Abstract: Pharmaceutical compositions comprising a RelA enzyme inhibitor and a bactericidal antibiotic, wherein said RelA enzyme inhibitor binds to the RelA enzyme in bacteria to reduce biofilm formation and to degrade biofilms that have been formed. The pharmaceutical compositions can be used to treat bacterial biofilm diseases.

Abstract: A light distribution system for freezer that includes a LED strip light disposed on a freezer door. The LED strip lamp includes a lamp holder, a strip-shaped polarizing lens, and a plurality of LED chips. The lamp holder includes a lens setting surface and a reflecting surface. The strip-shaped polarizing lens includes a plurality of optical axis, an incident surface, a first and second convex lens exit surfaces, and a transition surface. An angle between the illuminated surface and the optical axis includes an acute angle and the illuminated surface includes a main light region illuminated by the outgoing light of the first and second convex lens exit surfaces and a sub-light region illuminated by the reflected light from the reflecting surface.

Abstract: A lamp, including a lamp cover, the lamp cover is in the shape of a strip having openings at both ends, and the lamp cover is respectively provided with two side walls and a top surface along a direction away from the light emitting surface, and the two side walls and the top surface form an accommodating cavity; a PCB board, the PCB board being mounted in the accommodating cavity along the length direction of the lamp cover; the lamp also includes a conductive component connected to an external power supply, and the conductive component is electrically connected to the PCB board.

Abstract: The present disclosure provides a semiconductor device and a manufacturing method therefor. The manufacturing method for a semiconductor device is provided for forming through-holes in a semiconductor device, comprising: forming a plurality of shallow trench isolations in portions of a substrate corresponding to memory cell regions; forming a plurality of gates on surfaces of the portions of the substrate; forming spacers on side walls at both sides of the gates extending in the first direction; depositing a sacrificial layer on the memory cell region; removing portions of the sacrificial layer corresponding to the shallow trench isolations at memory cell drain, and depositing an isolation dielectric on the shallow trench isolations at the memory cell drain to form isolation strips; and removing the remaining sacrificial layer to form bottom through-holes in spaces formed after removing the remaining sacrificial layer.

Abstract: A lamp, including a lamp cover, the lamp cover is in the shape of a strip having openings at both ends, and the lamp cover is respectively provided with two side walls and a top surface along a direction away from the light emitting surface, and the two side walls and the top surface form an accommodating cavity; a PCB board, the PCB board being mounted in the accommodating cavity along the length direction of the lamp cover; the lamp also includes a conductive component connected to an external power supply, and the conductive component is electrically connected to the PCB board.

Abstract: A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S11, providing a MEMS sealing cap silicon substrate (100); step S12, forming n stacked mask layers (101, 102, 103) on the MEMS sealing cap silicon substrate (100), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D1, D2, D3); step S13, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S14, removing the current uppermost mask layer; step S15, repeating the step S13 and the step S14 until all the n mask layers are removed.

Abstract: The present invention relates to a lamp installation component comprising a clamping assembly for clamping on part to be clamped, and a mounting frame for assembling the lamp; the clamping assembly includes fixed part, abutting part, movable part and elastic part, and the fixed part is relatively fixed with the abutting part, and the movable part is slidably disposed between the fixed part and the abutting part, and the elastic part is held between the movable part and the abutting part, so that the movable part has a tendency to form a clamped state close to the fixed part; the mounting frame is fixedly connected to the abutting part. The lamp installation component has a simple structure and can be installed or disassembled with one hand, and is more convenient for use in a showcase or other small installation space.

Abstract: Semiconductor structures and fabrication methods are provided. An exemplary fabrication method includes providing a semiconductor substrate having at least a first region; forming a dielectric structure over the semiconductor substrate; forming a plurality of first openings in the dielectric structure in the first region by removing portions of the dielectric structure in the first region; forming a first barrier member in each of the plurality of first openings; forming second openings with sidewall surfaces exposing sidewall surfaces of the first barrier members by removing portions of the dielectric structure between adjacent first openings; and forming a second barrier member in each of the plurality of second openings.

Abstract: A strip lamp, characterized in that: the strip lamp comprises a groove body, a cover body covering the groove body, and at least one latching member disposed on the cover body, the groove body includes a first side wall, and a second side wall, the first side wall includes a blocking portion extending toward the second side wall in a section perpendicular to an extending direction of the groove body, the second side wall includes a latching edge extending toward the first side wall, and the latching member includes a body, a latching portion extending perpendicular to the body and engaging with the latching edge, and a V-shaped latching groove provided in cooperation with the blocking portion, so that the cover body can cover the cover body on the groove body without any fasteners, so that the assembly method is simple and convenient.

Abstract: A strip-shaped LED interconnected high-voltage lamp comprising an assembly groove, a lamp cover, a connector assembly, and a light source assembly. The assembly groove includes two wire assembly grooves. The wire assembly groove is curved and the central angle of the arc is greater than 180 degrees. The lamp cover is integrally formed with the assembly groove. The connector assembly includes a connector body that is inserted into the assembly groove, and two conductive sheets that are fixedly disposed in the connector body. The length of the conductive sheet in the extending direction of the assembly groove is greater than the length of the connector body and protrudes from both ends of the connector body. The conductive sheet coincides with a central axis of the wire assembly groove in an extending direction of the assembly groove.

Abstract: A light distribution system for freezer that includes a LED strip light disposed on a freezer door. The LED strip lamp includes a lamp holder, a strip-shaped polarizing lens, and a plurality of LED chips. The lamp holder includes a lens setting surface and a reflecting surface. The strip-shaped polarizing lens includes a plurality of optical axis, an incident surface, a first and second convex lens exit surfaces, and a transition surface. An angle between the illuminated surface and the optical axis includes an acute angle and the illuminated surface includes a main light region illuminated by the outgoing light of the first and second convex lens exit surfaces and a sub-light region illuminated by the reflected light from the reflecting surface.

Abstract: The present disclosure relates to a dielectrically isolated semiconductor device and a method for manufacturing the same. The dielectrically isolated semiconductor device includes a semiconductor substrate, a first semiconductor layer above the semiconductor substrate, a second semiconductor layer above the first semiconductor layer, a semiconductor island in the second semiconductor layer, and a first dielectric isolation layer surrounding a bottom and sidewalls of the semiconductor island. The first dielectric isolation layer includes a first portion which is formed from a portion of the first semiconductor layer and extending along the bottom of the semiconductor island, and a second portion which is formed from a portion of the second semiconductor layer and extending along the sidewalls of the semiconductor island. The dielectrically isolated semiconductor devices needs no an SOI wafer and reduces manufacturing cost.

Abstract: A method for processing software layout can include exporting layout setting information from design elements of a software; formatting the layout setting information, and storing it in a layout characteristic file; and importing the layout setting information in the layout characteristic file into design elements of another software. Layout information of each language can be stored in a customizable layout characteristic file.

Abstract: The present invention discloses an air purification apparatus for an indoor window vent, comprising an installing plate. Fixing blocks are welded on both sides of the installing plate. An air purification module is installed in the middle position of the installing plate. An air outlet apparatus is arranged on one side of the air purification module. The air purification module comprises an air duct. An active carbon filtering unit and a PM2.5 purification unit are respectively installed in the air duct. A filter mesh and a first fan are respectively arranged on one side of the active carbon filtering unit and the PM2.5 purification unit which are away from each other. A cleaning brush is vertically arranged on one side of the filter mesh away from the active carbon filtering unit. The present invention can seal window vents with different sizes, and has good purification effect.

Abstract: The present invention discloses a household intelligent soilless culture system, comprising a rectangular substrate. A U type bracket is vertically welded on both ends of the substrate. A U type sliding chute is formed in the bracket along a length direction. A sliding block is sleeved in the sliding chute. One end of the sliding block is hinged with a pull rod, and one end of the pull rod is sleeved with a casing pipe. One end of the casing pipe is welded with a connecting plate on both sides. Culture pipelines are installed in the bracket. A liquid inlet pipeline is installed on one side of the bracket along the vertical direction. A liquid storing tank is installed on a bottom of the liquid inlet pipeline. The present invention is suitable for installation and fixation in different positions, and effectively prevents plant roots from eroding.

Abstract: The invention discloses an irrigation apparatus for culturing organic vegetables, comprising a base, a regulating rod and an irrigation part. The regulating rod is fixed to one end of the base. One end of the regulating rod is connected with a rotating shaft through a bearing. One end of the rotating shaft is fixed with a secondary gear and a roller. A water storage tank is fixed to one end on the base. One end of the water storage tank is bolted with a water pump. A water outlet end of the water pump is connected with an irrigation pipe. In the invention, the height of the base is regulated through the regulating rod, and the roller is arranged on a bottom end of the regulating rod, thereby realizing movable and uniform irrigation of large area of organic vegetables. Irrigation mode is more flexible and efficient.

Abstract: A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S11, providing a MEMS sealing cap silicon substrate (100); step S12, forming n stacked mask layers (101, 102, 103) on the MEMS sealing cap silicon substrate (100), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D1, D2, D3); step S13, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S14, removing the current uppermost mask layer; step S15, repeating the step S13 and the step S14 until all the n mask layers are removed.

Abstract: A ultra-thin LED bar lights includes a bar house, a light module, a reflection film, a light guide plate, and a cover having a light transmittance less than 90%. An angle between the circuit board and the accessory placed board being larger than 80 degrees and less than 90 degrees. The light guide plate includes an incidence wall for receiving the emitted light of the light module, three reflective walls for reflecting light, and a diffusion surface contacting with the reflection film. A width of the diffusion surface of the light guide plate is between 3 times or 4 times the length or the maximum diameter of the LED chips and provides a plurality of light guide points thereon. The light guide points include a plurality of spaced apart circular dots, the total area of which is 50% to 55% of the total area of the diffusion surface.

Abstract: A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S11, providing a MEMS sealing cap silicon substrate (100); step S12, forming n stacked mask layers (101, 102, 103) on the MEMS sealing cap silicon substrate (100), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D1, D2, D3); step S13, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S14, removing the current uppermost mask layer; step S15, repeating the step S13 and the step S14 until all the n mask layers are removed.

Abstract: An LED lighting assembly structure includes a lamp housing, and an end cap. The lamp housing includes at least one slot. The end cap includes a lug cap, at least one through-hole, and at least one reinforcing rib, and at least one fastener. The reinforcing rib and the through-hole are partially coincident with each other in a cross section perpendicular to the central axis of the through-hole. When the fastener is screwed into the through-hole and the slot, it may either cut into the reinforcing rib, or the reinforcing rib is pressed against the lug cap, or both the reinforcing rib is pressed against the lug cap and the fastener cuts into the reinforcing rib. As a result, the strength between the fastener and the lamp frame is improved, and it is possible to make the lamp house smaller and thinner, which is advantageous in reducing the volume of the entire lamp.