Patents by Inventor En-Tsung Cho

En-Tsung Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984460
    Abstract: The present disclosure relates to an insulation unit based on an array substrate and a manufacturing method thereof, an array substrate and a manufacturing method thereof, and a display mechanism. The method for manufacturing the insulation unit based on the array substrate includes: providing an aluminum layer on a substrate; and anodizing the aluminum layer to oxidize the aluminum layer to form the insulation unit. The method for manufacturing the insulation unit based on the array substrate can manufacture an insulation unit with a better corrosion resistance.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: May 14, 2024
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: Yuming Xia, En-Tsung Cho, Haijiang Yuan
  • Publication number: 20240153757
    Abstract: A manufacturing method of a silicon nitride thin film, a thin film transistor, and a display panel are disclosed, the method including: providing a silane precursor into an atomic layer deposition apparatus for a preset time period, and remaining the silane precursor for a preset time period; providing an inert gas thereinto for a preset time period for the first time, and purging the silane precursor; providing a nitrogen supplying precursor for a preset time period, and remaining the nitrogen supplying precursor for a preset time period; providing the inert gas for a preset time period for the second time, and purging the nitrogen supplying precursor; repeating for a preset number of times the steps of providing the silane precursor, providing the inert gas for the first time, providing the nitrogen supplying precursor and providing the inert gas for the second time to form the silicon nitride thin film.
    Type: Application
    Filed: January 15, 2024
    Publication date: May 9, 2024
    Inventors: En-Tsung CHO, Wanfei YONG, Je-Hao HSU, Yuming XIA, Haijiang YUAN
  • Publication number: 20240142825
    Abstract: The present disclosure provides a curved display panel and a manufacturing method thereof and a display device. The curved display panel includes a first substrate, a second substrate, a liquid crystal layer, a first alignment layer and a second alignment layer. The first substrate and the second substrate are opposite to each other. The first alignment layer is located on a surface of the first substrate facing the second substrate. The second alignment layer is located on a surface of second substrate facing the first substrate. The liquid crystal layer is located between the first alignment layer and the second alignment layer. The first alignment layer includes a porous structure layer and alignment materials. The porous structure layer defines a plurality of spaced filling holes. The plurality of filling holes are perpendicular to the surface of the first substrate. The alignment materials are filled within the plurality of filling holes.
    Type: Application
    Filed: June 14, 2023
    Publication date: May 2, 2024
    Inventors: En-tsung CHO, Yuming XIA, Guiqing DU, Zhipeng HE, Haoxuan ZHENG
  • Patent number: 11961852
    Abstract: Disclosed is a manufacture method of the array substrate, including: sequentially forming a gate, a gate insulating layer, an active layer, an ohmic contact layer and a metal layer on a substrate, forming a photoetching mask on the metal layer, where thickness of the photoetching mask in a half exposure area of the mask plate is from 2000 ? to 6000 ?; etching the metal layer, the ohmic contact layer and the active layer outside a covering area of the photoetching mask; ashing the photoetching mask for a preset time with an ashing reactant, wherein the ashing reactant comprises oxygen, and the preset time is from 70 seconds to 100 seconds; and sequentially etching the metal layer, the ohmic contact layer and the active layer based on the ashed photoetching mask, and forming a channel region of the array substrate. The present disclosure further discloses an array substrate, and a display panel.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: April 16, 2024
    Assignees: HKC CORPORATION LIMITED, CHUZHOU HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: En-Tsung Cho, Fengyun Yang, Yuming Xia, Je-Hao Hsu, Zhen Liu, Hejing Zhang, Wanfei Yong
  • Patent number: 11908683
    Abstract: The present application discloses a manufacturing method of a silicon nitride thin film, a thin film transistor and a display panel, the method includes following steps: providing a silane precursor into an atomic layer deposition apparatus for a preset time period, and remaining the silane precursor for a preset time period after the provision; providing an inert gas into the atomic layer deposition apparatus for a preset time period for the first time, and purging the silane precursor; providing a nitrogen supplying precursor into the atomic layer deposition apparatus for a preset time period, and remaining the nitrogen supplying precursor for a preset time period after the provision; providing the inert gas into the atomic layer deposition apparatus for a preset time period for the second time, and purging the nitrogen supplying precursor; repeating for a preset number of times the steps of providing the silane precursor, providing the inert gas for the first time, providing the nitrogen supplying precurso
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: February 20, 2024
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: En-Tsung Cho, Wanfei Yong, Je-Hao Hsu, Yuming Xia, Haijiang Yuan
  • Patent number: 11901394
    Abstract: The present application discloses a display panel and a manufacturing method therefor, and the method includes steps of: forming a photosensitive element layer, forming a light collimating layer on the photosensitive element layer, and forming an active light-emitting matrix layer on the light collimating layer; where the step of forming the light collimating layer includes: providing a metal substrate, putting the metal substrate into an electrolyte, and preparing a porous oxidized metal as the light collimating layer by a two-step oxidation method.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: February 13, 2024
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: En-Tsung Cho, Jie Ding, Je-Hao Hsu, Lidan Ye
  • Patent number: 11901420
    Abstract: The present application discloses a manufacturing method for a gate electrode and a thin film transistor, and a display panel, including: depositing an aluminum film on a substratum by physical vapor deposition; depositing a molybdenum film over the aluminum film by atomic layer deposition; and etching the aluminum film and the molybdenum film to form the gate electrode of a predetermined pattern.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: February 13, 2024
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: En-Tsung Cho, Yuming Xia, Wei Li
  • Patent number: 11856814
    Abstract: The present disclosure provides a display panel and a manufacturing method for the display panel. The display panel includes a substrate, a switch assembly disposed on the substrate, and a light-sensing assembly disposed on a side of the switch assembly. The switch assembly comprises an indium gallium zinc oxide (IGZO) layer.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: December 26, 2023
    Assignees: HKC CORPORATION LIMITED, CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD
    Inventor: En-Tsung Cho
  • Patent number: 11791349
    Abstract: The present application discloses a manufacturing method for a display panel and the display panel, and the manufacturing method includes a manufacture procedure of forming an array substrate, where the manufacture procedure of forming an array substrate includes: forming a buffer layer with a preset pattern on a glass substrate; placing the glass substrate with the buffer layer formed thereon into an electrochemical deposition device, and performing electrochemical deposition to form a copper alloy metal layer corresponding to the buffer layer; heating and annealing the copper alloy metal layer to form a first metal layer; sequentially forming an insulating layer, an active layer, a second metal layer, a passivation layer and a transparent electrode layer on the first metal layer, where the first metal layer includes a buffer layer and a copper alloy metal layer.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: October 17, 2023
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: Yuming Xia, En-Tsung Cho, Chongwei Tang
  • Patent number: 11791416
    Abstract: This application discloses a display panel, a method for manufacturing a display panel, and a display device. The method includes steps of forming, in a display region of the display panel, a first active switch including a first semiconductor layer, and forming, in a non-display region of the display panel, a second active switch including a second semiconductor layer. A material of the first semiconductor layer formed is an oxide, a material of the second semiconductor layer formed is polysilicon, and the first semiconductor layer and the second semiconductor layer are formed on an identical layer.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 17, 2023
    Assignee: HKC CORPORATION LIMITED
    Inventors: En-Tsung Cho, Qionghua Mo
  • Patent number: 11749693
    Abstract: Disclosed are a manufacturing method of an array substrate, an array substrate and a display device. The manufacturing method of the array substrate includes: providing a substrate; depositing and patterning a gate layer on the substrate; depositing a protective layer on the substrate covered with the gate layer by atomic layer deposition; and depositing and patterning an amorphous silicon layer and an ohmic contact layer on the protective layer. The uniform protective layer of the present disclosure reduces the influence on the field effect mobility of the thin film transistor, makes the display of the product more stable, and improves the display effect.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: September 5, 2023
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: Yuming Xia, En-tsung Cho, Lidan Ye
  • Patent number: 11719966
    Abstract: The present application discloses a test structure, a substrate and a method for manufacturing the substrate. The substrate includes a stacked substratum, a metal layer and an insulating layer; first via holes and second via holes disposed in different areas and passing through the insulating layer, and first transparent electrodes and second transparent electrodes disposed in different via holes and connected with the metal layer. The first via holes and the second via holes are formed through the same manufacture procedure, and the first transparent electrodes and the second transparent electrodes are formed through the same manufacture procedure.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: August 8, 2023
    Assignees: HKC CORPORATION LIMITED, CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Kaijun Liu, En-Tsung Cho
  • Publication number: 20230230984
    Abstract: A manufacturing method of an array substrate and a display panel are disclosed. The manufacturing method includes: disposing a photoresist on an active switch; disposing a protective layer on the active switch; disposing a pixel electrode layer on the protective layer. The step of etching each film layer material based on the photoresist to form an active switch includes: performing a first wet etching on the active switch; performing a first dry etching and two ashing treatments on the active switch; performing a second wet etching on the active switch; and removing the photoresist. The present application can improve the issue of photoresist residues.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 20, 2023
    Inventors: WANFEI YONG, En-Tsung CHO, Yuming XIA, Sihui YU
  • Patent number: 11705533
    Abstract: Disclosed is a photosensitive component, including: an intrinsic layer; a first doped layer provided on a light incident side of the intrinsic layer; and a second doped layer provided on a light exit side of the intrinsic layer; the intrinsic layer, the first doped layer and the second doped layer are all doped with a dopant, and silicon ions are injected into the intrinsic layer, the first doped layer and the second doped layer. An X-ray detector and a display device are further disclosed.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: July 18, 2023
    Assignee: HKC CORPORATION LIMITED
    Inventor: En-tsung Cho
  • Patent number: 11646326
    Abstract: The present application discloses a manufacturing method for a carbon nanotube conductive film, a display panel and a display device. The manufacturing method for the carbon nanotube conductive film includes steps of: forming a mesoporous silica; depositing a catalyst layer in a channel of the mesoporous silica by atomic layer deposition; manufacturing the mesoporous silica with the catalyst layer deposited in the channel into a mesoporous silica film; introducing a carbon matrix precursor into the channel of the mesoporous silica film by chemical vapor deposition, and reacting under the catalysis of the catalyst layer to form a carbon nanotube film; and removing the mesoporous silica and the catalyst layer from the carbon nanotube film to form the transparent carbon nanotube conductive film.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: May 9, 2023
    Assignees: Beihai HKC Optoelectronics Technology Co., Ltd., HKC CORPORATION LIMITED
    Inventors: Yuming Xia, En-Tsung Cho, Haijiang Yuan
  • Patent number: 11574939
    Abstract: Disclosed are a method for manufacturing an array substrate, an array substrate and a display device. The method includes the following operations: sequentially forming a gate, a gate insulation layer, an active layer, an ohmic contact layer and a metal layer on a base substrate; forming a photolithography mask on the metal layer, a thickness of the photolithography mask being between 1.7 ?m and 1.8 ?m; exposing the photolithography mask through a mask plate to make a uniformity of the photolithography mask in a half-exposed area of the mask plate reach a preset uniformity; and manufacturing the array substrate based on the exposed photolithography mask.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: February 7, 2023
    Assignees: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC Corporation Limited
    Inventors: Yuming Xia, En-tsung Cho, Wei Li
  • Patent number: 11561309
    Abstract: Disclosed are a ray converter and a ray detection panel device. The ray converter (100, 100?) includes a substrate (110) and a conversion body (120). The substrate (110) includes a medium carrier. The medium carrier has a mesoporous structure distributed in an array. A pore of the mesoporous structure extends from an entrance end of the substrate (110) to an exit end of the substrate (110). The conversion body (120) is filled in the pore. The ray detection panel device includes a ray converter (100, 100?) and a light sensor.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: January 24, 2023
    Assignee: HKC Corporation Limited
    Inventor: En-tsung Cho
  • Patent number: 11562596
    Abstract: Disclosed are an optical fingerprint sensor, a preparation method thereof and a display device. The optical fingerprint sensor includes: a substrate; and a sensor unit, disposed on the substrate and including a thin film transistor and a photosensor electrically connected to the thin film transistor, where the thin film transistor includes a source electrode, a drain electrode, a semiconductor layer, and a light shield layer formed over a channel region between the source electrode and the drain electrode and shielding the semiconductor layer exposed in the channel region.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 24, 2023
    Assignees: BEIHAI HKG OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventors: En-tsung Cho, Fengyun Yang, Je-hao Hsu, Haijiang Yuan
  • Patent number: 11557611
    Abstract: Disclosed are a method and a device for manufacturing an array substrate, and an array substrate. The method includes: depositing and forming a gate insulation layer on a pre-formed base substrate and a pre-formed gate, the gate insulation layer covering the pre-formed gate; depositing and forming an amorphous silicon layer, a doped amorphous silicon layer including at least three doped layers, and a metal layer on the gate insulation layer in sequence, doping concentrations of the at least three doped layers of the doped amorphous silicon layer increasing from bottom to top; etching patterns of the amorphous silicon layer, the doped amorphous silicon layer and the metal layer to form the array substrate.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: January 17, 2023
    Assignee: HKC CORPORATION LIMITED
    Inventors: Qionghua Mo, En-tsung Cho
  • Patent number: 11515342
    Abstract: A gate unit and a manufacturing method thereof, a method of manufacturing an array substrate, and a display mechanism are provided. The method of manufacturing a gate unit includes: providing a conductive layer on a substrate; forming a photoresist layer on a side of the conductive layer away from the substrate; exposing the photoresist layer, and then developing the photoresist layer to form a groove extending through the photoresist layer on the photoresist layer, so as to form the photoresist layer with a pattern; and electrochemically depositing a functional material on the photoresist layer with the pattern, and then removing the photoresist layer to obtain the conductive layer having a pattern layer formed thereon, so as to obtain the gate unit.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: November 29, 2022
    Assignees: Beihai HKC Optoelectronics Technology Co., Ltd., HKC Corporation Limited
    Inventors: Xia Yuming, En-Tsung Cho, Chongwei Tang