Patents by Inventor Eric J. Bergman

Eric J. Bergman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220282394
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Eric J. Bergman, Stuart Crane, Tricia A. Youngbull, Timothy G. Stolt
  • Publication number: 20220259756
    Abstract: Exemplary electroplating apparatuses may include a system head operable to clamp a substrate. The system head may be operable to raise and lower the substrate between a plating bath, a first position above the plating bath, and a second position above the first position. The electroplating apparatuses may include a plating bath vessel adapted to hold the plating bath for electroplating on the substrate. The electroplating apparatuses may include a weir extending about the plating bath vessel. The electroplating apparatuses may include a first nozzle extending through the weir at a first radial position, and positioned to deliver fluid to the substrate at the first position above the plating bath. The electroplating apparatuses may include a second nozzle extending through the weir at a second radial position, and positioned to deliver fluid to the substrate at the second position above the plating bath.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 18, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Sam Lee, Kyle M. Hanson, Eric J. Bergman
  • Patent number: 11371159
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Grant
    Filed: June 22, 2019
    Date of Patent: June 28, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Eric J Bergman, Stuart Crane, Tricia A Youngbull, Timothy G Stolt
  • Patent number: 11352711
    Abstract: Cleaning substrates or electroplating system components may include methods of rinsing a substrate at a semiconductor plating chamber. The methods may include moving a head from a plating bath to a first position. The head may include a substrate coupled with the head. The methods may include rotating the head for a first period of time to sling bath fluid back into the plating bath. A residual amount of bath fluid may remain. The methods may include delivering a first fluid to the substrate from a first fluid nozzle to at least partially expel the residual amount of bath fluid back into the plating bath. The methods may include moving the head to a second position. The methods may include rotating the head for a second period of time. The methods may also include delivering a second fluid across the substrate from a second fluid nozzle.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: June 7, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Sam Lee, Kyle M. Hanson, Eric J. Bergman
  • Publication number: 20220145489
    Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
    Type: Application
    Filed: January 24, 2022
    Publication date: May 12, 2022
    Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
  • Publication number: 20220144699
    Abstract: In a method for removing an organic adhesive from a glass carrier in a semiconductor manufacturing process, the glass carrier is placed into a process chamber. The glass carrier is rotated and heated sulfuric acid is applied or sprayed onto the glass carrier. Ozone is introduced into the process chamber. The ozone diffuses through the sulfuric acid to the organic adhesive on the surface of the glass carrier. The sulfuric acid and the ozone chemically react with the organic adhesive and remove it from the glass carrier.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 12, 2022
    Inventors: Eric J. Bergman, David P. Surdock, Graeme Bell
  • Publication number: 20220072208
    Abstract: Dialysis systems for operating dialysis machines (e.g., peritoneal dialysis machines) for conducting dialysis treatments are disclosed. The dialysis system may include a spent dialysate container for receiving spent dialysate from a patient. In use, the spent dialysate containers are arranged and configured to provide one or more mechanical advantages to ease disposal of the spent dialysate. For example, the spent dialysate container may receive the spent dialysate from the patient and enable the patient or caregiver to dispose of the spent dialysate without requiring the patient or caregiver to lift bags of spent dialysate or incorporate lengthy drain lines. The spent dialysate container may include a reservoir to receive the spent dialysate, wheels to enable the patient or caregiver to transport the reservoir, mechanisms to facilitate disposal of the spent dialysate from the reservoir, a nozzle to dispose of the spent dialysate, and/or a disinfectant to disinfect the drain.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 10, 2022
    Inventors: David J. Yuds, Eric J. Bergman, Jonathon F. Leclerc
  • Patent number: 11268208
    Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 8, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Paul R McHugh, Gregory J Wilson, Kyle M Hanson, John L Klocke, Paul Van Valkenburg, Eric J Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R Borjesson
  • Patent number: 11241718
    Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: February 8, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Joseph Antony Jonathan, Kyle M. Hanson, Jason A. Rye, James E. Brown, Gregory J. Wilson, Eric J. Bergman, Tricia A. Youngbull, Timothy G. Stolt
  • Patent number: 11211252
    Abstract: Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operation and a second bath configured to maintain an anolyte during operation. The electroplating systems may include a catholyte tank and an anolyte tank fluidly coupled with the two baths of the two-bath electroplating chamber. The electroplating systems may include a first pump configured to provide catholyte from the catholyte tank to the first bath. The electroplating systems may include a second pump configured to provide anolyte from the anolyte tank to the second bath. The electroplating systems may also include an oxygen-delivery apparatus configured to provide an oxygen-containing fluid within the electroplating system.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: December 28, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, John L. Klocke, You Wang
  • Patent number: 11179508
    Abstract: Tubing protectors, systems including tubing protection, and methods for protecting tubing, are disclosed, such as for protecting tubing connected between a patient and a dialysis machine (e.g., peritoneal dialysis machine) during a dialysis treatment. A tubing protector may include a tubing sheath attachable to a patient. The sheath may include a first portion for receiving and protecting a length of tubing extendible in the sheath, such as to minimize collapse, kinking, blockage, or combinations thereof, along the length of the tubing. A second portion may comprise a flexible material and enclose the first portion. The first portion may comprise a resilient material, which allows for movement in the sheath and has a strength to allow for reorientation of the tubing, while withstanding deformation of the tubing along the length. The first portion may be a coil, a plurality of rings, a woven mesh, or a solid tube, or combinations thereof.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: November 23, 2021
    Assignee: Fresenius Medical Care Holdings, Inc.
    Inventors: David J. Yuds, Eric J. Bergman, Maria T. Tamayo-Coffey, Jonathan F. Leclerc, Jessica M. Steuber
  • Publication number: 20210348296
    Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
    Type: Application
    Filed: May 8, 2020
    Publication date: November 11, 2021
    Inventors: Paul R McHugh, Gregory J Wilson, Kyle M Hanson, John L Klocke, Paul Van Valkenburg, Eric J Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R Borjesson
  • Patent number: 10971354
    Abstract: Methods of drying a semiconductor substrate may include applying a drying agent to a semiconductor substrate, where the drying agent wets the semiconductor substrate. The methods may include heating a chamber housing the semiconductor substrate to a temperature above an atmospheric pressure boiling point of the drying agent until a vapor-liquid equilibrium of the drying agent within the chamber has been reached. The methods may further include venting the chamber, where the venting vaporizes the liquid phase of the drying agent from the semiconductor substrate.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: April 6, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, John L. Klocke, Paul McHugh, Stuart Crane, Richard W. Plavidal
  • Publication number: 20210017665
    Abstract: Cleaning substrates or electroplating system components may include methods of rinsing a substrate at a semiconductor plating chamber. The methods may include moving a head from a plating bath to a first position. The head may include a substrate coupled with the head. The methods may include rotating the head for a first period of time to sling bath fluid back into the plating bath. A residual amount of bath fluid may remain. The methods may include delivering a first fluid to the substrate from a first fluid nozzle to at least partially expel the residual amount of bath fluid back into the plating bath. The methods may include moving the head to a second position. The methods may include rotating the head for a second period of time. The methods may also include delivering a second fluid across the substrate from a second fluid nozzle.
    Type: Application
    Filed: July 16, 2019
    Publication date: January 21, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Sam Lee, Kyle M. Hanson, Eric J. Bergman
  • Publication number: 20200399779
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Application
    Filed: June 22, 2019
    Publication date: December 24, 2020
    Inventors: Eric J. Bergman, Stuart Hunt Crane, Tricia A. Youngbull, Timothy G. Stolt
  • Patent number: 10840104
    Abstract: Methods of etching a semiconductor substrate may include applying an etchant to the semiconductor substrate. The semiconductor substrate may include an exposed region of an oxygen-containing material and an exposed region of a nitrogen-containing material. The methods may include heating the semiconductor substrate from a first temperature to a second temperature. The methods may include maintaining the semiconductor substrate at the second temperature for a period of time sufficient to perform an etch of the nitrogen-containing material relative to the oxygen-containing material. The methods may also include quenching the etch subsequent the period of time.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: November 17, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, John L. Klocke, Charles Sharbono, Kyle Moran Hanson, Paul McHugh
  • Publication number: 20200338250
    Abstract: Tubing protectors, systems including tubing protection, and methods for protecting tubing, are disclosed, such as for protecting tubing connected between a patient and a dialysis machine (e.g., peritoneal dialysis machine) during a dialysis treatment. A tubing protector may include a tubing sheath attachable to a patient. The sheath may include a first portion for receiving and protecting a length of tubing extendible in the sheath, such as to minimize collapse, kinking, blockage, or combinations thereof, along the length of the tubing. A second portion may comprise a flexible material and enclose the first portion. The first portion may comprise a resilient material, which allows for movement in the sheath and has a strength to allow for reorientation of the tubing, while withstanding deformation of the tubing along the length. The first portion may be a coil, a plurality of rings, a woven mesh, or a solid tube, or combinations thereof.
    Type: Application
    Filed: April 23, 2019
    Publication date: October 29, 2020
    Inventors: David J. Yuds, Eric J. Bergman, Maria T. Tamayo-Coffey, Jonathan F. Leclerc, Jessica M. Steuber
  • Patent number: 10546762
    Abstract: Methods of drying a semiconductor substrate may include applying a drying agent to a semiconductor substrate, where the drying agent wets the semiconductor substrate. The methods may include heating a chamber housing the semiconductor substrate to a temperature above an atmospheric pressure boiling point of the drying agent until a vapor-liquid equilibrium of the drying agent within the chamber has been reached. The methods may further include venting the chamber, where the venting vaporizes the liquid phase of the drying agent from the semiconductor substrate.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: January 28, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, John L. Klocke, Paul McHugh, Stuart Crane, Richard W. Plavidal
  • Publication number: 20190321861
    Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 24, 2019
    Applicant: Applied Materials, Inc.
    Inventors: Joseph A. Jonathan, Kyle M. Hanson, Jason Rye, James Brown, Greg Wilson, Eric J. Bergman, Tricia A. Youngbull, Timothy Gale Stolt
  • Publication number: 20190301049
    Abstract: Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 3, 2019
    Applicant: Applied Materials, Inc.
    Inventors: Nolan Zimmerman, Greg Wilson, Andrew Anten, Richard W. Plavidal, Eric J. Bergman, Tricia Youngbull, Timothy Gale Stolt, Sam Lee