Patents by Inventor Eun-Ji Kim

Eun-Ji Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11837310
    Abstract: The present disclosure relates to a memory device for correcting a pulse duty ratio and a memory system including the same, and relates to a memory device which corrects the duty ratio of a primary pulse of a memory device control signal, and a memory system including the same.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: December 5, 2023
    Assignee: SK hynix Inc.
    Inventors: Jaehyeong Hong, In Seok Kong, Gwan Woo Kim, Jae Young Park, Kwan Su Shon, Soon Sung An, Daeho Yang, Sung Hwa Ok, Junseo Jang, Yo Han Jeong, Eun Ji Choi
  • Publication number: 20230344008
    Abstract: Disclosed are a carbonate electrolyte and a lithium secondary battery including the same, in which the carbonate electrolyte includes a specific type of lithium salt at a high concentration equal to or greater than an appropriate level, thereby improving durability of the lithium secondary battery.
    Type: Application
    Filed: March 7, 2023
    Publication date: October 26, 2023
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Yeon Jong OH, Won Keun KIM, Eun Ji KWON, Kyu Ju KWAK, Dong Hyun LEE, Kyoung Han RYU, Samuel SEO
  • Publication number: 20230344009
    Abstract: Disclosed is an electrolyte for a secondary battery that includes an ionic liquid containing an ether functional group, thereby providing effects of lowering the viscosity and improving lithium ion conductivity even when a molecular weight is increased.
    Type: Application
    Filed: December 7, 2022
    Publication date: October 26, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Samuel Seo, Dong Hyun Lee, Kyoung Han Ryu, Yeon Jong Oh, Je Seung Lee, Dae Won Kim, Su Yeon Lee
  • Publication number: 20230331753
    Abstract: The present invention relates to a ligand compound represented by the following Formula 1, an organochromium compound, a catalyst system including the organochromium compound and a method for oligomerizing ethylene using the same: wherein Cy, and R1 to R4 are described herein.
    Type: Application
    Filed: September 15, 2021
    Publication date: October 19, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Seok Sun Kim, Tae Hee Kim, Seok Pil Sa, Se Young Kim, Eun Ji Shin
  • Publication number: 20230335520
    Abstract: Nonvolatile memory devices and methods of forming the same are provided. The devices may include an array region, an extension region, and a pad region and may include a substrate including a source plate. The devices may also include a mold structure that is on a front surface of the substrate and includes gate electrodes and mold insulating films alternately stacked in a stair shape in the extension region, a channel structure extending through the mold structure, a cell contact extending through the mold structure, a first insulator on the mold structure, a second insulator on a rear surface of the substrate, an pad on the second insulator, an contact extending through the first insulator, and a via formed by etching the second insulator and the substrate in the pad region. The source plate does not overlap the cell contact and the contact in a vertical direction.
    Type: Application
    Filed: January 4, 2023
    Publication date: October 19, 2023
    Inventors: EUN-JI KIM, Yoon Jo HWANG, Seo Jin PARK, Jun Seok BANG
  • Publication number: 20230321181
    Abstract: The present invention related to a composition for the prevention, improvement or treatment of allergic diseases or itching.
    Type: Application
    Filed: June 11, 2021
    Publication date: October 12, 2023
    Applicant: CAREGEN CO, LTD.
    Inventors: Yong Ji CHUNG, Eun Mi KIM, Seon Soo KIM
  • Publication number: 20230327247
    Abstract: Disclosed is a battery cell, which includes a battery case having an accommodation portion in which an electrode assembly is mounted, and a sealing portion formed by sealing an outer periphery thereof by heat fusion; an electrode lead electrically connected to an electrode tab included in the electrode assembly and protruding out of the battery case via the sealing portion; and a lead film located at a portion corresponding to the sealing portion in at least one of an upper portion and a lower portion of the electrode lead, wherein the lead film has a dented portion recessed toward an inside of the battery case, and the dented portion is opened toward an outside of the battery case.
    Type: Application
    Filed: January 11, 2022
    Publication date: October 12, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Hun-Hee Lim, Sang-Hun Kim, Soo-Ji Hwang, Min-Hyeong Kang, Eun-Suk Park, Hyung-Kyun Yu
  • Publication number: 20230327287
    Abstract: A separator and an electrochemical device including the same. The separator includes: a porous substrate; and a coating layer provided on one or both surfaces of the porous substrate. The coating layer includes inorganic particles, a particulate polymer binder, and an aqueous polymer binder, and the separator has a Ga/Gc value represented by the following Equation (1) of 0.2 to 0.75: (1) Ga/Gc, wherein Ga is a surface gloss of the coating layer, and Gc is a surface gloss of a coating layer of a separator in which the coating layer including 90.0 to 99.9 wt % of inorganic particles having an average particle diameter of 100 to 500 nm, BET of 15 to 20 m2/g, and a bulk density of 200 to 300 kg/m3 and 0.1 to 10 wt % of an aqueous polymer binder is provided at a thickness of 3 ?m or less on the porous substrate.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 12, 2023
    Inventors: Yun Bong KIM, Eun Ji OH, Chang Hee LEE, Kyu Young CHO
  • Publication number: 20230327196
    Abstract: A gel polymer electrolyte manufactured through an in-situ crosslinking reaction. The gel polymer electrolyte may include a porous membrane in which a fluorine-based compound, a lithium salt, and a crosslinking agent including a graphene-based compound are crosslinked.
    Type: Application
    Filed: November 16, 2022
    Publication date: October 12, 2023
    Inventors: Eun Ji Kwon, Won Keun Kim, Samuel Seo, Yeon Jong Oh, Kyu Ju Kwak, Kyoung Han Ryu, Dong Hyun Lee, Jong Chan Lee, Da Un Jeong, Jin Sol Yook, Dong Gi Hong
  • Publication number: 20230318025
    Abstract: The present disclosure relates to an electrolyte for a lithium secondary battery, including an ionic liquid, and a lithium secondary battery having the same. Specifically, the electrolyte may include an ionic liquid containing a cation and an anion, and a lithium salt, and the cation may include a functional group containing an oxygen element.
    Type: Application
    Filed: December 12, 2022
    Publication date: October 5, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Jin Hyeok Cha, Yeon Jong Oh, Ji Hye Baek, Dong Hyun Lee, Kyoung Han Ryu, Samuel Seo
  • Publication number: 20230298639
    Abstract: A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: EUN-JI KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
  • Publication number: 20230292521
    Abstract: A semiconductor memory device includes a peripheral circuit structure including a peripheral circuit and a first bonding pad, the first bonding pad connected to the peripheral circuit, a cell structure on the peripheral circuit structure, the cell structure including a second bonding pad bonded to the first bonding pad, and a pad structure on the cell structure. The cell structure includes a cell substrate having a first face, a second face opposite to the first face, a first contact plug extending through the cell substrate and connected to an electrode layer, and a second contact plug extending through the cell substrate and connected to the cell substrate. Each of the first contact plug and the second contact plug is connected to the pad structure, and a bypass via is in contact with the pad structure on the second face.
    Type: Application
    Filed: January 12, 2023
    Publication date: September 14, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Woo Yong JEON, Eun-Ji Kim, Ji Young Kim, Moo Rym Choi
  • Publication number: 20230285264
    Abstract: The present disclosure relates to a peptide consisting of an amino acid sequence of SEQ ID NO: 1, 2, 3, or 4, a pharmaceutical composition for preventing or treating skin disease including the peptide, a cosmetic composition for skin condition improvement including the peptide, a food composition for skin condition improvement including the peptide, a method of preventing or treating skin disease using the peptide, and a use of the peptide in preventing or treating skin disease or improving skin condition.
    Type: Application
    Filed: April 28, 2023
    Publication date: September 14, 2023
    Inventors: Yong Ji CHUNG, Eun Mi KIM, Eung Ji LEE
  • Publication number: 20230286965
    Abstract: The present disclosure relates to a compound derivative containing a 6-7 bicyclic ring and use thereof. The compound according to the present disclosure can be effectively used in the prevention or treatment of diseases caused by PRMT5 by acting as a PRMT5 inhibitor.
    Type: Application
    Filed: March 17, 2023
    Publication date: September 14, 2023
    Inventors: Yong Je SHIN, Jin Hee KIM, Jun LEE, Sook Kyung PARK, Ho Yeon LEE, Hyun Suk CHOI, Se Hyuk KIM, Eun Ji KANG, Ho Youl LEE, Soo Yeon JUNG
  • Publication number: 20230287208
    Abstract: The present invention relates to a thermoplastic resin composition including a polyolefin-polystyrene-based multi-block copolymer having a structure in which a polystyrene chain is attached to both ends of a polypropylene and polyolefin chain, and the thermoplastic resin composition according to the present invention exhibits high fluidity properties as well as soft feel and high restoring force.
    Type: Application
    Filed: August 6, 2021
    Publication date: September 14, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Tae Hee Kim, Ki Soo Lee, Eun Ji Shin, Seok Pil Sa, Seul Ki Im, Hyun Mo Lee, Ji Hyun Park, Yun Kon Kim, Seung Jung Yu
  • Publication number: 20230285263
    Abstract: The present disclosure relates to a peptide consisting of an amino acid sequence of SEQ ID NO: 1, 2, 3, or 4, a pharmaceutical composition for preventing or treating skin disease including the peptide, a cosmetic composition for skin condition improvement including the peptide, a food composition for skin condition improvement including the peptide, a method of preventing or treating skin disease using the peptide, and a use of the peptide in preventing or treating skin disease or improving skin condition.
    Type: Application
    Filed: April 28, 2023
    Publication date: September 14, 2023
    Inventors: Yong Ji CHUNG, Eun Mi KIM, Eung Ji LEE
  • Publication number: 20230287382
    Abstract: The present application relates to a variant of ornithine decarboxylase or protein, a polynucleotide encoding the same, a microorganism containing the same, and a method for producing putrescine using the same. The present invention achieves effects of increasing putrescine productivity, production efficiency or production selectivity, suppressing side reactions, and saving the cost involved in purifying putrescine.
    Type: Application
    Filed: December 24, 2019
    Publication date: September 14, 2023
    Inventors: Jaehun LEE, Hee-See MOON, Ae Ji JEON, Young Lyeol YANG, Byung-Gee KIM, Eun Young HONG
  • Publication number: 20230282475
    Abstract: A semiconductor device manufacturing method includes providing a first layer having a first surface, providing a second layer including a trench that exposes the first surface, onto the first layer, forming a first polymer layer that fills the trench, and performing a heat treatment process on the first polymer layer to form a second polymer layer. A second surface of the second layer is exposed by the trench, the first polymer layer includes a first portion being in contact with the first surface, and a second portion being in contact with the second surface, when the heat treatment process is performed, the first portion of the first polymer layer is decomposed, when the heat treatment process is performed, the second portion of the first polymer layer is cross-linked to form the second polymer layer, and physical properties of the first layer are different from physical properties of the second layer.
    Type: Application
    Filed: January 19, 2023
    Publication date: September 7, 2023
    Inventors: Eun Hyea KO, Hoon HAN, Byung Keun HWANG, Jae Woon KIM, Jeong Ho MUN, Younghun SUNG, Hyun-Ji SONG, Youn Joung CHO
  • Publication number: 20230282512
    Abstract: A semiconductor device is provided. The semiconductor device includes: a lower line structure; an upper interlayer insulating film provided on the lower line structure and having a trench formed therein, wherein the trench includes a wiring line trench and a via trench extending from the wiring line trench to the lower line structure; and an upper line structure provided in the line trench, wherein the upper line structure includes an upper barrier film and an upper filling film. The upper filling film includes a first sub-filling film in contact with the upper interlayer insulating film, and a second sub-filling film provided on the first sub-filling film. The first sub-filling film fills an entirety of the upper via trench and covers at least a portion of a bottom surface of the upper wiring line trench.
    Type: Application
    Filed: November 21, 2022
    Publication date: September 7, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Wook KIM, Seung Yong YOO, Eui Bok LEE, Jin Nam KIM, Eun-Ji JUNG
  • Patent number: 11744056
    Abstract: Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee-Won Kang, Nam-Su Kim, In-Hyuk Ko, Eun-Ji Moon