Abstract: A semiconductor structure is provided. The semiconductor structure includes: a fin heat-dissipation region on a substrate; a fin channel part on the fin heat-dissipation region, and an isolation structure on the substrate. A width of the fin channel part is smaller than a width of the fin heat-dissipation region. A top surface of the isolation structure is coplanar with a top surface of the fin heat-dissipation region.

Abstract: Semiconductor device is provided. The semiconductor device includes a base substrate including a first region, a second region, and a third region, a first doped layer in the base substrate at the first region and a second doped layer in the base substrate at the third region, a first gate structure on the base substrate at the second region, a first dielectric layer on the base substrate, a first conductive layer on the first conductive layer and the second doped layer, a second conductive layer on a surface of the first conductive layer, and a third conductive layer on a contact region of the first gate structure. The second region is between the first region and the third region. The contact region is at a top of the first gate structure. A minimum distance between the second conductive layer and the third conductive layer is greater than zero.

Abstract: A semiconductor structure includes a doped single crystalline semiconductor material layer, a metal or metal alloy source contact layer located over a back side of the doped single crystalline semiconductor material layer, a dielectric isolation layer located over a front side of the doped single crystalline semiconductor material layer, an alternating stack of insulating layers and electrically conductive layers located over the dielectric isolation layer, a memory opening vertically extending through the alternating stack and the dielectric isolation layer and at least partially through the doped single crystalline semiconductor material layer, a memory film and a vertical semiconductor channel located within the memory opening, such that the vertical semiconductor channel vertically extends through the dielectric isolation layer and into the doped single crystalline semiconductor material layer, and a single crystalline semiconductor pedestal contacting the doped single crystalline semiconductor material l

Abstract: A memory device includes an alternating stack of insulating layers and electrically conductive layers, a memory opening vertically extending through the alternating stack, and memory opening fill structures located in the memory opening and including a vertical semiconductor channel, a dielectric material liner laterally surrounding the vertical semiconductor channel, and a vertical stack of discrete memory elements laterally surrounding the dielectric material liner. A subset of the insulating layers a lower insulating sublayer, an upper insulating sublayer overlying the lower insulating sublayer, and a center insulating sublayer located between and in contact with the lower insulating sublayer and the upper insulating sublayer.

Abstract: A semiconductor device is provided. The semiconductor device includes a semiconductor substrate; fins on the semiconductor substrate; an isolation layer formed on the semiconductor substrate and between adjacent fins; and gate structures on sides of the isolation layer. The isolation layer has a top surface higher than top surfaces of the fins and passes through the fins along a direction perpendicular to an extending direction of the fins and in parallel with a surface of the semiconductor substrate.

Abstract: Semiconductor structures is provided. The semiconductor structure includes a semiconductor substrate, a plurality of fins protruding from the semiconductor substrate, an isolation layer formed on the fins and with a bandgap greater than a bandgap of the fins, and a first channel layer formed on the isolation layer and isolated from the isolation layer.

Abstract: A miniaturized PPKTP crystal-based entanglement source system using multi-mode reception is provided, which includes a pump light source, a pump light transmission module, an entanglement device, a first collection device, and a second collection device. In the entanglement source system, entangled lights are received by using multi-mode optical fibers, and an entangled light processing scheme of combining a temporal filtering technology and a spatial filtering technology is applied into a collecting device at one side of the entanglement source system, to form asymmetric device structures in the entanglement source system, to enable multi-mode reception.

Abstract: Provided is a bispecific chimeric antigen receptor targeting CD19 and CD22, which comprises extracellular antigen binding domains of heavy-chain variable regions and light-chain variable regions of anti-CD19 and anti-CD22 antibodies. Further provided is a bispecific CAR-T cell targeting CD19 and CD22.

Abstract: A method of depositing a metal includes providing a structure a process chamber, and providing a metal fluoride gas and a growth-suppressant gas into the process chamber to deposit the metal over the structure. The metal may comprise a word line or another conductor of a three-dimensional memory device.

Abstract: A method of depositing a metal includes providing a structure a process chamber, and providing a metal fluoride gas and a growth-suppressant gas into the process chamber to deposit the metal over the structure. The metal may comprise a word line or another conductor of a three-dimensional memory device.

Abstract: A method of depositing a metal includes providing a structure a process chamber, and providing a metal fluoride gas and a growth-suppressant gas into the process chamber to deposit the metal over the structure. The metal may comprise a word line or another conductor of a three-dimensional memory device.

Abstract: A miniaturized PPKTP crystal-based entanglement source system using multi-mode reception is provided, which includes a pump light source, a pump light transmission module, an entanglement device, a first collection device, and a second collection device. In the entanglement source system, entangled lights are received by using multi-mode optical fibers, and an entangled light processing scheme of combining a temporal filtering technology and a spatial filtering technology is applied into a collecting device at one side of the entanglement source system, to form asymmetric device structures in the entanglement source system, to enable multi-mode reception.

Abstract: A semiconductor device is provided. The semiconductor device includes a base substrate; a first well region and a second well region in the base substrate; a gate electrode structure, sidewall spacers, a doped source layer and a doped drain layer over the base substrate; a dielectric layer on the base substrate; and an isolation layer in the dielectric layer. The dielectric layer covers sidewalls of the sidewall spacers, the doped source layer and the doped drain layer, and exposes a top surface of the gate electrode structure. The isolation layer is in the gate electrode structure of the second well region and the base substrate of the second well region, and adjacent to the sidewalls of the sidewall spacer over the second well region.

Abstract: A temperature prediction method and apparatus are provided. The method includes: determining a loss of a motor based on information about a motor controller, where the loss of the motor includes a first loss and a second loss, and the first loss is a loss generated by a fundamental wave component of a current of the motor (S210); and determining temperature of the motor based on the loss of the motor and a temperature prediction model (S220). According to the method, precision of temperature prediction of the motor can be improved.

Abstract: A method of forming a memory device includes forming an alternating stack of disposable material layers and silicon nitride layers over a substrate, forming a memory opening through the alternating stack, forming a memory film and a vertical semiconductor channel in the memory opening, where the memory film includes a continuous silicon nitride charge storage material layer and a tunneling dielectric layer, forming a backside trench through the alternating stack, forming laterally-extending cavities by removing the disposable material layers selective to the silicon nitride layers through the backside trench, oxidizing portions of the silicon nitride layers and the continuous silicon nitride charge storage material layer exposed in the laterally-extending cavities to form silicon oxide insulating layers and to separate the continuous silicon nitride charge storage material layer into a vertical stack of discrete silicon nitride charge storage material portions, and replacing remaining portions of the silicon

Abstract: Semiconductor devices are provided. An exemplary semiconductor device includes a semiconductor substrate having a first region. The first region includes a first middle region and a first edge region adjacent to and surrounding the first middle region; and a surface of the first middle region of the semiconductor substrate is higher than a surface of the first edge region of the semiconductor substrate. The semiconductor device also includes a plurality of first fins discretely formed on the first middle region of the semiconductor substrate; and an isolation structure formed on the first middle region of the semiconductor substrate and the first edge region of the semiconductor substrate and covering portions of sidewall surfaces of the first fins.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory stack structures vertically extending through the alternating stack, etch stop plates located in the staircase region, laterally and vertically spaced apart among one another, and overlying an end portion of a respective one of the electrically conductive layers, and contact via structures located in a staircase region, vertically extending through a respective one of the etch stop plates, and contacting a respective one of the electrically conductive layers.

Abstract: Semiconductor device is provided. The semiconductor device includes a base substrate including a first device region, a second device region, and a transition region separating the first region from the second region. A first work function layer is formed on the base substrate in the second region. A second work function layer is formed on the base substrate in the first region and the transition region, and on the first work function layer in the second region.

Abstract: A memory device includes an alternating stack of insulating layers and electrically conductive layers, a memory opening vertically extending through the alternating stack, and a memory opening fill structure located in the memory opening and including a vertical semiconductor channel and a memory film. The memory film includes a memory material layer having a straight inner cylindrical sidewall that vertically extends through a plurality of electrically conductive layers within the alternating stack without lateral undulation and a laterally-undulating outer sidewall having outward lateral protrusions at levels of the plurality of electrically conductive layers.

Abstract: A semiconductor device is provided in the present disclosure. The semiconductor device includes a substrate, a plurality of fins formed on the substrate, a dummy gate structure formed across the plurality of fins and on the substrate, a first sidewall spacer formed on a sidewall of the dummy gate structure, an interlayer dielectric layer formed on a surface portion of each fin adjacent to the first sidewall spacer to cover a lower portion of a sidewall of the first sidewall spacer, and a second sidewall spacer formed on a top of the interlayer dielectric layer and covering a remaining portion of the sidewall of the first sidewall spacer. The top of the second sidewall spacer is coplanar with a top of the first sidewall spacer and the top of the dummy gate structure.