Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: The invention relates to a method and a device (1) for bonding wafers (6, 9). Here at least one wafer surface is first wetted with a molecular dipolar compound, whereupon the wafers are brought into contact with each other. The bonding of the wafers then takes place by means of microwave irradiation.

Abstract: The invention relates to an apparatus for imprinting and/or embossing substrates (7), in particular semiconductor substrates or wafers, having: a receiving unit (5) for receiving the substrate (7) in a working space (13), an adjusting device (2, 3, 4) for adjusting the substrate (7) in relation to an embossing and/or printing punch (10), whereby for a process that is as contamination-free as possible and for a manufacture of the apparatus that is as favorable as possible the receiving unit (5) is designed so as to separate the working space (13) from the environment.

Abstract: The invention relates to a method for bonding wafers along their corresponding surfaces.

Abstract: The present invention relates to a device (1) and a method for coating a microstructured and/or nanostructured structured substrate (8). According to the present invention, the coating is performed in a vacuum chamber (3). The pressure level in the vacuum chamber (3) is elevated during or after the charging of the vacuum chamber (3) with coating substance.

Abstract: The invention relates to a device for applying and/or detaching a wafer to/from a carrier with a deformable membrane which can be aligned parallel to the contact surface of the wafer, with one contact side for at least partial contact-making with the contact surface, deformation means which are located backward to the contact side for deformation of the membrane which can be controlled in a defined manner and adhesion means for adhesion of the wafer to the membrane and process for detaching and/or applying a wafer to/from a carrier with a corresponding device.

Abstract: The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.

Abstract: The invention relates to a stamp comprising a nanostructure for introducing and/or applying nanostructures into/onto components as well as a device and a method for producing said stamp. The inventive stamp is provided with a rigid support for the nanostamping structure while the nanostamping structure is joined to the support.

Abstract: The invention relates to a process and a device for bonding at least two substrates (1, 2), in particular semiconductor substrates or wafers, having the following features: a) a lower pressure plate (5) for holding the substrates (1, 2) and transferring pressure and, in particular, heat to the substrates (1, 2), b) an upper pressure plate (6) located opposite the lower pressure plate (5) for transferring pressure and, in particular, heat to the substrates (1, 2), c) heating means (7, 8) for heating up the substrates (1, 2), in particular to temperatures above 250° C., and d) pressure charging means, in particular an actuator (9), for charging the lower (5) and/or upper pressure plate (6) with a pressing force F, in particular higher than 500 N, preferably higher than 1,000 N. According to the invention, the upper pressure plate (6) and/or the lower pressure plate (5) are substantially free from the chemical elements Ti and Mo at least on one substrate contact surface (5o, 6o) facing the substrates.

Abstract: The invention concerns a device for transferring structures which are provided in a mask onto a substrate, with at least one illumination device, for homogeneous illumination of a section of the mask, and with a mask holding device, for holding a mask in a mask plane which is defined by an X axis and a Y axis which is perpendicular to it, and with at least one lens device, which is arranged on the side of the mask plane facing away from the illumination device, for mapping the structures onto the substrate, and with a substrate holding device, for holding the substrate in a substrate plane which is parallel to the mask plane and at a distance from the lens device, and with means for synchronous movement of the illumination device and lens device in parallel, relative to the mask plane and substrate plane, along the X axis and/or along the Y axis.

Abstract: The invention relates to an apparatus for imprinting and/or embossing substrates (7), in particular semiconductor substrates or wafers, having: a receiving unit (5) for receiving the substrate (7) in a working space (13), an adjusting device (2, 3, 4) for adjusting the substrate (7) in relation to an embossing and/or printing punch (10), whereby for a process that is as contamination-free as possible and for a manufacture of the apparatus that is as favourable as possible the receiving unit (5) is designed so as to separate the working space (13) from the environment.

Abstract: An adjusting device with a mounting fixture (4) for mounting a wafer (2) on a mounting side (4a) of the mounting fixture (4), whereby the mounting fixture has at least one through-hole (5) directed essentially orthogonal to the mounting side (4a), is characterised in that the through-hole (5) on the mounting side (4a) has a smaller cross-section than on the entrance side (4b) of the through-hole (5) facing away from the mounting side (4a).

Abstract: The invention relates to a method and a device according to the preambles of claims 1 and 10, and also to the use of a nanopatterned die, a disc with a defined nanopattern and a hard disk drive comprising a disc of this type. In order to propose a more rapidly operating device as well as a corresponding method in which the smallest-possible patterns can be applied to discs, and in order to provide discs, which are produced as cost-effectively as possible, for hard disk drives, said discs having smaller patterns and thus being able to be produced rapidly and cost-effectively, the invention proposes using microcontact printing (?CP) in the production of micropatterned and/or nanopatterned products/substrates of this type.

Abstract: The invention relates to a process and a device for bonding at least two substrates (1, 2), in particular semiconductor substrates or wafers, having the following features: a) a lower pressure plate (5) for holding the substrates (1, 2) and transferring pressure and, in particular, heat to the substrates (1, 2), b) an upper pressure plate (6) located opposite the lower pressure plate (5) for transferring pressure and, in particular, heat to the substrates (1, 2), c) heating means (7, 8) for heating up the substrates (1, 2), in particular to temperatures above 250° C., and d) pressure charging means, in particular an actuator (9), for charging the lower (5) and/or upper pressure plate (6) with a pressing force F, in particular higher than 500 N, preferably higher than 1,000 N. According to the invention, the upper pressure plate (6) and/or the lower pressure plate (5) are substantially free from the chemical elements Ti and Mo at least on one substrate contact surface (5o, 6o) facing the substrates.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. According to the invention, at least one of the holding instruments (1, 7), preferably both holding instruments (1, 7) respectively, comprises at least one gel film (2, 8) for holding the associated wafer (5, 9). The invention furthermore relates to the use of a gel film for holding integral wafers.

Abstract: The present invention relates to a device (1) and a method for coating a microstructured and/or nanostructured structural substrate (8). According to the present invention, the coating is performed in a vacuum chamber (3). The pressure level in the vacuum chamber (3) is elevated during or after the charging of the vacuum chamber (3) with coating substance.