Abstract: A substrate can efficiently be manufactured by separating the alignment and the actual processing when an alignment mark is provided, which is fixed with respect to the substrate and when position information on a position of a process area on the substrate is retrieved with respect to the alignment mark before the substrate is processed. During the processing alignment can then be performed by redetermining the position of the alignment mark only once and by using the stored position information on the position of the process area.

Abstract: The present invention relates to an alignment device for aligning an object in a plane.

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: The invention relates to a method and a device (1) for bonding wafers (6, 9). Here at least one wafer surface is first wetted with a molecular dipolar compound, whereupon the wafers are brought into contact with each other. The bonding of the wafers then takes place by means of microwave irradiation.

Abstract: An adjusting device with a mounting fixture (4) for mounting a wafer (2) on a mounting side (4a) of the mounting fixture (4), whereby the mounting fixture has at least one through-hole (5) directed essentially orthogonal to the mounting side (4a), is characterised in that the through-hole (5) on the mounting side (4a) has a smaller cross-section than on the entrance side (4b) of the through-hole (5) facing away from the mounting side (4a).

Abstract: The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.

Abstract: The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.

Abstract: The present invention relates to an alignment device for aligning an object in a plane.

Abstract: The present invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.

Abstract: A device for forming a surface structure on a wafer. The device includes a support (18) for receiving the wafer (10), and a holder (20) that accommodates a stamp (14). The stamp (14) has a profiling (16) corresponding to the surface structure to be formed on the wafer. The profiling (16) has at least one section and/or at least one additional adjusting mark that is repeated in a direction of movement of the stamp (14).

Abstract: The invention concerns a device for detaching a carrier that has been temporarily fixed on the top-most surface of a semi-conductor wafer from the semi-conductor wafer.

Abstract: An adjustment table for aligning a body in a horizontal plane. The adjustable table includes an external frame, an intermediate frame moveable in a first horizontal direction in the external frame along a first path, and a holding unit for the body movable in a second horizontal direction that is perpendicular to the first horizontal direction in the intermediate frame along a second path. The intermediate frame can be positioned according to the external frame via a first adjustable device pivoted/hinged to the intermediate frame at a freely definable position along the first path. The holding unit can be positioned according to the intermediate frame via a second adjustment device pivoted/hinged to the holding unit at a freely definable position along the second path.

Abstract: The invention relates to a device comprising a carrier for accommodating a wafer within a wafer treatment device.

Abstract: The invention concerns an adjustment table for aligning a body in a horizontal plane.

Abstract: The invention concerns a device for detaching a carrier that has been temporarily fixed on the top-most surface of a semi-conductor wafer from the semi-conductor wafer.

Abstract: In an apparatus for coating substrates with materials, particularly for lacquering Si-wafers (9) with photosensitive material, comprising a treating chamber (1,16) holding a carrier (10) (chuck) for the substrate to be treated and at least one atomizing nozzle (2) generating a spray jet of the coating material, which may be dosed and which is directed towards the substrate, and a propellant gas, additional guiding and, respectively or, processing devices (6) are arranged between the atomizing nozzle or nozzles (2) and the substrate carrier (10) in the treating chamber (1, 16), which devices comprise nozzles or swirl generators charged with compressed gas or compressed gas and a solvent, and/or centrifugal disks, small turbines, or the like, and produce the spray jet directed towards the substrate from the spray mist generated by the atomizing nozzle or nozzles, for additionally influencing and controlling the spray jet and thereby to improve the quality of the material application.

Abstract: An apparatus for the chemical treatment of disc-shaped semiconduct or substrates comprises a fluid-tight treatment chamber, a carrier for holding a disc-shaped substrate in the chamber, and an elongated spraying head having a plurality of nozzles for applying a fluid to at least one surface of the substrate. The spraying head is adjustably mounted in the treatment chamber and has a length corresponding at least to the diameter of the disc-shaped substrate. Fluid inlet conduits have portions leading from outside the treatment chamber into the chamber to the nozzles, and these fluid inlet conduit portions are adjustable with the spraying head. An adjustment drive displaces the spraying head transversely relative to the substrate over the surface thereof whereby the nozzles sweep over the surface in substantially parallel tracks, and at least one outlet is connected to a suction device for removing the applied fluid from the treatment chamber.

Abstract: In the method for the aligned joining of wafers (8, 11), the wafers (8, 11) are adjusted to a parallel position of their sides facing towards each other, are aligned according to alignment marks provided on these sides, and are then joined in a processing station (1). Both wafers (8, 11) are mounted on substrate carriers (5, 10), of which the one can be moved in only one direction from the processing station (1) into a measuring station (2), whereas the other one can in addition be adjusted in two further coordinate directions and can slightly be rotated about a vertical axis. In the measuring station there are provided microscope units with coaxial lenses (26, 27) facing towards each other. Upon introducing the first wafer (8), the microscope units are adjusted to its alignment marks.