control signal; and a control circuit producing the first, second, and third control signals such that the second control signal is produced after producing the third control signal and the first control signal is produced after producing the second and third control signals.

Abstract: A semiconductor device comprising a plurality of semiconductor chips and a plurality of through-line groups is disclosed. Each of the through-line groups consists of a unique number of through-lines. The numbers associated with the through-line groups are mutually coprime to each other. When one of the through-lines is selected for the each through-line group, one of the semiconductor chip is designated by a combination of the selected through-lines of the plurality of the through-line groups.

Abstract: Disclosed herein is a device that includes: a semiconductor substrate having a first surface on which a plurality of circuit elements are formed and a second surface opposite to the first surface; an insulating layer covering the second surface of the semiconductor substrate; and a penetration electrode having a body section that penetrates through the semiconductor substrate and a protruding section that is connected to one end of the body section and protrudes from the second surface of the semiconductor substrate. The second surface of the semiconductor substrate is covered with the protruding section of the penetration electrode without intervention of the insulating layer.

Abstract: A semiconductor device is disclosed which comprises a clock generating circuit generating first and second divided clocks by dividing an input clock by first and second division number, respectively, and a counter circuit including a shift register having a plurality of stages that sequentially shifts an input signal and outputs an output signal delayed based on setting information. The counter circuit individually controls operation timings of the stages of the shift register by selectively supplying either of the first and second divided clocks to each stage of the shift register, and either of signals from the stages of the shift register is extracted and outputted as the output signal.

Abstract: A semiconductor device capable of increasing ON current while reducing channel resistance and allowing transistors to operate independently and stably, having a fin formed to protrude from the bottom of a gate electrode trench, a gate insulating film covering the surfaces of the gate electrode trench and the fin, a gate electrode embedded in a lower part of the gate electrode trench and formed to stride over the fin via the gate insulating film, a first impurity diffusion region arranged on a first side face, and a second impurity diffusion region arranged on a second side face.

Abstract: A semiconductor device includes a semiconductor substrate, first and second penetration electrodes each penetrating the semiconductor substrate, a multi-level wiring structure formed on the semiconductor substrate, the multi-level wiring structure including a lower-level wiring, an upper-level wiring and an interlayer insulating film between the lower-level wiring and the upper-level wiring, a first wiring pad formed as the lower-level wiring and electrically connected to the first penetration electrode, a second wiring pad formed as the upper-level wiring, a plurality of first through electrodes each formed in the interlayer insulating film to form an electrical connection between the first and second wiring pads, a third wiring pad formed as the lower-level wiring and electrically connected to the second penetration electrode, a fourth wiring pad formed as the upper-level wiring, and a plurality of second through electrodes each formed in the interlayer insulating film.

Abstract: A device includes memory banks, each having a plurality of memory cells with respective error data output circuits. Each of the error data output circuits outputs first to M-th (M is an integer of 2 or more) error data according to first to M-th data retrieved from first to M-th memory cell groups selected from its corresponding memory bank. A test control circuit has first error data synthesis circuits and second to (M+1)-th error data synthesis circuits, each of which synthesizes the first to M-th error data from a corresponding error data output circuit and outputs the synthesized data as first test data. Each of the error data synthesis circuits synthesizes m-th (m is an integer of from 1 to M) error data from the error data output circuits and outputs the synthesized data as (m+1)-th test data.

Abstract: Disclosed herein is a device that includes a memory cell array having a plurality of pages, a row cache register, and an array control circuit. The array control circuit is configured to: select one of the pages as a selected page to form an electrical path between the selected page and the row cache register in response to a first command with a row address; cut the electrical path between the selected page and the row cache register; and form the electrical path again between the selected page and the row cache register in response to a second command without the row address.

Abstract: Disclosed herein is a device that includes an internal circuit, a first terminal supplied with a first voltage, a first power-supply line coupled between the first terminal and the internal circuit, a potential monitoring terminal, and a first switch coupled between the internal power-supply line and the potential monitoring terminal.

Abstract: Disclosed herein is a device that includes a multi-level wiring structure including a first wiring layer and a second wiring layer formed over the first wiring layer; a memory cell array area including a plurality of memory cells, a plurality of sense amplifiers and a plurality of sub amplifiers; a main amplifier area including a plurality of main amplifiers, the memory cell array area and the main amplifier area being arranged in line in a first direction; and a plurality of first I/O lines each connecting an associated one of the sub amplifiers to an associated one of the main amplifiers, each of the first I/O lines including first and second wiring portions that are elongated in the first direction, the first wiring portion being formed as the first wiring layer and the second wiring portion being formed as the second wiring layer.

Abstract: Disclosed herein is a device that includes: a data strobe terminal; a data terminal; a first output driver coupled to the data strobe terminal; a second output driver coupled to the data terminal; and a data control circuit configured to enable the first and second output drivers to function as termination resistors in different timings from each other.

Abstract: A semiconductor device includes a plurality of channels, a plurality of command monitor circuits provided corresponding to the plurality of channels, respectively, and a plurality of signal lines coupled in common to the plurality of command monitor circuits. Each of the plurality of command monitor circuits includes a selector configured to receive a plurality of input signals and selectively output a plurality of selected signals among the input signals, based on a first selection information, and an output circuit coupled between the selector and the plurality of signal lines, and configured to output the selected signals to the plurality of signal lines, respectively, based on a second selection information. One of the plurality of command monitor circuits is selected to output the selected signals to the plurality of signal lines while the remaining of the command monitor circuits is non selected, based on the second selection information.

Abstract: A method of manufacturing a semiconductor device includes forming an insulating isolation portion in a groove of a substrate, forming a projection portion in which an upper portion of the insulating isolation portion projects from a principal surface of the substrate, forming a sidewall spacer covering a side surface of the projection portion and part of the principal surface of the substrate along the side surface of the projection portion, and forming a first trench in the substrate by etching the substrate using the sidewall spacer as a mask.

Abstract: Disclosed herein is a semiconductor chip that includes: a plurality of penetration electrodes each penetrating between main and back surfaces of the semiconductor chip, the penetration electrodes including a plurality of first penetration electrodes, a second penetration electrode and a third penetration electrode; and a wiring configured to intersect with a plurality of regions, each of the regions being defined as a region between corresponding two of the first penetration electrodes, one end of the wiring being coupled to the second penetration electrode, the other end of the wiring being coupled to the third penetration electrode.

Abstract: Disclosed herein is a device that includes: a first circuit configured to operate on a first power voltage to produce a first set of slew rate control signals; a second circuit configured to operate on a second power voltage to produce a second set of slew rate control signals in response to the first set of slew rate control signals; and a third circuit configured to operate on the second power voltage to produce a signal at a rate that is controllable in response to the second set of slew rate control signals.

Abstract: Disclosed herein is a semiconductor device that includes: a measurement circuit which measures propagation time of an internal clock signal; a delay adjustment circuit which adjusts the propagation time of the internal clock signal on the basis of a result of measurement by the measurement circuit; and a data output circuit which outputs a data signal in synchronization with the internal clock signal.

Abstract: A semiconductor device comprises a first pair of signal lines and a first control circuit. The first control circuit precharges each of the first pair of signal lines to a first voltage in response to a precharge signal, and changes the voltage level of each of the first pair of signal lines to a second voltage different from the first voltage when a deep power down signal is input.

Abstract: A semiconductor device 100 includes a plurality of vertical transistors 50 provided to stand from a silicon substrate 1 and having a pillar lower diffusion layer 9 at their end portions on the silicon substrate 1 side, a metal contact plug 31 provided to stand from the silicon substrate 1 and connected to the pillar lower diffusion layer 9 of the plurality of vertical transistors 50, the plurality of vertical transistors 50 are uniformly arranged around the metal contact plug 31 and share the pillar lower diffusion layer 9 and the metal contact plug 31.

Abstract: Disclosed herein a semiconductor device, which comprises: a vertical MOS transistor that has an upper diffusion layer, and a first lower diffusion layer disposed at a lower position than the upper diffusion layer; and a first diode that has a first well isolated from the first lower diffusion layer, and a second lower diffusion layer disposed at a lower position than the upper diffusion layer and formed in the first well. A surge voltage is discharged across the second lower diffusion layer and the first well when the surge voltage is applied.

Abstract: In a manufacturing method of a barrier layer, a via hole is formed in an insulating layer that covers a conductive layer over a substrate, and then the barrier layer is formed in the via hole. The barrier layer is provided by forming a second titanium nitride film after forming a first titanium nitride film. The second titanium nitride film is formed using a method having a weak anisotropy than the first titanium nitride film.