Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Abstract: A needle holder positioning structure for a safety syringe includes a syringe with a neck portion having a top end forming a positioning projecting ring, an inner edge of a lower end of the neck portion upwardly and integrally formed with a forked elastic sleeve, with a terminus inwardly forming hook members, a bottom end of a needle holder for receiving a needle being inwardly provided with a flared hole having a distal end forming an enlarged opening, the bottom end of the needle holder being outwardly provided with a guide face, and an outer side formed with depressions corresponding to the hook members.

Abstract: A needle holder positioning structure for a safety syringe includes a syringe with a neck portion having a top end forming a positioning projecting ring, an inner edge of a lower end of the neck portion upwardly and integrally formed with a forked elastic sleeve, with a rear end inwardly forming hook members, a bottom end of a needle holder for receiving a needle being inwardly provided with a flared hole having a rear end forming an enlarged opening, the bottom end of the needle holder being outwardly provided with a guide face, and an outer side formed with depressions corresponding to the hook members.

Abstract: The present invention relates to a manufacturing method for multilayer high density substrate. The circuit layout of the first layer substrate of the multilayer board requires a high demand of pitch density, and therefore polyimide layer is used to make into polyimide substrate (or other high density polymeric film substrate), and combines with the non-high density multilayer board formed from second layer board (or more layer boards) made of organic substrate. In making the organic multilayer board, the adjacent surface of the first layer polyimide substrate (or high density polymeric film substrate), corresponding to appropriate solder pad position of the first layer polyimide substrate (or high density polymeric film substrate), is formed with a solder bump. Thus, when the individual layer board and the first layer substrate are combined, direct heating and compression are applied, such that the bump and the solder pad are bound and electrically connected.

Abstract: A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.

Abstract: A wire bonding technique applied to wafer bump and wafer level chip size package structure and the method of manufacturing thereof comprising under no repassivation layer and without an under bump metallurgy layer, direct forming metal bump on a metal pad of a wafer surface, ball bump, method being employed to form metal bump, and wire bonding of ultrasonic vibration being used to join a suitable metal wire on the metal pad, next pulling off the metal wire and leaving the metal bump, the height of the metal bump is controlled by the parameters of the type, diameter and wire bonding of the metal wire; planarizing the metal bump of all wire bonding to an appropriate height using metallurgical tools; implanting solder bump by means of implant ball or solder printing technology on the metal bump, and an under bump metallurgy layer being formed on the top face of the metal block by means of metal deposition method in case an unfavorable intermetallic compound is formed between the metal (used for the metal bump) a

Abstract: A baby stroller having a switchable handle, a tray accessory, and an attachment device for attaching the tray accessory to the handle.

Abstract: A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

Abstract: A mobile security system, which includes a warning signal transmitter unit installed in the place or equipment to be protected, an auto dialing unit having a signal receiver, and a cellular phone coupled to the auto dialing unit, wherein when the warning signal transmitter unit detects an abnormal condition, it immediately sends a warning signal to the signal receiver by radio, and the signal receiver immediately drives the auto dialing unit to dial a particular telephone number upon receipt of the warning signal, so as to inform a particular person or security center to take the necessary step. The auto dialing unit can be a mechanical design, or an electronic design as desired.

Abstract: A mobile security system, which includes a warning signal transmitter unit installed in the place or equipment to be protected, an auto dialing unit having a signal receiver, and a cellular phone coupled to the auto dialing unit, wherein when the warning signal transmitter unit detects an abnormal condition, it immediately sends a warning signal to the signal receiver by radio, and the signal receiver immediately drives the auto dialing unit to dial a particular telephone number upon receipt of the warning signal, so as to inform a particular person or security center to take the necessary step. The auto dialing unit can be a mechanical design, or an electronic design as desired.

Abstract: A mobile security system, which includes a warning signal transmitter unit installed in the place or equipment to be protected, an auto dialing unit having a signal receiver, and a cellular phone coupled to the auto dialing unit, wherein when the warning signal transmitter unit detects an abnormal condition, it immediately sends a warning signal to the signal receiver by radio, and the signal receiver immediately drives the auto dialing unit to dial a particular telephone number upon receipt of the warning signal, so as to inform a particular person or security center to take the necessary step. The auto dialing unit can be a mechanical design, or an electronic design as desired.

Abstract: A process of manufacturing thin ball array substrates includes the steps of: using a layer of polyimide film as a carrier, electroplating a thin copper layer on the polyimide film, electroplating a thick copper layer on the thin copper layer, applying photosensitive coating layers on both sides of the carrier, mounting two masks with optically transmissible circuit tracks on two sides of the carrier and then processing the carrier with exposure treatment, processing the carrier with development treatment so as to remove the photosensitive coating layers aligned with the circuit track thereby forming recessed circuit tracks on the photosensitive coating layers, electroplating a copper layer on a top of the carrier thereby forming an additional copper layer on the thick copper layer, etching a bottom of the carrier to remove the upper recessed circuit track thereon, coating the copper layer on the upper recessed circuit track with soldering metallic material so as to make a top of the soldering metallic materia

Abstract: The present invention provides a wafer tweezer assembling device by utilizing a chuck member and a plurality of tweezer blades separated by spacers having a predetermined thickness such that the mounting and the calibration of the tweezer can be accomplished in one operation without the need of further calibration steps after the assembling process.

Abstract: A terminal structure for memory card connectors includes a front positioning element; a rear positioning element oriented in the same direction as the front positioning element and connected to the front positioning element by means of two clamp pieces disposed therebetween; a retain element extending backwardly from the rear positioning element and having a U-shaped section; and a curved tail portion extending backwardly from the retain element. The upper and lower clamp pieces joining the front and rear positioning element have an upper contact portion and a lower contact portion respectively, the upper and lower contact portions curving inwardly towards each other and having respective inwardly curved, positioning slots such that an insert pin of a card mounting slot inserted into the terminal may have its upper and lower surfaces projecting from the positioning slots to expose on the contact portions respectively. The terminal has good resilience and firm clamping and positioning effects.

Abstract: A pre-washing device for water circulating tubes of a massaging bath tub includes a cap member for a water circulating tube head, a rotary adjustment block locked with the cap member and formed with opposing wedge-shaped openings, and an inner seat located at the water circulating tube head and having channels for the adjustment block to rotate to two stages. A partitioning plate is disposed in the inner seat and includes wedge-shaped openings corresponding to those of the adjustment block. The adjustment block rotates relative to the inner seat so as to align or offset to control the flow of water from the bath tub into the cap member. A valve body and an independent tube are disposed in the water circulating tube head. The valve body is controlled in cooperation with the opening and closing of the water circulating tube head. That is, when the water circulating tube is closed, the valve body is opened, permitting the water to flow from the independent tube into the water circulating tube for pre-washing.

Abstract: A stage structure disposed to a vehicle which includes a head portion and the stage structure has a base connecting to the head portion, two first posts and two second posts respectively disposed to four corners of the base and a top cover mounted to the four posts wherein one side of the top cover is pivotally connected to two of the posts in a longitudinal direction of the base, a lower supporting board connected between each pair of two posts for a first cylinder disposed thereon which connects to a mediate part so as to lift the other side of the top cover, a first frame and a second frame respectively and retractably disposed below an under surface of the top cover, each of the first frame and the second frame respectively connected to a second cylinder and a third cylinder on the top cover, a third frame pivotally connected to the second frame, an extending base respectively pivotally connected to each one of two sides of the base such that a stage can be formed by extending these frames and extending b

Abstract: An IC card assembly includes an upper housing, a circuit board, a pair of mounting frames, a lower housing and a ground element. The upper housing has both sides extending inwardly to form retain portions; the mounting frames are injection molded integrally with the lower housing; the lower housing has upwardly extending side walls at both lateral sides for closing the mounting frames, and either side wall is provided with a groove for receiving the retain portion of the upper housing. The upper housing and the lower housing may be easily and speedily coupled together without any need for welding or rivets. Besides, the surfaces of the IC card is even and uniform and will not scratch the IC card mounting slot or the user's hand.

Abstract: A contact terminal having two locating portions at two opposite ends for receiving a contact pin, a curved mounting tail longitudinally backwardly extended from one locating portion for fastening to the memory card, an upper connecting portion and a lower connecting portion connected between the locating portions at different elevations, the upper connecting portion and the lower connecting portion having a respective contact portion curved inwards in the middle toward each other for holding down the contact pin, and a longitudinal clamping strip suspended from one locating portion, the longitudinal clamping strip having one end extended from one locating portion toward the other locating portion, an opposite end suspending between the upper connecting portion and the lower connecting portion, and a contact portion curved inwards in the middle toward the contact portions of the upper connecting portion and the lower connecting portion for contact with the contact pin.

Abstract: A CPU card mounting structure including an electrical connector installed in a mother board and having a card slot, a substantially U-shaped mounting frame mounted on the electrical connector, the U-shaped mounting frame having a horizontal section defining a connector slot, which receives the electrical connector, and two vertical sections raised from two opposite ends of the horizontal section at right angles, each vertical section having a longitudinal sliding groove and a top screw hole, a CPU card inserted through the longitudinal sliding grooves of the vertical sections of the said U-shaped mounting frame into the card slot of the electrical connector to be electrically connected to the mother board, and two holding down devices respectively fastened to the top screw holes of the vertical sections of the U-shaped mounting frame to hold down the CPU card in the card slot of the electrical connector.

Abstract: A novel copolymer of an unsaturated acidic reactant and an atactic vinyl terminated propene polymer (VTPP) and its use in preparation of fuel and lubricant additives is taught. The VTPP has a major amount of polymer chains containing terminal vinyl unsaturation, a number average molecular weight of at least 500, and comprises at least 70 weight per cent propene and 0 to 30 weight per cent of at least one olefin selected from the group consisting of C.sub.2 and C.sub.4 to C.sub.10 olefins. The unsaturated acidic reactant comprises at least one unsaturated C.sub.4 to C.sub.10 carboxylic or dicarboxylic acid or anhydride. An oil soluble dispersant additive of the invention useful in oleaginous compositions is prepared by contacting the atactic VTPP copolymer with at least one nucleophilic reagent selected from the group consisting of amines, alcohols, metal reactants and mixtures thereof under conditions effective to form adducts of the nucleophilic reagent with the copolymer.