Abstract: A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a capacitor to decouple the power supply to the die. One of the bodies and respective finger provides one of power supply and ground connections for wire bonding with the die, and the other of the bodies provides the other of power supply and ground connections for wire bonding with the die. The first body includes a die paddle for supporting the die, and the second body includes a plate for overlaying the paddle with the insulator disposed between the paddle and plate, thereby providing an electrical decoupling effect therebetween upon supplying power and ground connections, respectively.

Abstract: The present invention is directed to a transition delay circuit. The transition delay circuit includes a delay circuit which is responsive to an input signal. The transition delay circuit produces an output signal at a common node. The transition delay circuit also includes a first MOS capacitor connected between the input signal and the common node and a second MOS capacitor connected between the input signal and the common node. A method for delaying an input signal to a buffer circuit is also disclosed.

Abstract: An integrated circuit, including but not limited to a memory device, receives an externally provided voltage signal and selectively adjusts the timing of internal control signals. An external signal selects between two possible pre-determined delay paths. The delay paths are adjusted using fuse circuitry which can be programmed by the manufacturer prior to implementation by a user. The delay path adjustment feature is particularly applicable to adjusting output signal timing to allow the integrated circuit to be operated in an environment which requires slower communications speeds. The same integrated circuit, therefore, can also be implemented in an environment which allows for faster communications speeds.

Abstract: A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a capacitor to decouple the power supply to the die. One of the bodies and respective finger provides one of power supply and ground connections for wire bonding with the die, and the other of the bodies provides the other of power supply and ground connections for wire bonding with the die. The first body includes a die paddle for supporting the die, and the second body includes a plate for overlaying the paddle with the insulator disposed between the paddle and plate, thereby providing an electrical decoupling effect therebetween upon supplying power and ground connections, respectively.

Abstract: The present invention is directed to a transition delay circuit. The transition delay circuit includes a delay circuit which is responsive to an input signal. The transition delay circuit produces an output signal at a common node. The transition delay circuit also includes a first MOS capacitor connected between the input signal and the common node and a second MOS capacitor connected between the input signal and the common node. A method for delaying an input signal to a buffer circuit is also disclosed.

Abstract: The present invention provides a method for controlling a timing of a digital component having an impedance-input terminal. The method includes determining an impedance level present at the impedance-input terminal, and delaying the timing of the digital component based on the impedance level. The present invention also provides a digital component and a system, where the digital component includes an impedance-input terminal and an impedance matching circuit that is capable of determining an impedance level present at the impedance-input terminal. The digital component also includes a delay circuit that is capable of delaying a timing of the digital component based on the impedance level.

Abstract: The present invention is directed to a transition delay circuit. The transition delay circuit includes a delay circuit which is responsive to an input signal. The transition delay circuit produces an output signal at a common node. The transition delay circuit also includes a first MOS capacitor connected between the input signal and the common node and a second MOS capacitor connected between the input signal and the common node. A method for delaying an input signal to a buffer circuit is also disclosed.

Abstract: A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a capacitor to decouple the power supply to the die. One of the bodies and respective finger provides one of power supply and ground connections for wire bonding with the die, and the other of the bodies provides the other of power supply and ground connections for wire bonding with the die. The first body includes a die paddle for supporting the die, and the second body includes a plate for overlaying the paddle with the insulator disposed between the paddle and plate, thereby providing an electrical decoupling effect therebetween upon supplying power and ground connections, respectively.

Abstract: A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a capacitor to decouple the power supply to the die. One of the bodies and respective finger provides one of power supply and ground connections for wire bonding with the die, and the other of the bodies provides the other of power supply and ground connections for wire bonding with the die. The first body includes a die paddle for supporting the die, and the second body includes a plate for overlaying the paddle with the insulator disposed between the paddle and plate, thereby providing an electrical decoupling effect therebetween upon supplying power and ground connections, respectively.

Abstract: A multi-layer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main lead finger extending from each body. The bodies act as a capacitor to decouple the power supply to the die. One of the bodies and respective finger provides one of power supply and ground connections for wire bonding with the die, and the other of the bodies provides the other of power supply and ground connections for wire bonding with the die. The first body includes a die paddle for supporting the die, and the second body includes a plate for overlaying the paddle with the insulator disposed between the paddle and plate, thereby providing an electrical decoupling effect therebetween upon supplying power and ground connections, respectively.