Patents by Inventor Eun-Ji Kim

Eun-Ji Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230335520
    Abstract: Nonvolatile memory devices and methods of forming the same are provided. The devices may include an array region, an extension region, and a pad region and may include a substrate including a source plate. The devices may also include a mold structure that is on a front surface of the substrate and includes gate electrodes and mold insulating films alternately stacked in a stair shape in the extension region, a channel structure extending through the mold structure, a cell contact extending through the mold structure, a first insulator on the mold structure, a second insulator on a rear surface of the substrate, an pad on the second insulator, an contact extending through the first insulator, and a via formed by etching the second insulator and the substrate in the pad region. The source plate does not overlap the cell contact and the contact in a vertical direction.
    Type: Application
    Filed: January 4, 2023
    Publication date: October 19, 2023
    Inventors: EUN-JI KIM, Yoon Jo HWANG, Seo Jin PARK, Jun Seok BANG
  • Publication number: 20230298639
    Abstract: A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: EUN-JI KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
  • Publication number: 20230292521
    Abstract: A semiconductor memory device includes a peripheral circuit structure including a peripheral circuit and a first bonding pad, the first bonding pad connected to the peripheral circuit, a cell structure on the peripheral circuit structure, the cell structure including a second bonding pad bonded to the first bonding pad, and a pad structure on the cell structure. The cell structure includes a cell substrate having a first face, a second face opposite to the first face, a first contact plug extending through the cell substrate and connected to an electrode layer, and a second contact plug extending through the cell substrate and connected to the cell substrate. Each of the first contact plug and the second contact plug is connected to the pad structure, and a bypass via is in contact with the pad structure on the second face.
    Type: Application
    Filed: January 12, 2023
    Publication date: September 14, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Woo Yong JEON, Eun-Ji Kim, Ji Young Kim, Moo Rym Choi
  • Patent number: 11742040
    Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
  • Patent number: 11736280
    Abstract: A quantum entity authentication apparatus and method. The quantum entity authentication apparatus includes a quantum state preparation unit for preparing an authentication quantum state that is generated based on an authentication key previously shared with an entity, a quantum channel verification unit for transmitting a quantum state, generated by performing an operation using a prestored unique operator on the authentication quantum state, to a quantum measurement device, and for verifying security of a quantum channel by using a result of Bell measurement and the authentication quantum state, the result of Bell measurement being revealed by the quantum measurement device for the quantum state, and a quantum entity authentication unit for, when the security of the quantum channel is verified, authenticating the entity using the result of the Bell measurement and the unique operator.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: August 22, 2023
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Changho Hong, Nayoung Kim, Osung Kwon, Younchang Jeong, Se Wan Ji, Eun Ji Kim, Seok Kim, Jingak Jang, Daesung Kwon
  • Publication number: 20230248703
    Abstract: The present invention provides a pharmaceutical composition for preventing or treating colitis comprising tegoprazan, which is a benzimidazole derivative compound, as an effective ingredient.
    Type: Application
    Filed: October 30, 2020
    Publication date: August 10, 2023
    Inventors: Jae Hee CHEON, Seung Won KIM, Mi Jeong SON, I Seul PARK, Dongkyu KIM, Bong Tae KIM, Eun Ji KIM, Jae Yong HAN
  • Patent number: 11705166
    Abstract: A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: July 18, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
  • Patent number: 11705386
    Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: July 18, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang Wuk Park, Sung Dong Cho, Eun Ji Kim, Hak Seung Lee, Dae Suk Lee, Dong Chan Lim, Sang Jun Park
  • Publication number: 20230202049
    Abstract: An embodiment device for controlling a service robot includes a communication device configured to communicate with the service robot and a controller configured to detect a present situation of the service robot by using various pieces of sensor information acquired from the service robot, determine a task appropriate to the present situation of the service robot, wherein the task includes one or more behaviors, and control the service robot based on an action set for each of the one or more behaviors of the task.
    Type: Application
    Filed: June 23, 2022
    Publication date: June 29, 2023
    Inventors: Sang Hyun Hwang, Il Yong Yoon, Eun Ji Kim, Si Hyun Joo, Gil Jin Yang
  • Publication number: 20230158001
    Abstract: The present invention relates to a pharmaceutical composition for preventing peptic ulcer and/or recurrence thereof containing a benzimidazole derivative. The pharmaceutical composition of the present invention may effectively prevent peptic ulcer and/or recurrence thereof, which may be caused by administration of a non-steroidal anti-inflammatory drug, for a long period of time without side effects.
    Type: Application
    Filed: April 13, 2021
    Publication date: May 25, 2023
    Inventors: Seokuee KIM, Yeong Hyeon JO, Eun Jee PARK, Bong Tae KIM, Heehyun KIM, Minja KANG, Geun Seog SONG, Naree SHIN, Eun Ji KIM, Eunbi CHO
  • Publication number: 20230045941
    Abstract: An electronic component is disclosed. The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.
    Type: Application
    Filed: June 22, 2022
    Publication date: February 16, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Yeop KIM, Kyong Nam HWANG, Eun Ji KIM, Do Hyun AN
  • Publication number: 20220297289
    Abstract: An information management apparatus may include a storage device that separately stores ontology information of an intelligent robot that provides a service and includes a plurality of repositories each having meta information. A storage management device sorts and stores ontology information of the intelligent robot in the plurality of repositories based on a prefix of the ontology information of the intelligent robot and the meta information.
    Type: Application
    Filed: November 8, 2021
    Publication date: September 22, 2022
    Inventors: Sang Hyun HWANG, Eun Ji KIM, Jae Ho LEE, Byung Gi CHOI
  • Patent number: 11410951
    Abstract: A three-dimensional semiconductor memory device is provided. The device may include a first substrate including a bit-line connection region and a word-line connection region, a cell array structure on the first substrate, a second substrate including a first core region and a second core region, which are respectively overlapped with the bit-line connection region and the word-line connection region, and a peripheral circuit structure on the second substrate.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungeun Choi, Eun-Ji Kim, Jong-Ho Moon, Hyoungyol Mun, Han-Sik Yoo, Kiseok Lee, Seungjae Jung, Taehyun An, Sangyeon Han, Yoosang Hwang
  • Publication number: 20220215892
    Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Inventors: Eun-ji KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
  • Publication number: 20220173016
    Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.
    Type: Application
    Filed: February 17, 2022
    Publication date: June 2, 2022
    Inventors: Kwang Wuk PARK, Sung Dong CHO, Eun Ji KIM, Hak Seung LEE, Dae Suk LEE, Dong Chan LIM, Sang Jun PARK
  • Patent number: 11342038
    Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
  • Patent number: 11316677
    Abstract: A quantum key distribution (QKD) node apparatus and a QKD method therein. The QKD node apparatus may include a QKD module for generating quantum keys and quantum key IDs, a quantum key synchronization management module for storing the quantum keys and the quantum key IDs as outbound and inbound quantum keys in a distributed manner and sharing the outbound and inbound quantum keys with a second QKD node apparatus, and a quantum key orchestration module for delivering a master key and a master key ID to a secure application connected therewith in response to a request for the master key with the ID of a second secure application and delivering a packet including the master key encrypted with the outbound quantum key shared with the second QKD node apparatus, the master key ID, and a quantum key ID, to the second QKD node apparatus.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: April 26, 2022
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Haeng-Seok Ko, Se Wan Ji, Younchang Jeong, Osung Kwon, Seok Kim, Eun Ji Kim, Changho Hong, Jingak Jang, Daesung Kwon
  • Patent number: 11289402
    Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: March 29, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwang Wuk Park, Sung Dong Cho, Eun Ji Kim, Hak Seung Lee, Dae Suk Lee, Dong Chan Lim, Sang Jun Park
  • Publication number: 20220081482
    Abstract: The present invention relates to a pharmaceutical composition for preventing or treating cancer comprising: as active ingredients, (1) an immune checkpoint inhibitor; (2) a biguanide-based compound or a pharmaceutically acceptable salt thereof; (3) 2-deoxy-D-glucose; or further comprising: (4) inositol hexaphosphate or a pharmaceutically acceptable salt thereof, inositol, or a mixture thereof. The compositions according to the present invention not only increase the indicants to various carcinomas for immune checkpoint inhibitors with limited indicants, but also exhibit a synergistic anti-cancer effect by appropriately combining specific drugs, thereby maximizing a therapeutic effect and killing only cancer cells without side effects. Therefore, the compositions of the present invention may be usefully used as anticancer agents for preventing or treating cancer.
    Type: Application
    Filed: December 30, 2019
    Publication date: March 17, 2022
    Inventors: Man-Chul Suh, Yieun Jung, Eun Ji Kim, Jae In Jung
  • Patent number: 11268215
    Abstract: Provided is a method of producing a carbon fiber, the method including: a) adding an acrylonitrile-based polymer solution to a solution containing a glycol-based compound having a boiling point of 180 to 210° C. to precipitate an acrylonitrile-based polymer; b) melt spinning the acrylonitrile-based polymer to obtain a spun fiber; and c) performing stabilization and carbonization on the spun fiber to obtain a carbon fiber.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: March 8, 2022
    Assignee: HPK INC.
    Inventors: Chang Hyun Cho, Chang Se Woo, Kap Seung Yang, Chang Ha Lim, Sun Ho Choe, Hong Min Kim, Kyung Ae Oh, Eun Ji Kim