Abstract: A non-volatile memory device includes a matrix memory plane with columns of memory words respectively formed on each row of the memory plane by groups of memory cells and control elements respectively associated with the memory words of each row. At least some of the control elements associated with the memory words of the corresponding row form at least one control block of B control elements disposed next to one another, adjacent to a memory block containing the B memory words disposed next to one another and associated with these B control elements, a first electrically-conducting link connecting one of the B control elements to all the control electrodes of the state transistors of the corresponding group of memory cells and B-1 second electrically-conducting link(s) respectively connecting the B-1 control element(s) to all the control electrodes of the state transistors of the B-1 corresponding group(s) of memory cells.

Abstract: In an embodiment, an electronic device for filtering an incoming digital signal includes several elementary filtering modules that include an elementary input configured to receive an incident elementary signal extracted from an incoming signal, an elementary output, and a dedicated capacitive circuit. The device further includes a resistive circuit common to all the elementary filtering modules and configured for cooperating with the capacitive circuit of each elementary filtering module in such a manner as to filter, on the respective elementary output, pulses of the incident elementary signal having a first voltage level and a duration less than a time constant and to deliver a filtered elementary signal on the elementary output.

Abstract: A semiconductor structure includes first and second source/drain region disposed in a semiconductor body and spaced from each other by a channel region. A gate electrode overlies the channel region and a capacitor electrode is disposed between the gate electrode and the channel region. A first gate dielectric is disposed between the gate electrode and the capacitor electrode and a second gate dielectric disposed between the capacitor electrode and the channel region. A first electrically conductive contact region is in electrical contact with the gate electrode and a second electrically conductive contact region in electrical contact with the capacitor electrode. The first and second contact regions are electrically isolated from one another.

Abstract: A memory device includes an input/output interface, a bus of SPI type coupled to the input/output interface, and a plurality of individual non-volatile memory devices connected to the bus of SPI type. The chip select inputs of each individual memory device are all connected to one and the same chip select wire of the SPI bus. The individual memory devices are further configured and controllable so as to behave, as seen by the input/output interface, as a single non-volatile memory device, the total memory space of which has a total memory capacity equal to the sum of the individual memory capacities of the individual devices.

Abstract: A read amplifier of a memory device has two current generators, an inverter, and five transistors. The inverter is connected to the second current generator. The first transistor has a gate connected to the read amplifier, a drain connected to the first current generator, and a source connected to a reference ground. The second transistor has a gate connected to the first current generator, a drain connected to a reference voltage, and a source connected to the gate of the first transistor. The third transistor has a drain connected to the first current generator and a source connected to the reference ground. The fourth transistor has a gate connected to the first current generator, a drain connected to the second current generator, and a source connected to the reference ground. The fifth transistor has a drain connected to the second current generator and a source connected to the reference voltage.

Abstract: A value representative of a duration of the low state of a synchronization signal on a bus is measured and then compared with a threshold value. The threshold value is stored in a memory and the measured value represents, in a first comparison, a longest duration of the low states of the synchronization signal.

Abstract: An EEPROM memory integrated circuit includes memory cells arranged in a memory plane. Each memory cell includes an access transistor in series with a state transistor. Each access transistor is coupled, via its source region, to the corresponding source line and each state transistor is coupled, via its drain region, to the corresponding bit line. The floating gate of each state transistor rests on a dielectric layer having a first part with a first thickness, and a second part with a second thickness that is less than the first thickness. The second part is located on the source side of the state transistor.

Abstract: A memory device includes a memory plane including a succession of neighboring semiconductor recesses of a first type of conductivity, wherein each semiconductor recess houses a plurality of memory words including a plurality of memory cells, wherein each memory cell includes a state transistor having a floating gate and a control gate. The memory device further includes a plurality of control gate selection transistors respectively allocated to each memory word of the plurality of memory words, wherein each control gate selection transistor is coupled to the control gates of the state transistors of the memory word to which the control gate selection transistor is allocated, wherein each control gate selection transistor is situated in and on a neighbor semiconductor recess of the semiconductor recess housing the memory word to which the control gate selection transistor is allocated.

Abstract: In an embodiment, a method is provided for controlling a level of a read current in a non-volatile memory that is powered by a supply voltage includes. A model current representative of an actual current able to flow during a readout through a read path of the memory is determined based on the value of the supply voltage. The model current is compared to a reference current having a reference value. A control signal is generated. The control signal is to control the generation of the read current having a level equal to the lowest value between a fraction of the value of the model current and the reference value.

Abstract: An electronic chip is provided that includes a plurality of first transistors electrically coupled to one another in parallel. A plurality of first isolating trenches is included in the electronic chip, and the first transistors are separated from one another by the first isolating trenches. Each of the first isolation trenches has a depth and a maximum width, and the depth depends on, or is a function of, the maximum width.

Abstract: An electronic chip includes first transistors connected in parallel so that gates of the first transistors are interconnected, drain areas of the first transistors are interconnected, and source areas of the first transistors are interconnected. The first transistors are separated from one another by first isolating trenches. The chip also includes second transistors and second isolating trenches. The second transistors are separated from one another by the second isolating trenches. The first isolating trenches have a maximum width that is smaller than a maximum width of all the second isolating trenches.

Abstract: A method of controlling a cycle for writing at least one data item to at least one memory slot of the electrically programmable and erasable read-only memory type disposed in an electronic circuit supplied by a supply voltage includes a controlled increase of the duration of the write cycle in the presence of a decrease in the supply voltage.

Abstract: An integrated circuit includes at least one input-output pad and a terminal intended to be connected to a source of a reference potential and further including a protection structure including a thyristor forward-connected between the pad and the terminal. The thyristor includes a first resistor between its cathode gate and the terminal. At least one Zener diode is disposed between the thyristor and the pad. The anode of the Zener diode is connected to the cathode gate of the thyristor and the cathode of the Zener diode is connected to the pad via at least one second resistor. The junction of the Zener diode is different from the junctions of the PNPN structure of the thyristor.

Abstract: A read amplifier of a memory device has two current generators, an inverter, and five transistors. The inverter is connected to the second current generator. The first transistor has a gate connected to the read amplifier, a drain connected to the first current generator, and a source connected to a reference ground. The second transistor has a gate connected to the first current generator, a drain connected to a reference voltage, and a source connected to the gate of the first transistor. The third transistor has a drain connected to the first current generator and a source connected to the reference ground. The fourth transistor has a gate connected to the first current generator, a drain connected to the second current generator, and a source connected to the reference ground. The fifth transistor has a drain connected to the second current generator and a source connected to the reference voltage.

Abstract: A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.

Abstract: In some embodiments, a buffer stage device includes a data input for receiving a data signal, a clock input for receiving a clock signal, a data output and a processor that is configured to deliver, to the data output, the data from the data signal in synchronism with clock cycles of the clock signal. The processor includes a first buffer module configured to deliver, to the data output, each datum in synchronism with a first edge of the clock signal and during a first half of a clock cycle, and a second buffer module configured to hold the datum at the data output during the second half of the clock cycle.

Abstract: A method of writing in a memory of the EEPROM type includes, in the presence of a string of new bytes to be written in the memory plane in at least one destination memory word already containing old bytes, a verification for each destination memory word whether or not the old bytes of this destination memory word must all be replaced with new bytes. The method also includes a reading of the old bytes of this destination memory word only if the old bytes must not all be replaced with new bytes.

Abstract: Some embodiments include a method for addressing an integrated circuit for a non-volatile memory of the EEPROM type on a bus of the I2C type. The memory includes J hardware-identification pins, with J being an integer lying between 1 and 3, which are assigned respective potentials defining an assignment code on J bits. The method includes a first mode of addressing used selectively when the assignment code is equal to a fixed reference code on J bits, and a second mode of addressing used selectively when the assignment code is different from the reference code. In the first mode, the memory plane of the non-volatile memory is addressed by a memory address contained in the last low-order bits of the slave address and in the first N bytes received. In the second mode, the memory plane is addressed by a memory address contained in the first N+1 bytes received.

Abstract: A method of controlling a cycle for writing at least one data item to at least one memory slot of the electrically programmable and erasable read-only memory type disposed in an electronic circuit supplied by a supply voltage includes a controlled increase of the duration of the write cycle in the presence of a decrease in the supply voltage.

Abstract: A method can be used for writing in a memory location of the electrically-erasable and programmable memory type. The memory location includes a first memory cell with a first transistor having a first gate dielectric underlying a first floating gate and a second memory cell with a second transistor having a second gate dielectric underlying a second floating gate that is connected to the first floating gate. In a first writing phase, an identical tunnel effect is implemented through the first gate dielectric and the second gate dielectric. In a second writing phase, a voltage across the first gate dielectric but not the second gate dielectric is increased.