Abstract: A method for bonding a first substrate to a second substrate including the steps of: making contact of a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, as a result of which a common contact area is formed; and producing a bond interconnection between the first substrate and the second substrate outside the common contact area. The invention also relates to a corresponding device and a substrate composite of a first substrate and a second substrate, in which a first contact area of the first substrate with a second contact area of the second substrate, which second area is aligned parallel to the first contact area, forms a common contact area, outside the common contact area there being a bond interconnection between the first substrate and the second substrate.

Abstract: A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the substrate; a carrier substrate holding means for attaching the carrier substrate; detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate; aligning means for aligning the substrate relative to the carrier substrate; and contacting means for bringing the substrate into contact with the carrier substrate.

Abstract: The invention relates to a substrate for producing a substrate-product substrate combination by aligning, bringing into contact, and bonding a contact side of the large-area substrate to a support surface of a carrier substrate, whereby the substrate has a diameter d1, which can be reduced during back-thinning.

Abstract: This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens.

Abstract: A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers (2, 3), wherein a bond pressure is applied in succession to partial sections of the joining surface V.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.

Abstract: The invention relates to a device for loosening a polymer layer from a surface of a substrate.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers (2, 3), wherein a bond pressure is applied in succession to partial sections of the joining surface V.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: A method of producing a nanopattern on an upper side and a lower side of a disc.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.

Abstract: The present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate. According to the present invention, the coating is performed in a vacuum chamber. The pressure level in the vacuum chamber is elevated during or after the charging of the vacuum chamber with coating substance.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.