Abstract: Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens.

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.

Abstract: The invention concerns a device for transferring structures which are provided in a mask onto a substrate, with at least one illumination device, for homogeneous illumination of a section of the mask, and with a mask holding device, for holding a mask in a mask plane which is defined by an X axis and a Y axis which is perpendicular to it, and with at least one lens device, which is arranged on the side of the mask plane facing away from the illumination device, for mapping the structures onto the substrate, and with a substrate holding device, for holding the substrate in a substrate plane which is parallel to the mask plane and at a distance from the lens device, and with means for synchronous movement of the illumination device and lens device in parallel, relative to the mask plane and substrate plane, along the X axis and/or along the Y axis.

Abstract: The present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate. According to the present invention, the coating is performed in a vacuum chamber. The pressure level in the vacuum chamber is elevated during or after the charging of the vacuum chamber with coating substance.

Abstract: The invention relates to a device for applying and/or detaching a wafer to/from a carrier with a deformable membrane which can be aligned parallel to the contact surface of the wafer, with one contact side for at least partial contact-making with the contact surface, deformation means which are located backward to the contact side for deformation of the membrane which can be controlled in a defined manner and adhesion means for adhesion of the wafer to the membrane and process for detaching and/or applying a wafer to/from a carrier with a corresponding device.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: The invention relates to a method and a device according to the preambles of claims 1 and 10, and also to the use of a nanopatterned die, a disc with a defined nanopattern and a hard disk drive comprising a disc of this type. In order to propose a more rapidly operating device as well as a corresponding method in which the smallest-possible patterns can be applied to discs, and in order to provide discs, which are produced as cost-effectively as possible, for hard disk drives, said discs having smaller patterns and thus being able to be produced rapidly and cost-effectively, the invention proposes using microcontact printing (?CP) in the production of micropatterned and/or nanopatterned products/substrates of this type.

Abstract: A method of producing a nanopattern on an upper side and a lower side of a disc.

Abstract: The invention relates to a device having a first holding instrument (1) for a first wafer (5) and having a second holding instrument (7) for a second wafer (9) arrangeable parallel to the first wafer (5), the two holding instruments (1, 7) being fixable relative to one another. According to the invention, at least one of the holding instruments (1, 7), preferably both holding instruments (1, 7) respectively, comprises at least one gel film (2, 8) for holding the associated wafer (5, 9). The invention furthermore relates to the use of a gel film for holding integral wafers.

Abstract: Device for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer with: a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer, the connection release means being made to work in a temperature range from 0 to 350° C., especially from 10 to 200° C., preferably from 20 to 80° C., and more preferably at ambient temperature.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: The invention relates to a device for loosening a polymer layer from a surface of a substrate.

Abstract: The invention relates to a method for bonding wafers along their corresponding surfaces.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.