Abstract: A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.

Abstract: A tunable three-dimensional (3D) inductor comprises a plurality of vias arranged with spacing among them, a plurality of interconnects in a metal layer, wherein the plurality of interconnects connect the plurality of vias on one end, and a plurality of tunable wires that connects to the plurality of vias on the other end to form the 3D inductor. The physical configuration and inductance value of the 3D inductor are adjustable by tuning the plurality of tunable wires during manufacturing process.

Abstract: An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.

Abstract: An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.

Abstract: Methods and apparatus are disclosed for a package or a package-on-package (PoP) device. An IC package or a PoP device may comprise an electrical path connecting a die and a decoupling capacitor, wherein the electrical path may have a width in a range from about 8 um to about 44 um and a length in a range from about 10 um to about 650 um. The decoupling capacitor and the die may be contained in a same package, or at different packages within a PoP device, connected by contact pads, redistribution layers (RDLs), and connectors.

Abstract: An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.

Abstract: An antenna apparatus comprises a semiconductor die comprising a plurality of active circuits, a molding layer formed over the semiconductor die, wherein the semiconductor die and the molding layer form a fan-out package, a first dielectric layer formed on a first side of the semiconductor die over the molding compound layer, a first redistribution layer formed in the first dielectric layer and an antenna structure formed above the semiconductor die and coupled to the plurality of active circuits through the first redistribution layer.

Abstract: A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module.

Abstract: A front end module includes a transmitter path network coupled to an antenna and a transmitter, and includes a first selectable matching network. The front end module further includes a receiver path network coupled to the antenna and a receiver. The receiver path network is a second selectable matching network.

Abstract: A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.

Abstract: A switched capacitor circuit includes a positive side capacitor coupled to a first positive side node; a first positive side switch element for selectively coupling the first positive side node to a second node according to a first control signal; and a precharge circuit coupled to the first positive side node for precharging the first positive side node to a precharge voltage for a predetermined time when the first positive side switch element is switched off according to the first control signal, and then for charging the first positive side node to a charge voltage until the first positive side switch element is switched on according to the first control signal. By rapidly precharging the first positive side node, the clock feedthrough effect is eliminated and the locking period of the VCO is shortened. Afterwards by charging the first positive side node, the phase noise of the VCO is minimized.

Abstract: A calibration circuit for calibrating an output level of a demodulator includes a test signal generator, an RSSI module and a calibration module. The test signal generator generates a test signal, and the RSSI module detects the test signal to generate a control signal, wherein the control signal controls the demodulator to process the test signal to generate a determined output signal. The calibration module then calibrates the RSSI module according to the output signal in order to calibrate the output level of the demodulator. When the control signal is utilized to selectively enable or disable a soft-mute function of the demodulator, the calibration module can be utilized to calibrate or determine the soft-mute function of the demodulator.

Abstract: A switched capacitor circuit includes a positive side capacitor coupled to a first positive side node; a first positive side switch element for selectively coupling the first positive side node to a second node according to a first control signal; and a precharge circuit coupled to the first positive side node for precharging the first positive side node to a precharge voltage for a predetermined time when the first positive side switch element is switched off according to the first control signal, and then for charging the first positive side node to a charge voltage until the first positive side switch element is switched on according to the first control signal. By rapidly precharging the first positive side node, the clock feedthrough effect is eliminated and the locking period of the VCO is shortened. Afterwards by charging the first positive side node, the phase noise of the VCO is minimized.

Abstract: A switched capacitor circuit includes a positive side capacitor coupled to a first positive side node; a first positive side switch element for selectively coupling the first positive side node to a second node according to a first control signal; and a precharge circuit coupled to the first positive side node for precharging the first positive side node to a precharge voltage for a predetermined time when the first positive side switch element is switched off according to the first control signal, and then for charging the first positive side node to a charge voltage until the first positive side switch element is switched on according to the first control signal. By rapidly precharging the first positive side node, the clock feedthrough effect is eliminated and the locking period of the VCO is shortened. Afterwards by charging the first positive side node, the phase noise of the VCO is minimized.

Abstract: A calibration circuit for calibrating an output level of a demodulator includes a test signal generator, an RSSI module and a calibration module. The test signal generator generates a test signal, and the RSSI module detects the test signal to generate a control signal, wherein the control signal controls the demodulator to process the test signal to generate a determined output signal. The calibration module then calibrates the RSSI module according to the output signal in order to calibrate the output level of the demodulator. When the control signal is utilized to selectively enable or disable a soft-mute function of the demodulator, the calibration module can be utilized to calibrate or determine the soft-mute function of the demodulator.

Abstract: A multi-band low noise amplifier capable of operating in a plurality of band modes includes a plurality of input amplifiers respectively corresponding to the plurality of band modes and a single output amplifier. Each input amplifier includes a receiving port for receiving a corresponding input signal in one of the plurality of band modes. The single output amplifier includes at least one port coupled to the plurality of input amplifiers and an output port for outputting a signal processed by the single output amplifier.

Abstract: A switched capacitor circuit includes a positive side capacitor coupled to a first positive side node; a first positive side switch element for selectively coupling the first positive side node to a second node according to a first control signal; and precharge circuit coupled to the first positive side node for precharging the first positive side node to a precharge voltage for a predetermined time when the first positive side switch element is switched off according to the first control signal, and then for charging the first positive side node to a charge voltage until the first positive side switch element is switched on according to the first control signal. By rapidly precharging the first positive side node, the clock feedthrough effect is eliminated and the locking period of the VCO is shortened. Afterwards by charging the first positive side node, the phase noise of the VCO is minimized.

Abstract: A multi-band low noise amplifier capable of operating in a plurality of band modes includes a plurality of input amplifiers respectively corresponding to the plurality of band modes and a single output amplifier. Each input amplifier includes a receiving port for receiving a corresponding input signal in one of the plurality of band modes. The single output amplifier includes at least one port coupled to the plurality of input amplifiers and an output port for outputting a signal processed by the single output amplifier.

Abstract: A multi-band low noise amplifier capable of operating in a plurality of band modes includes a plurality of input amplifiers respectively corresponding to the plurality of band modes and an output amplifier. Each input amplifier includes a receiving port for receiving a corresponding input signal in the band mode. The output amplifier includes at least a lowest-impedance port being a lowest-impedance node of the multi-band low noise amplifier and an output port for outputting the input signal processed by the output amplifier. The output amplifier is coupled to the plurality of input amplifiers at the lowest-impedance port.

Abstract: A switched capacitor circuit includes a positive side capacitor coupled to a first positive side node; a first positive side switch element for selectively coupling the first positive side node to a second node according to a first control signal; and a precharge circuit coupled to the first positive side node for precharging the first positive side node to a precharge voltage for a predetermined time when the first positive side switch element is switched off according to the first control signal, and then for charging the first positive side node to a charge voltage until the first positive side switch element is switched on according to the first control signal. By rapidly precharging the first positive side node, the clock feedthrough effect is eliminated and the locking period of the VCO is shortened. Afterwards by charging the first positive side node, the phase noise of the VCO is minimized.