Abstract: Word shift static random access memory (WS-SRAM) cell, word shift static random access memory (WS-SRAM) and method using the same employ dynamic storage mode switching to shift data. The WS-SRAM cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data, a dynamic/static (D/S) mode selector to selectably switch the WS-SRAM cell between the dynamic storage mode and a static storage mode, and a column selector to selectably determine whether or not the WS-SRAM cell accepts shifted data. The WS-SRAM includes a plurality of WS-SRAM cells arranged in an array and a controller to shift data. The method includes switching a storage mode and activating a column selector of, coupling data from an adjacent memory cell to, and storing the coupled data in, a selected WS-SRAM cell.

Abstract: Dynamic/static random access memory (D/SRAM) cell, block shift static random access memory (BS-SRAM) and method using the same employ dynamic storage mode and dynamic storage mode switching to shift data. The D/SRAM cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data, and a dynamic/static (D/S) mode selector to selectably switch the D/SRAM cell between the dynamic storage mode and a static storage mode. The BS-SRAM includes a plurality of D/SRAM cells arranged in an array and a controller to shift data from an adjacent D/SRAM cell in a second row of the array to a D/SRAM cell in a first row. The method includes switching the mode of, coupling data from an adjacent memory cell to, and storing the coupled data in, a selected D/SRAM cell.

Abstract: Dynamic/static random access memory (D/SRAM) cell, block shift static random access memory (BS-SRAM) and method using the same employ dynamic storage mode and dynamic storage mode switching to shift data. The D/SRAM cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data, and a dynamic/static (D/S) mode selector to selectably switch the D/SRAM cell between the dynamic storage mode and a static storage mode. The BS-SRAM includes a plurality of D/SRAM cells arranged in an array and a controller to shift data from an adjacent D/SRAM cell in a second row of the array to a D/SRAM cell in a first row. The method includes switching the mode of, coupling data from an adjacent memory cell to, and storing the coupled data in, a selected D/SRAM cell.

Abstract: Word shift static random access memory (WS-SRAM) cell, word shift static random access memory (WS-SRAM) and method using the same employ dynamic storage mode switching to shift data. The WS-SRAM cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data, a dynamic/static (D/S) mode selector to selectably switch the WS-SRAM cell between the dynamic storage mode and a static storage mode, and a column selector to selectably determine whether or not the WS-SRAM cell accepts shifted data. The WS-SRAM includes a plurality of WS-SRAM cells arranged in an array and a controller to shift data. The method includes switching a storage mode and activating a column selector of, coupling data from an adjacent memory cell to, and storing the coupled data in, a selected WS-SRAM cell.

Abstract: A stateful negative differential resistance device includes a first conductive electrode and a second conductive electrode. The device also includes a first material with a reversible, nonvolatile resistance that changes based on applied electrical energy and a second material comprising a differential resistance that is negative in a locally active region. The first material and second material are sandwiched between the first conductive electrode and second conductive electrode. A method for using a stateful NDR device includes applying programming energy to the stateful NDR device to set a state of the stateful NDR device to a predetermined state and removing electrical power from the stateful NDR device. Power-up energy is applied to the stateful NDR device such that the stateful NDR device returns to the predetermined state.

Abstract: A stateful negative differential resistance device includes a first conductive electrode and a second conductive electrode. The device also includes a first material with a reversible, nonvolatile resistance that changes based on applied electrical energy and a second material comprising a differential resistance that is negative in a locally active region. The first material and second material are sandwiched between the first conductive electrode and second conductive electrode. A method for using a stateful NDR device includes applying programming energy to the stateful NDR device to set a state of the stateful NDR device to a predetermined state and removing electrical power from the stateful NDR device. Power-up energy is applied to the stateful NDR device such that the stateful NDR device returns to the predetermined state.

Abstract: A data storage device includes non-volatile memory; and a read circuit for performing multi-sample read operations on the memory during a normal mode of operation. The read circuit includes a digital counter having an output that indicates a single bit (e.g., a sign-bit). The read circuit allows an external device (e.g., a memory tester) to supply test clock pulses to an input of the digital counter during a test mode. The test clock pulses can be counted to determine a state of the digital counter.

Abstract: A memory device and method of reading the memory device is disclosed. The memory device includes a first string of MRAM cells and a second string of MRAM cells. The first string of MRAM cells include a plurality of MRAM cells connected in series and the second string of MRAM cells include another plurality of MRAM cells connected in series. A common connection is controllably connectable to one end of the first string of MRAM cells, and to one end of the second string of MRAM cells.

Abstract: A digital current source used to mirror a reference current is provided. The digitally controlled analog current source multiplies a current from a master mirror transistor producing an output current that is a digitally controlled multiple of the reference current. The circuit comprises a plurality of one bit current mirror cells. Each one bit current mirror cell comprises a mirror transistor receiving an analog gate voltage from a master mirror transistor and providing a drain voltage, an operational amplifier configured to maintain the drain voltage for the mirror transistor equivalent to the analog gate voltage, and a switch configured to receive one control bit, the switch enabling current mirroring when the mirror voltage is substantially equivalent to the master mirror voltage. The digital current source further includes a common line summing element employed to receive and compile currents from each of the one bit current mirror cells.

Abstract: A method for making magnetic random access memories (MRAM) isolates each and every memory cell in an MRAM array during operation until selected. Some embodiments use series connected diodes for such electrical isolation. Only a selected one of the memory cells will then conduct current between respective ones of the bit and word lines. A better, more uniform distribution of read and data-write data access currents results to all the memory cells. In another embodiment, this improvement is used to increase the number of rows and columns to support a larger data array. In a further embodiment, such improvement is used to increase operating margins and reduce necessary data-write voltages and currents.

Abstract: A memory device includes a first layer of MRAM memory cells arranged in accordance with an MRAM architecture, a second layer of MRAM memory cells that is fabricated over the first layer of MRAM memory cells, and a common connection associated with the first layer of MRAM memory cells and the second layer of MRAM memory cells that facilitates operation of the memory device. The method of fabricating the memory device includes fabricating a first layer of MRAM memory cells arranged in accordance with an MRAM architecture, fabricating a second layer of MRAM memory cells over the first layer of MRAM memory cells, and fabricating a common connection associated with the first layer of MRAM memory cells and the second layer of MRAM memory cells that facilitates operation of the memory device.

Abstract: A memory storage device having an address control system is disclosed. The memory storage device includes memory cells and an address control system configured to decode a bit number which identifies a number of the memory cells which are selected in parallel. The memory cells selected in parallel correspond to least significant bits of an address which has a range that includes the memory cells.

Abstract: A flexible media magnetic printing system provides for data storage within flexible media imprinted with magnetic ink. In a particular embodiment, the printing system includes at least one reservoir of magnetic ink with magnetic particles capable of supporting high density data, and at least one reservoir of visible ink. The reservoirs are coupled to a print head including one or more ink-ejecting nozzles, which is removably or fixedly coupled to at least one magnetic read/write device. The magnetic read/write device tracks above the magnetic ink applied by the ink-ejecting nozzles to the flexible media. The magnetic read/write device writes to the magnetic ink by providing a magnetic field of sufficient intensity to re-orient the magnetic alignment within the ink to a known direction. The magnetic read/write device also reads data from flexible media, for example, paper or cloth that is imprinted with data-embedded magnetic ink.

Abstract: A method of performing a read operation from a first magnetic random access memory (MRAM) cell in a memory cell string that includes the first MRAM cell coupled to a second MRAM cell. The method includes providing a voltage to a first end of the first memory cell string that is closest to the first MRAM cell, providing a ground source to a second end of the first memory cell string that is opposite the first end, and determining whether a voltage change occurred at a node between the first and second MRAM cells in response to applying a write sense current to the first MRAM cell.

Abstract: A combined analog and digital calibration circuit and method for adjusting an output offset voltage of a differential amplifier circuit are provided. The circuit comprises a digitally controlled voltage divider positioned between at least one isolated well and a controllable voltage source, a controllable voltage source controlled by an initial constant current and a variable current, and a controller to modify the variable current to continuously adjust the back gate control voltage. The method comprises adjusting a control voltage of at least one of a pair of input transistors using a back gate control voltage, providing an analog current to establish a back gate control voltage, and altering the analog current when the back gate control voltage causes an output offset voltage to differ from a reference voltage by more than a predetermined quantity.

Abstract: A method of making a lower cost active matrix display. In a particular embodiment, the method includes providing at least one first conductor upon a substrate and depositing a gate dielectric upon the first conductor and substrate. At least one paired second conductor and a pixel electrode are deposited upon the gate dielectric, with the second conductor crossing the first conductor and with a narrow gap between the paired second conductor and the pixel electrode. A semiconductor material is deposited over the paired second conductor and pixel electrode, filling the narrow gap. The narrow gap shelters a portion of the semiconductor material, which serves as a semiconductor bridge capable of functioning either as an insulator or as a channel region of a field effect transistor. The remaining, unsheltered semiconductor material is removed.

Abstract: In various embodiments of the present invention, tunable resistors are introduced at the interconnect layer of integrated circuits in order to provide a for adjusting internal voltage and/or current levels within the integrated circuit to repair defective components or to configure the integrated circuit following manufacture. For example, when certain internal components, such as transistors, do not have specified electronic characteristics due to manufacturing defects, adjustment of the variable resistances of the tunable resistors included in the interconnect layer of integrated circuits according to embodiments of the present invention can be used to adjust internal voltage and/or levels in order to ameliorate the defective components. In other cases, the tunable resistors may be used as switches to configure integrated circuit components, including individual transistors and logic gates as well as larger, hierarchically structured functional modules and domains.

Abstract: A magnetic memory cell write current threshold detector. The magnetic memory cell write current threshold detector includes a first MRAM test cell receiving a write current and sensing when the write current exceeds a first threshold, and a second MRAM test cell receiving the write current and sensing when the write current exceeds a second threshold.

Abstract: Programming of a programmable resistive memory device includes supplying programming power to the device; generating feedback as to when the device has been programmed; and removing the programming power when the feedback indicates that the device has been programmed.

Abstract: Methods and apparatuses are disclosed for controlling the write current in magnetic memory. In some embodiments, the method includes: providing a current in a plurality of memory write lines (where the write lines may be magnetically coupled to at least one memory element), coupling a first and second plurality of transistors to either end of the memory write line, and altering the conduction state of individual transistors within the first and second plurality of transistors.