Abstract: An apparatus and a method for detecting the tilt angle of a wafer platform in a process machine, particularly in a medium density ion implanter. The apparatus and method can be used to accurately calibrate the zero-angle position of a wafer platform in the medium energy ion implanter. The apparatus includes a process chamber that has a cavity and a wafer platform therein, a window that is substantially transparent to laser energy mounted in a top wall of the chamber, and a laser emitter and receiver positioned outside the process chamber juxtaposed to the window for emitting a laser beam onto a wafer positioned on the wafer platform and receiving a reflected laser beam to determine a tilt angle of the wafer platform by the intensity of the reflected laser beam.

Abstract: It is a method of prevention of gas leakage in the vehicle wheels, if the tires was broken a by the glass, pin, etc . . . , the method could replace and recover the broken tires and reduce the gas leakage automatically The method is that the surface of tire could be designed extensionly outside to form a curved surface of wheel, and tire inside and outside could be fixed an adhensive and sticker plastic. The prevention of gas leakage is very obvious. If the tire is pined into by the iron pin of diameter of 1 mm-6 mm and the length 1 cm-10 cm, no matter whether the pin is pull out or not, the broken tire could be used as the normal continuously more than 2000 KM by the speed 120 Km/Hour without the gas leakage. This method could solve the gas leakage when then tire is pinned or broken without needing to repair immediately, it reduce a lot of repair cost and the economic benefit to the public.

Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,

Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.

Abstract: A system for generating sales reports using a mobile terminal includes a database server (101), a mobile commerce server (103) electronically linked with the database server for generating business schedules, and a plurality of mobile terminals (109) linked with the mobile commerce server for assisting execution of commercial activities in accordance with business schedules (208) downloaded from the mobile commerce server. Each mobile terminal includes a business schedule storing module (301) for storing downloaded business schedules and for assisting arrangement of business visits, and a data analyzing module (305) for processing data and generating sales reports. The mobile commerce server comprises an application processing module (106) for generating business schedules and updating data.

Abstract: A system for configuring a layout of merchandise by way of mobile commerce includes a database server (101), a mobile commerce server (103) linked with the database server for generating business schedules, and at least one mobile terminal (109) linked with the mobile commerce server for downloading business schedules from the mobile commerce server and thereby assisting execution of commercial activities. Each mobile terminal includes: a business schedule storing module (301) for storing downloaded business schedules; and a merchandise displaying module (304) for recording and adjusting layouts of merchandise and sales assistance tools at storefront premises of various sellers. A related method includes the steps of: (a) downloading merchandise layout key information and commercial activities information; (b) displaying merchandise layout key information in the form of pictures; (c) recording a layout of merchandise and sales assistance tools; and (d) illustrating a merchandise layout adjustment advice.

Abstract: A system for reviewing data in a mobile terminal (109) includes a pending event storing module (306), and a client data storing module (305). The pending event storing module connects with the client data storing module, and accesses data stored in the client data storing module. The pending event storing module includes a data sheet for storing pending events (401), a data sheet for storing commercial activities (402), a data sheet for recording data to-be-prepared (404), and a data reviewing interface (405). The data reviewing interface links with the data sheet for recording data to-be-prepared and the data sheet for storing commercial activities, and displays data stored in the data sheet for recording data to-be-prepared, the data sheet for storing commercial activities, the data sheet for storing pending events, and the client data storing module. A related method for reviewing information is also disclosed.

Abstract: A system for facilitating sales by way of mobile commerce includes a database server (101), a mobile commerce server (103) incorporating an application processing module (106), a client information system (110), and at least one mobile terminal (109). The database server stores information including client information and merchandise information. The application processing module is used to generate a business visit schedule based on data downloaded from the database server. Each mobile terminal downloads merchandise information from the database server and from the client information system. The mobile terminal includes an order processing module which is used to generate purchase orders based on merchandise data, and an executing data storing module which is used to record all information on business activities. The generated purchase orders are stored in the mobile commerce server. A related method for facilitating sales by way of mobile commerce is also disclosed.

Abstract: A system for assisting execution of commercial activities by using a mobile terminal (109) includes a client data storing module (305) for storing data on clients, a pending event storing module (306), and an executing data storing module (303). The pending event storing module includes an executing commercial activities interface (401), and a data sheet for storing pending events (404). The executing commercial activities interface connects with the client data storing module and the executing data storing module, accesses data stored in the client data storing module, sends corresponding data to the executing data storing module, and displays data stored in the data sheet for storing pending events. The executing data storing module records data on execution of commercial activities. A related method for assisting execution of commercial activities is also disclosed.

Abstract: A system for executing mobile commerce includes a database server (101), a mobile commerce server (103), and at least one mobile terminal (109). The mobile terminal downloads business schedules created by the mobile commerce server, to assist execution of commercial activities. The mobile terminal includes a business schedule storing module (301) which stores the downloaded business schedule, and an executing data storing module (303) which records data on execution of commercial activities in accordance with the business schedule. The mobile commerce server includes an application processing module (106) which creates business schedules in accordance with data stored in the database server, and which updates data stored in the database server in accordance with data sent from the mobile terminal. A related method for executing mobile commerce is also disclosed.

Abstract: An apparatus and a method for detecting the tilt angle of a wafer platform in a process machine, particularly in a medium density ion implanter. The apparatus and method can be used to accurately calibrate the zero-angle position of a wafer platform in the medium energy ion implanter. The apparatus includes a process chamber that has a cavity and a wafer platform therein, a window that is substantially transparent to laser energy mounted in a top wall of the chamber, and a laser emitter and receiver positioned outside the process chamber juxtaposed to the window for emitting a laser beam onto a wafer positioned on the wafer platform and receiving a reflected laser beam to determine a tilt angle of the wafer platform by the intensity of the reflected laser beam.

Abstract: A substrate holding mechanism which is particularly adaptable to automatically centering a semiconductor wafer on a platen spider as the wafer is lowered from a wafer loading and unloading position to a wafer processing position in a medium current implanter such as a Varian EHP500. Upon subsequent placement of a mechanical clamp on the wafer to hold the wafer on the platen, the clamp fingers of the clamp engage the edge of the wafer with substantially uniform pressure to prevent micro-cracking or fracturing of the wafer.

Abstract: A liquid crystal display includes a casing, a frame mounted in the casing, a support mounted in the frame, a motor, and a tray. The casing includes a front plate for holding a display screen and a rear cover attached to the front plate. The rear cover includes a lower casing portion having a side opening. The support mounted is slidable through the side opening so as to be located between an extended position out of the casing and a retracted position in the casing. The support includes a receiving space for receiving a backlight and a drive circuit for the backlight. The motor moves the support to the extended position or the retracted position. The tray is removably received in the receiving space of the support and includes a portion for receiving an X-ray film.

Abstract: A method of metal-electro-plating for IC package substrate comprising the steps of: forming vias on the package substrate coated with copper film on both sides thereof; electro-plating the vias to form electrical conductive holes between the top layer and the bottom layer of the package substrate; coating a resisting agent where the patterns should be formed on the top layer and on the entire bottom layer of the package substrate; etching the pattern to form circuit without plating lines on the top layer of the substrate, and removing the resisting agent; coating with a resisting agent on the top side and the bottom side of the package substrate but the wiring position to be electro-plated as surface finish for wire-bonding electro-plating on the top side of the package substrate not being applied with the resisting agent; electro-plating the substrate with nickel and gold, and removing the resisting agent; fabricating the circuit on the bottom side of the package substrate and coating with a resisting agent

Abstract: An open-typed multi-chip stack-packaging is disclosed and the packaging comprises a substrate having a first surface and a second surface, at least a through opening formed on the substrate, and including at least two layers of circuitry to electrically transmit signals; at least a first chip positioned on the upper section of the opening of the first surface and a plurality of protruded blocks being soldered onto the circuitry on the first surface of the substrate at the external region of the substrate for electrically connection; at least a second chip stacked onto the first chip and the second chip being connected electrically to the circuitry of the first surface with gold lines; at least a third chip positioned at the lower section of the opening of the second surface and having a size smaller than the first chip, and a plurality of protruded blocks being used to electrically bond with the center position of the first chip, and adhesive being used to fill the first chip and the third chip, and the regio

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract: A fabrication method of semiconductor packaging and the packaging element is disclosed. A layer of copper is formed on a thick heat-resistant tape and the surface of the copper layer is coated with a light sensitive photoresist. A light source passes through a pre-fabricated circuit negative being performed on the copper layer such that the photoresist is retained on the surface of the copper layer. An etching step is performed so as to obtain a copper wire with circuit diagram. After that, a wire bonding or a flip chip method is used to bind copper wire circuit with the chip. An appropriate packaging method is performed, a packaging element is obtained after the heat-resistant tape is removed.

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical passage which is conical in shape and has a larger diameter at a bottom such that a lower portion of the vertical passage is larger than an upper portion of the vertical passage, whereby a metal wire is inserted into the vertical passage of the hard conical tubular member, with a lower end of the metal wire protruded downwardly out of the vertical passage, the lower end of the metal wire is melted to form a ball, the hard conical tubular member is approached to a raised platform formed on a top of a chip, and a load is applied to the metal wire and the metal wire is heated and bonded on the pad of die and ultrasonic energy is applied to deform the melted metal so as to fill up the lower portion of the vertical passage thereby forming a metal bump on the raised platform of the chip, and finally the hard conical tubular member is removed to pull off the necking position between the metal wire and a top of the metal bump the

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.